JPS5943570A - 薄膜配線 - Google Patents
薄膜配線Info
- Publication number
- JPS5943570A JPS5943570A JP57153896A JP15389682A JPS5943570A JP S5943570 A JPS5943570 A JP S5943570A JP 57153896 A JP57153896 A JP 57153896A JP 15389682 A JP15389682 A JP 15389682A JP S5943570 A JPS5943570 A JP S5943570A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- alloy
- chromium
- zirconium
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57153896A JPS5943570A (ja) | 1982-09-06 | 1982-09-06 | 薄膜配線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57153896A JPS5943570A (ja) | 1982-09-06 | 1982-09-06 | 薄膜配線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5943570A true JPS5943570A (ja) | 1984-03-10 |
| JPH0425715B2 JPH0425715B2 (OSRAM) | 1992-05-01 |
Family
ID=15572474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57153896A Granted JPS5943570A (ja) | 1982-09-06 | 1982-09-06 | 薄膜配線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5943570A (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01248538A (ja) * | 1988-03-30 | 1989-10-04 | Hitachi Ltd | 半導体装置 |
| JPH0262035A (ja) * | 1988-08-29 | 1990-03-01 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
| US5243222A (en) * | 1991-04-05 | 1993-09-07 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
| US7755192B2 (en) | 2008-03-25 | 2010-07-13 | Tohoku University | Copper interconnection structure, barrier layer including carbon and hydrogen |
-
1982
- 1982-09-06 JP JP57153896A patent/JPS5943570A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01248538A (ja) * | 1988-03-30 | 1989-10-04 | Hitachi Ltd | 半導体装置 |
| JPH0262035A (ja) * | 1988-08-29 | 1990-03-01 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
| US5243222A (en) * | 1991-04-05 | 1993-09-07 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
| US7755192B2 (en) | 2008-03-25 | 2010-07-13 | Tohoku University | Copper interconnection structure, barrier layer including carbon and hydrogen |
| US8163649B2 (en) | 2008-03-25 | 2012-04-24 | Advanced Interconnect Materials, Llc | Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0425715B2 (OSRAM) | 1992-05-01 |
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