JPS5939931U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS5939931U
JPS5939931U JP1982135552U JP13555282U JPS5939931U JP S5939931 U JPS5939931 U JP S5939931U JP 1982135552 U JP1982135552 U JP 1982135552U JP 13555282 U JP13555282 U JP 13555282U JP S5939931 U JPS5939931 U JP S5939931U
Authority
JP
Japan
Prior art keywords
capillary
circuit
speed
speed command
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982135552U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0124931Y2 (enExample
Inventor
治 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982135552U priority Critical patent/JPS5939931U/ja
Publication of JPS5939931U publication Critical patent/JPS5939931U/ja
Application granted granted Critical
Publication of JPH0124931Y2 publication Critical patent/JPH0124931Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1982135552U 1982-09-07 1982-09-07 ワイヤボンデイング装置 Granted JPS5939931U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982135552U JPS5939931U (ja) 1982-09-07 1982-09-07 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982135552U JPS5939931U (ja) 1982-09-07 1982-09-07 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5939931U true JPS5939931U (ja) 1984-03-14
JPH0124931Y2 JPH0124931Y2 (enExample) 1989-07-27

Family

ID=30305066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982135552U Granted JPS5939931U (ja) 1982-09-07 1982-09-07 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5939931U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252938A (ja) * 1985-09-02 1987-03-07 Hitachi Tokyo Electron Co Ltd ワイヤボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252938A (ja) * 1985-09-02 1987-03-07 Hitachi Tokyo Electron Co Ltd ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0124931Y2 (enExample) 1989-07-27

Similar Documents

Publication Publication Date Title
JPS5939931U (ja) ワイヤボンデイング装置
JPS6030011U (ja) センサ位置制御装置
JPS6230340U (enExample)
JPS59145033U (ja) ワイヤボンデイング装置
JPH0618222B2 (ja) ワイヤボンディング装置
JPS5965533U (ja) 半導体測定装置
JPS59148185U (ja) 電気抵抗溶接機
JPS6072739U (ja) パワ−シ−ト装置
JPS58174989U (ja) ゲ−ト制御装置
JPS59152413U (ja) サ−ボ記録装置
JPS594635U (ja) ボンデイング装置
JPS6255942A (ja) ボンデイング方法
JPS60125734U (ja) ポンデイング装置
JPS58105138U (ja) 半導体装置用自動ボンデイング装置
JPS5830783U (ja) 電磁ポンプの駆動装置
JPS5817635U (ja) 磁気記録再生装置
JPS59135638U (ja) ワイヤボンデイング装置
JPS5842090U (ja) 自動製図機用制御装置
JPS6043012B2 (ja) 半導体組立装置
JPS5812945U (ja) ワイヤボンデイング装置
JPS5717140A (en) Wire bonding device
JPS58133732U (ja) 空気調和機の制御装置
JPH02278846A (ja) ワイヤーボンディング方法
JPS6051625U (ja) ビデオテ−プレコ−ダ−の録画監視・制御装置
JPS587216U (ja) 録音回路