JPS593944A - ウエハ−搬送装置 - Google Patents

ウエハ−搬送装置

Info

Publication number
JPS593944A
JPS593944A JP11063782A JP11063782A JPS593944A JP S593944 A JPS593944 A JP S593944A JP 11063782 A JP11063782 A JP 11063782A JP 11063782 A JP11063782 A JP 11063782A JP S593944 A JPS593944 A JP S593944A
Authority
JP
Japan
Prior art keywords
wafer
guide
transport
unino
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11063782A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0330299B2 (enrdf_load_stackoverflow
Inventor
Akira Kobayashi
彰 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11063782A priority Critical patent/JPS593944A/ja
Publication of JPS593944A publication Critical patent/JPS593944A/ja
Publication of JPH0330299B2 publication Critical patent/JPH0330299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP11063782A 1982-06-29 1982-06-29 ウエハ−搬送装置 Granted JPS593944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11063782A JPS593944A (ja) 1982-06-29 1982-06-29 ウエハ−搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11063782A JPS593944A (ja) 1982-06-29 1982-06-29 ウエハ−搬送装置

Publications (2)

Publication Number Publication Date
JPS593944A true JPS593944A (ja) 1984-01-10
JPH0330299B2 JPH0330299B2 (enrdf_load_stackoverflow) 1991-04-26

Family

ID=14540771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11063782A Granted JPS593944A (ja) 1982-06-29 1982-06-29 ウエハ−搬送装置

Country Status (1)

Country Link
JP (1) JPS593944A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60264338A (ja) * 1984-06-11 1985-12-27 Furukawa Electric Co Ltd:The 光フアイバ母材の製造方法
JPH0588039A (ja) * 1991-09-30 1993-04-09 Fujikura Ltd 光フアイバおよびその製造方法
US5370709A (en) * 1990-07-18 1994-12-06 Kabushiki Kaisha Toshiba Semiconductor wafer processing apparatus having a Bernoulli chuck

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60264338A (ja) * 1984-06-11 1985-12-27 Furukawa Electric Co Ltd:The 光フアイバ母材の製造方法
US5370709A (en) * 1990-07-18 1994-12-06 Kabushiki Kaisha Toshiba Semiconductor wafer processing apparatus having a Bernoulli chuck
JPH0588039A (ja) * 1991-09-30 1993-04-09 Fujikura Ltd 光フアイバおよびその製造方法

Also Published As

Publication number Publication date
JPH0330299B2 (enrdf_load_stackoverflow) 1991-04-26

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