JPS5937741U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5937741U
JPS5937741U JP13332482U JP13332482U JPS5937741U JP S5937741 U JPS5937741 U JP S5937741U JP 13332482 U JP13332482 U JP 13332482U JP 13332482 U JP13332482 U JP 13332482U JP S5937741 U JPS5937741 U JP S5937741U
Authority
JP
Japan
Prior art keywords
steps
circuit element
semiconductor equipment
element chips
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13332482U
Other languages
Japanese (ja)
Inventor
滝島 昭二
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP13332482U priority Critical patent/JPS5937741U/en
Publication of JPS5937741U publication Critical patent/JPS5937741U/en
Pending legal-status Critical Current

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例を示す断面図、第2図および第3図は本
考案実施例を示す断面図および斜視図である。    
 ・ lA、  lB・・・回路素子チップ、5A、  5B
・・・段差、5、A、  5B・・・絶縁膜、7・・・
絶縁樹脂、10・・・相互配線。
FIG. 1 is a sectional view showing a conventional example, and FIGS. 2 and 3 are a sectional view and a perspective view showing an embodiment of the present invention.
・ 1A, 1B...Circuit element chip, 5A, 5B
...Step, 5, A, 5B... Insulating film, 7...
Insulating resin, 10... Mutual wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の回路素子チップの端部に段差を設けると共にこの
段差表面を絶縁膜で覆い、上記段差表面を含む回路素子
チップ間を絶縁樹脂で満たしこの絶縁樹脂表面に回路素
子チップ間を接続する相互配線を設けたことを特徴とす
る半導体装置。
Steps are provided at the ends of a plurality of circuit element chips, the surfaces of the steps are covered with an insulating film, the spaces between the circuit element chips including the surfaces of the steps are filled with an insulating resin, and the interconnections connect the circuit element chips to the surfaces of the insulating resin. A semiconductor device characterized by being provided with.
JP13332482U 1982-09-01 1982-09-01 semiconductor equipment Pending JPS5937741U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13332482U JPS5937741U (en) 1982-09-01 1982-09-01 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13332482U JPS5937741U (en) 1982-09-01 1982-09-01 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5937741U true JPS5937741U (en) 1984-03-09

Family

ID=30300789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13332482U Pending JPS5937741U (en) 1982-09-01 1982-09-01 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5937741U (en)

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