JPS5936949A - マルチチツプパツケ−ジ - Google Patents

マルチチツプパツケ−ジ

Info

Publication number
JPS5936949A
JPS5936949A JP57147212A JP14721282A JPS5936949A JP S5936949 A JPS5936949 A JP S5936949A JP 57147212 A JP57147212 A JP 57147212A JP 14721282 A JP14721282 A JP 14721282A JP S5936949 A JPS5936949 A JP S5936949A
Authority
JP
Japan
Prior art keywords
chip
chip carrier
carrier
multilayer wiring
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57147212A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0126544B2 (enExample
Inventor
Toshihiko Watari
渡里 俊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57147212A priority Critical patent/JPS5936949A/ja
Publication of JPS5936949A publication Critical patent/JPS5936949A/ja
Publication of JPH0126544B2 publication Critical patent/JPH0126544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57147212A 1982-08-25 1982-08-25 マルチチツプパツケ−ジ Granted JPS5936949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57147212A JPS5936949A (ja) 1982-08-25 1982-08-25 マルチチツプパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57147212A JPS5936949A (ja) 1982-08-25 1982-08-25 マルチチツプパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5936949A true JPS5936949A (ja) 1984-02-29
JPH0126544B2 JPH0126544B2 (enExample) 1989-05-24

Family

ID=15425100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57147212A Granted JPS5936949A (ja) 1982-08-25 1982-08-25 マルチチツプパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5936949A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2065933A3 (en) * 2007-11-21 2010-02-17 Kabushiki Kaisha Toyoda Jidoshokki Heat dissipation apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5248364U (enExample) * 1975-10-02 1977-04-06
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5248364U (enExample) * 1975-10-02 1977-04-06
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2065933A3 (en) * 2007-11-21 2010-02-17 Kabushiki Kaisha Toyoda Jidoshokki Heat dissipation apparatus

Also Published As

Publication number Publication date
JPH0126544B2 (enExample) 1989-05-24

Similar Documents

Publication Publication Date Title
US5471366A (en) Multi-chip module having an improved heat dissipation efficiency
JP3815239B2 (ja) 半導体素子の実装構造及びプリント配線基板
US7250675B2 (en) Method and apparatus for forming stacked die and substrate structures for increased packing density
JP3762844B2 (ja) 対向マルチチップ用パッケージ
US7224062B2 (en) Chip package with embedded panel-shaped component
JP2910670B2 (ja) 半導体実装構造
KR970000218B1 (ko) 반도체 패키지
US4698662A (en) Multichip thin film module
JPH0758276A (ja) マルチチップ・モジュール
JP2901835B2 (ja) 半導体装置
JPH01253942A (ja) 半導体パッケージ及びそれを用いたコンピュータ
CN108990362B (zh) 一种散热结构
TW201631722A (zh) 功率轉換電路的封裝模組及其製造方法
CN116314065A (zh) 包括散热器的半导体封装结构及其制造方法
CN100550360C (zh) 具有底部散热的设备和系统及其制造方法
JPS5987893A (ja) 配線基板とその製造方法およびそれを用いた半導体装置
CN106298724A (zh) 塑封型功率模块
JP2021119630A (ja) チップパッケージ構造及び電子機器
CN100417312C (zh) 具有改善散热结构的印刷电路板及电子装置
JPS5936949A (ja) マルチチツプパツケ−ジ
KR100220249B1 (ko) 열방출 능력이 향상된 박막 볼 그리드 어레이 패키지
CN116454038A (zh) 封装方法及封装结构
CN223680107U (zh) 一种功率器件
US20250201666A1 (en) Power Module For An Electronic Computing Device
US20240112983A1 (en) Semiconductor device and manufacturing method thereof