JPS5936917Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5936917Y2
JPS5936917Y2 JP10225678U JP10225678U JPS5936917Y2 JP S5936917 Y2 JPS5936917 Y2 JP S5936917Y2 JP 10225678 U JP10225678 U JP 10225678U JP 10225678 U JP10225678 U JP 10225678U JP S5936917 Y2 JPS5936917 Y2 JP S5936917Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
heat sink
solder member
resin material
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10225678U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5520252U (enExample
Inventor
康平 森
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP10225678U priority Critical patent/JPS5936917Y2/ja
Publication of JPS5520252U publication Critical patent/JPS5520252U/ja
Application granted granted Critical
Publication of JPS5936917Y2 publication Critical patent/JPS5936917Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP10225678U 1978-07-24 1978-07-24 半導体装置 Expired JPS5936917Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10225678U JPS5936917Y2 (ja) 1978-07-24 1978-07-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10225678U JPS5936917Y2 (ja) 1978-07-24 1978-07-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS5520252U JPS5520252U (enExample) 1980-02-08
JPS5936917Y2 true JPS5936917Y2 (ja) 1984-10-12

Family

ID=29041665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10225678U Expired JPS5936917Y2 (ja) 1978-07-24 1978-07-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS5936917Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752062Y2 (ja) * 1989-02-08 1995-11-29 株式会社吉野工業所 押出容器

Also Published As

Publication number Publication date
JPS5520252U (enExample) 1980-02-08

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