JPS5936275U - Three-dimensional wiring using thick film printing - Google Patents

Three-dimensional wiring using thick film printing

Info

Publication number
JPS5936275U
JPS5936275U JP9487183U JP9487183U JPS5936275U JP S5936275 U JPS5936275 U JP S5936275U JP 9487183 U JP9487183 U JP 9487183U JP 9487183 U JP9487183 U JP 9487183U JP S5936275 U JPS5936275 U JP S5936275U
Authority
JP
Japan
Prior art keywords
thick film
dimensional wiring
film printing
wiring body
upper conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9487183U
Other languages
Japanese (ja)
Other versions
JPH02915Y2 (en
Inventor
東夫 反町
寺島　稔
清 佐藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9487183U priority Critical patent/JPS5936275U/en
Publication of JPS5936275U publication Critical patent/JPS5936275U/en
Application granted granted Critical
Publication of JPH02915Y2 publication Critical patent/JPH02915Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

本図は本考案の厚膜印刷を用いた立体配線体の構成を示
す断面図。 図において、Ｓ・・・・・・基板、Ａ・・・・・・下部
導体、Ｂ・・・・・・絶縁層、Ｃ・・・・・・上部導体
、Ｄ・・・・・・低抵抗層。This figure is a sectional view showing the configuration of a three-dimensional wiring body using thick film printing of the present invention. In the figure, S...Substrate, A...Lower conductor, B...Insulating layer, C...Top conductor, D...Low resistance layer.

Claims (1)

【実用新案登録請求の範囲】 １　基板Ｓ上に下部導体Ａが形成され、その上に絶縁層
Ｂが形成され、更にその上に上部導体Ｃが形成された立
体配線体において、前記上部導体Ｃを低温焼成可能な厚
膜印刷体にて形成し、前記上部導体Ｃの上に更に低抵抗
層りを設けたことを特徴とする厚膜印刷を用いた立体配
線体。 ２　前記低抵抗層りがメッキによって形成されているこ
とを特徴とした実用新案登録請求の範囲第１項記載の厚
膜印刷を用いた立体配線体。 ３　前記低抵抗層りが半田ディツプによって形成されて
いることを特徴とした実用新案登録請求の範囲第１項記
載の厚膜印刷を用いた立体配線体。[Claims for Utility Model Registration] 1. In a three-dimensional wiring body in which a lower conductor A is formed on a substrate S, an insulating layer B is formed thereon, and an upper conductor C is further formed thereon, the upper conductor C A three-dimensional wiring body using thick film printing, characterized in that the upper conductor C is formed of a thick film printed body that can be fired at a low temperature, and a low resistance layer is further provided on the upper conductor C. 2. A three-dimensional wiring body using thick film printing according to claim 1, wherein the low resistance layer is formed by plating. 3. The three-dimensional wiring body using thick film printing according to claim 1, wherein the low resistance layer is formed by solder dip.
JP9487183U 1983-06-22 1983-06-22 Three-dimensional wiring using thick film printing Granted JPS5936275U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9487183U JPS5936275U (en) 1983-06-22 1983-06-22 Three-dimensional wiring using thick film printing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9487183U JPS5936275U (en) 1983-06-22 1983-06-22 Three-dimensional wiring using thick film printing

Publications (2)

Publication Number Publication Date
JPS5936275U true JPS5936275U (en) 1984-03-07
JPH02915Y2 JPH02915Y2 (en) 1990-01-10

Family

ID=30226858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9487183U Granted JPS5936275U (en) 1983-06-22 1983-06-22 Three-dimensional wiring using thick film printing

Country Status (1)

Country Link
JP (1) JPS5936275U (en)

Also Published As

Publication number Publication date
JPH02915Y2 (en) 1990-01-10

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