JPS5825060U - Enamel board for printed circuit board - Google Patents

Enamel board for printed circuit board

Info

Publication number
JPS5825060U
JPS5825060U JP11909981U JP11909981U JPS5825060U JP S5825060 U JPS5825060 U JP S5825060U JP 11909981 U JP11909981 U JP 11909981U JP 11909981 U JP11909981 U JP 11909981U JP S5825060 U JPS5825060 U JP S5825060U
Authority
JP
Japan
Prior art keywords
board
enamel
printed circuit
circuit board
enameled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11909981U
Other languages
Japanese (ja)
Inventor
直道 鈴木
二見 菊男
Original Assignee
株式会社フジクラ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社フジクラ filed Critical 株式会社フジクラ
Priority to JP11909981U priority Critical patent/JPS5825060U/en
Publication of JPS5825060U publication Critical patent/JPS5825060U/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面はプリント配線を施した状態のこの考案に係るプリ
ント回路板用はうろう基板の一実施例を示す一部欠截斜
視図である。 1・・・・・・金属素地材、2,3・・・・・・はうろ
うエナメル。
The drawing is a partially cutaway perspective view showing an embodiment of the printed circuit board according to the present invention with printed wiring applied thereto. 1... Metal base material, 2, 3... Warou enamel.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属素地材1上に2層以上のほうろう掛けが施されてな
るほうろう基板において、少なくとも最外層のほうろう
エナ゛メル3を結晶化はうろうによって構成したことを
特徴とするプリント回路板用はうろう基板。
An enameled board comprising two or more layers of enameling applied to a metal base material 1, characterized in that at least the outermost layer of enameled enamel 3 is composed of crystallized enameled wax. wax substrate.
JP11909981U 1981-08-11 1981-08-11 Enamel board for printed circuit board Pending JPS5825060U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11909981U JPS5825060U (en) 1981-08-11 1981-08-11 Enamel board for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11909981U JPS5825060U (en) 1981-08-11 1981-08-11 Enamel board for printed circuit board

Publications (1)

Publication Number Publication Date
JPS5825060U true JPS5825060U (en) 1983-02-17

Family

ID=29913181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11909981U Pending JPS5825060U (en) 1981-08-11 1981-08-11 Enamel board for printed circuit board

Country Status (1)

Country Link
JP (1) JPS5825060U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS569666B2 (en) * 1972-09-26 1981-03-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS569666B2 (en) * 1972-09-26 1981-03-03

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