JPS5935956Y2 - Connection terminal with ceramic board - Google Patents
Connection terminal with ceramic boardInfo
- Publication number
- JPS5935956Y2 JPS5935956Y2 JP1980002564U JP256480U JPS5935956Y2 JP S5935956 Y2 JPS5935956 Y2 JP S5935956Y2 JP 1980002564 U JP1980002564 U JP 1980002564U JP 256480 U JP256480 U JP 256480U JP S5935956 Y2 JPS5935956 Y2 JP S5935956Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- terminals
- blade
- terminal
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【考案の詳細な説明】
この考案は、電子部品を実装したセラミック基板を外部
に電気的に接続するために設けられたコネクタ内に配置
され、セラミック基板に接続されるセラミック基板用接
続ターミナルに関するものである。[Detailed description of the invention] This invention relates to a connection terminal for a ceramic substrate that is placed in a connector provided for electrically connecting a ceramic substrate mounted with electronic components to the outside and connected to the ceramic substrate. It is.
従来この種の装置として第１図、第２図に示すものがあ
った。Conventionally, there have been devices of this type as shown in FIGS. 1 and 2.
図において、１，２はターミナルで、ｌａ、２ａは刃部
、ｌｂ、２ｂは接続部であり、夫々同一厚さで形成され
ている。In the figure, 1 and 2 are terminals, la and 2a are blade parts, and lb and 2b are connection parts, each of which is formed with the same thickness.
図中７はターミナル１，２がインサートされたコネクタ
、８１〜８３はセラミック基板９に設けられた穴に挿入
され、リードを半田１０にて半田付けされた電子部品、
１１は前記セラミック基板９の穴９ａに挿入されて半田
付けされたターミナル５６の接合部である。In the figure, 7 is a connector into which terminals 1 and 2 are inserted, 81 to 83 are electronic components inserted into holes provided in a ceramic substrate 9, and the leads are soldered with solder 10.
Reference numeral 11 denotes a joint portion of a terminal 56 inserted into the hole 9a of the ceramic substrate 9 and soldered.
上記のように構成されたものにおいて、従来、ターミナ
ル１，２はコネクタ７にインサートされ、接続部１ｂ、
２ｂがセラミック基板９の穴９ａに半田付けされて実装
されていたが、この従来のものは、ターミナル１，２の
接続部１ｂ、２ｂの厚さは、刃部１ａ、２ａと同一厚さ
で形成されているため、充分な弾性を保有しておらず、
セラミック基板９のセラミック部とターミナル１，２の
接続部１ｂ、２ｂの熱膨張係数の相違によるストレスが
接続部１ｂ、２ｂに生じた場合、接続部１ｂ。In the device configured as described above, conventionally, the terminals 1 and 2 are inserted into the connector 7, and the connecting portion 1b,
2b is mounted by soldering into the hole 9a of the ceramic substrate 9. However, in this conventional device, the thickness of the connecting portions 1b and 2b of the terminals 1 and 2 is the same as that of the blade portions 1a and 2a. Because it is formed, it does not have sufficient elasticity,
When stress occurs in the connecting portions 1b, 2b due to the difference in thermal expansion coefficient between the ceramic portion of the ceramic substrate 9 and the connecting portions 1b, 2b of the terminals 1, 2, the connecting portion 1b.
２ｂは何ら緩衝する作用をなさないので、半田１゜が剥
離する欠点を有していた。Since 2b does not have any buffering effect, it has the disadvantage that the solder 1° peels off.
なお、この対策としてターミナル１，２の接続部１ｂ、
２ｂを廃止してターミナル１，２の刃部ｌａ、２ａに細
いリード線を接続することも考えられるが、刃部１ａ、
２ａとリード線との半田付は作業工程が追加されること
になり、作業工程が増加すると共に作業性も劣り等、不
都合な点を有していた。In addition, as a countermeasure for this, the connection part 1b of terminals 1 and 2,
It is also possible to eliminate 2b and connect thin lead wires to the blade parts la and 2a of terminals 1 and 2, but the blade parts 1a,
Soldering 2a and the lead wire requires an additional work process, which has disadvantages such as an increase in the work process and poor workability.
この考案は上記のような従来のものの欠点を除去するた
めになされたもので、安価で且つ品質が向上するセラミ
ック基板との接続ターミナルを提供するものである。This invention was made in order to eliminate the above-mentioned drawbacks of the conventional devices, and provides a connection terminal with a ceramic substrate that is inexpensive and of improved quality.
以下この考案の一実施例を第３図ないし第４図に従って
説明する。An embodiment of this invention will be described below with reference to FIGS. 3 and 4.
図において、５，６はターミナルであり、従来のターミ
ナル１，２の板厚の％の板厚の材料を折り重ねて二重状
の刃部５ａ。In the figure, reference numerals 5 and 6 indicate terminals, which have a double-shaped blade portion 5a made by folding a material having a thickness that is % of the thickness of the conventional terminals 1 and 2.
６ａ形戊して、この刃部５ａ、６ａの部分は従来ターミ
ナル１，２の刃部１ａ、２ａと同じ厚さとし、接続部５
ｂ、６ｂを刃部５ａ、６ａの％の厚さに形成している。6a shape, the blade parts 5a and 6a have the same thickness as the blade parts 1a and 2a of the conventional terminals 1 and 2, and the connecting part 5
b, 6b are formed to have a thickness of % of that of the blade portions 5a, 6a.
その他の符号の説明は従来装置と同様につき省略する。Descriptions of other symbols are omitted as they are the same as in the conventional device.
」―記のように構成されたものにおいては、コネフタ７
のターミナル５，６の刃部５ａ、６ａが、従来のターミ
ナル１，２の刃部１ａ、２ａと同等の厚さで形成されて
いるので、ターミナル５，６は相手のコネクタと品質上
問題なく充分に接合でき、互換性を有している。” - In the case configured as described above, the connector 7
The blade parts 5a and 6a of the terminals 5 and 6 are formed to have the same thickness as the blade parts 1a and 2a of the conventional terminals 1 and 2, so the terminals 5 and 6 have no quality problems with the mating connectors. Can be fully bonded and is compatible.
ターミナル５，６の接続部５ｂ、６ｂは、セラミック基
板９の穴９ａに挿入され、半田１０で固定される。Connecting portions 5b and 6b of terminals 5 and 6 are inserted into holes 9a of ceramic substrate 9 and fixed with solder 10.
ここで、ターミナル５，６とセラミック基板９との温度
変化が生じると、ターミナル５，６の接続部５ｂ、６ｂ
と、セラミック基板９のセラミックとの間の熱膨張係数
の相違により、これらの間にストレスが生じることにな
るが、接続部５ｂ、６ｂの板厚が刃部５ａ。Here, if a temperature change occurs between the terminals 5, 6 and the ceramic substrate 9, the connecting portions 5b, 6b of the terminals 5, 6
Due to the difference in coefficient of thermal expansion between the ceramic substrate 9 and the ceramic of the ceramic substrate 9, stress will be generated between them.
６ａの板厚よりも薄く形成されているので、接続部５ｂ
、６ｂに充分な弾性が保有され、ストレスは接続部５ｂ
、６ｂに効果的に吸収され、接続部５ｂ、６ｂが緩衝部
分として作用することになるなお、上記実施例では従来
板厚の％の板を二重折りしたターミナルについて述べた
が第５図のように％厚の板をプレスして、ターミナル５
を形成し、刃部５ａは従来板厚相当に形成し、接続部５
ｂは刃部５ａの％板厚としても同様の効果を奏する。Since the connecting portion 5b is formed thinner than the plate thickness of the connecting portion 5b.
, 6b has sufficient elasticity, and the stress is reduced to the connecting portion 5b.
, 6b, and the connecting parts 5b and 6b act as buffer parts.In the above embodiment, a terminal was described in which a plate of % of the conventional plate thickness was folded double, but the terminal in FIG. Press a board with a thickness of % as shown, and press the terminal 5.
The blade portion 5a is formed to have a thickness equivalent to that of a conventional plate, and the connecting portion 5
The same effect can be obtained even if b is the % plate thickness of the blade portion 5a.
以上のように本考案によれば、刃部と接続部を夫々一体
板状に形成すると共に、上記接続部の板厚を上記刃部の
厚さ方向外観寸法よりも小さくしたので、信頼性の高い
製品が安価にできる効果がある。As described above, according to the present invention, the blade portion and the connecting portion are each formed into an integral plate shape, and the plate thickness of the connecting portion is made smaller than the external dimension in the thickness direction of the blade portion, thereby improving reliability. This has the effect of making expensive products cheaper.
第１図は従来のターミナルを示す図で、Ａは平面図、Ｂ
は正面図、第２図は従来のターミナルとセラミック基板
との接続状態を示す側面図、第３図はこの考案の一実施
例によるターミナルでＡは平面図、Ｂは正面図、第４図
はこの考案のターミナルの接続状態を示す側面図、第５
図はこの考案の他の実施例を示す図でＡは平面図、Ｂは
正面図である。
図にお・いて、５，６はターミナル、５ａ、６ａは刃部
、５ｂ、６ｂは接続部、７はコネクタ、８１゜８２、８
３は電子部品、９はセラミック基板、９ａは穴、１０は
半田、１１は接合部である。
なお゛、各図中同一符号は同−又は相当部分を示す。Figure 1 shows a conventional terminal, where A is a plan view and B
is a front view, FIG. 2 is a side view showing the connection state between a conventional terminal and a ceramic substrate, FIG. 3 is a terminal according to an embodiment of this invention, A is a plan view, B is a front view, and FIG. Side view showing the connection state of the terminal of this invention, No. 5
The figures show another embodiment of this invention, with A being a plan view and B being a front view. In the figure, 5 and 6 are terminals, 5a and 6a are blade parts, 5b and 6b are connection parts, 7 is a connector, 81° 82, 8
3 is an electronic component, 9 is a ceramic substrate, 9a is a hole, 10 is solder, and 11 is a joint. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
設けられた刃部と、この刃部と一体的に設けられ、上記
セラミック基板と接続される接続部とを備え、上記刃部
と上記接続部を夫々一体板状に形成すると共に、上記接
続部の板厚を上記刃部の厚さ方向外観寸法よりも小さく
形成したことを特徴とするセラミック基板との接続ター
ミナル。A connector for connecting the ceramic substrate to an external circuit includes a blade portion provided on the connector, and a connecting portion provided integrally with the blade portion and connected to the ceramic substrate, the blade portion and the connecting portion being connected to each other. A connection terminal for a ceramic substrate, characterized in that each terminal is formed into an integral plate shape, and the plate thickness of the connection part is smaller than the external dimension in the thickness direction of the blade part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980002564U JPS5935956Y2 (en) | 1980-01-14 | 1980-01-14 | Connection terminal with ceramic board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980002564U JPS5935956Y2 (en) | 1980-01-14 | 1980-01-14 | Connection terminal with ceramic board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56105269U JPS56105269U (en) | 1981-08-17 |
| JPS5935956Y2 true JPS5935956Y2 (en) | 1984-10-04 |
Family
ID=29599391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980002564U Expired JPS5935956Y2 (en) | 1980-01-14 | 1980-01-14 | Connection terminal with ceramic board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5935956Y2 (en) |
-
1980
- 1980-01-14 JP JP1980002564U patent/JPS5935956Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56105269U (en) | 1981-08-17 |
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