JPS5931238B2 - flexible print warmer - Google Patents
flexible print warmerInfo
- Publication number
- JPS5931238B2 JPS5931238B2 JP50150856A JP15085675A JPS5931238B2 JP S5931238 B2 JPS5931238 B2 JP S5931238B2 JP 50150856 A JP50150856 A JP 50150856A JP 15085675 A JP15085675 A JP 15085675A JP S5931238 B2 JPS5931238 B2 JP S5931238B2
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- coating
- coating resin
- printed circuit
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、フレキシブルプリント回路基板の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in flexible printed circuit boards.
従来のフレキシブルプリント回路基板は、フレキシブル
なベースフィルムに銅箔が接着剤層によつて接着されエ
ッチングによつて所望回路の導体として形成されるもの
で、導体を保護するためランド部等の導体の一部を除い
てその他導体上にオーバーレイフィルムに接着剤コーテ
ィングしたものを所定の形状に位置決めしてプレスする
ものである。In conventional flexible printed circuit boards, copper foil is bonded to a flexible base film using an adhesive layer and etched to form the conductor of the desired circuit. An overlay film is coated with an adhesive on the conductor except for a part and then positioned in a predetermined shape and pressed.
然るに最近になつて上記のオーバーフィルムに代つて樹
脂を主にスクリーンプリントで導体上に直接コーティン
グする方法がとられるようになつてきた。併し最近のこ
の方法で製造されたフレキシブルプリント回路基板では
コーティングが１回であるため、ピンホールが多数あり
、延いては耐電圧に問題点があつた。本発明は、上記の
問題点を解決するためになされたもので、ベースフィル
ムに接着剤で接着された導体例えば銅箔上に樹脂を少く
とも２回以上ランド部等の上の窓あき部の大きさをかえ
てコーティングすることによつて、オーバーレイを設け
ピンホールの無い、耐電圧の向上したフレキシブルプリ
ント回路基板を提供するものである。However, recently, instead of the above-mentioned overfilm, a method of directly coating the conductor with a resin mainly by screen printing has been used. However, since recent flexible printed circuit boards manufactured using this method are coated only once, they have a large number of pinholes, which in turn poses problems in withstand voltage. The present invention has been made in order to solve the above-mentioned problems.The present invention has been made in order to solve the above-mentioned problems. By changing the size of the coating, a flexible printed circuit board with an overlay, no pinholes, and improved withstand voltage is provided.
本発明を以上図面を用いて説明する。The present invention will be explained using the drawings above.
第１図において１はフレキシブルなベースフィルム、２
は接着剤層、３は導体で、４、５はそれぞれ第１回目、
第ｚ回目のオーバーレイ用コーティング樹脂層である。In Figure 1, 1 is a flexible base film, 2
is the adhesive layer, 3 is the conductor, 4 and 5 are the first time,
This is the coating resin layer for the zth overlay.
第１回目のコーティング樹脂層４にたとえピンホールが
できても、第２回目のコーティング樹脂層５を施すこと
によつてピンホールを皆無にし耐電圧を向上させる。な
お本発明に係るフレキシブルプリント回路、基板に使用
するコーティング樹脂は、市販のソルダーレジスト、エ
ポキシ、ウレタン等の樹脂である。Even if pinholes are formed in the first coating resin layer 4, by applying the second coating resin layer 5, the pinholes are completely eliminated and the withstand voltage is improved. The coating resin used for the flexible printed circuit and substrate according to the present invention is a commercially available resin such as solder resist, epoxy, or urethane.
エポキシ樹脂でコーティングを１回だけ施したもの、本
発明の２回施したものを回路〜水中間で耐電圧試検を行
つた結果は次のとおりであつた。なおプリント回路基板
には導体露出部としていわゆるランド部、端子部がある
。従来の所定の厚みに１回でコーテイングする方法では
ランド部、端子部に樹脂のにじみがあり、ハンダ付けの
面積の減少によるハンダ付けの信頼性を下げるような問
題、更に圧着で金メツキ等を施して導電性を良くする場
合もあるが、この場合樹脂のにじみは致命的な欠陥とな
る。本発明のものはこの場合にも有効であることを図面
を用いて説明する。第１図に示すように、第１回目のコ
ーテイング樹脂層４が施される時にランド部３−１上に
設けられる窓あき部６に比べて、第２回目のコーテイン
グ樹脂層５が施されるときの窓あき部７はわずかに大き
くなつている。A withstand voltage test was carried out between the circuit and water for the epoxy resin coated once and the present invention coated twice, and the results were as follows. Note that the printed circuit board has so-called land portions and terminal portions as conductor exposed portions. With the conventional method of coating to a predetermined thickness in one go, resin bleeds into the land and terminal areas, reducing soldering reliability due to a reduction in the soldering area.Furthermore, there are problems with gold plating, etc. during crimping. In some cases, the conductivity can be improved by adding resin, but in this case, the bleeding of the resin becomes a fatal defect. The fact that the present invention is also effective in this case will be explained with reference to the drawings. As shown in FIG. 1, the second coating resin layer 5 is applied compared to the window opening 6 provided on the land portion 3-1 when the first coating resin layer 4 is applied. The window opening 7 is slightly larger.
更に説明を加えると第１回目のコーテイング樹脂層４は
、薄い膜層の例えば１５μ程度のコーテイングで、位置
、形状を精度よくコーテイングした層であり、第２回目
のコーテイング樹脂層５は耐電圧、絶縁性を得るために
第１回目のコーテイングの際の窓あき部６より大きな窓
あき部７で所定の厚みにコーテイングを施した層である
。この第２回目のコーテイング樹脂層は窓あき部が第１
回目のコーテイング樹脂層に比べ大きいためコーデイン
グにあたつての位置決めを第１回目のものほど精度よく
合わせる必要はない。上述のように第１回目のコーテイ
ング樹脂層が薄くできるため、樹脂のにじみが出ない利
点があり、形状の精度がよくて０．６φの程度の窓あき
まで可能である。To explain further, the first coating resin layer 4 is a thin film layer, for example, about 15 μm coating, and is coated with high precision in position and shape, and the second coating resin layer 5 is a thin film layer coated with a thickness of, for example, about 15 μm. In order to obtain insulation properties, this layer is coated to a predetermined thickness with window openings 7 that are larger than window openings 6 during the first coating. In this second coating resin layer, the window opening is the first layer.
Since it is larger than the coating resin layer of the second coating, it is not necessary to position it as accurately as the first coating. As mentioned above, since the first coating resin layer can be made thinner, there is an advantage that the resin does not bleed, and the shape accuracy is good, and a window opening of about 0.6φ is possible.
更にランド部に金、半田等のメツキが必要なものでメツ
キ層を有するものにも適用できる。Furthermore, it can also be applied to items that require plating with gold, solder, etc. on the land portions and have a plating layer.
以上のとおり、本発明のフレキシブルプリント回路基板
は、コーテイングを２回行うことにしてピンホールを無
くし、かつ第１回目と第２回目の窓あき部の大きさをか
え第２回目はそれほど位置決め精度を要しないようにし
たので製造効率を上げる上でもきわめて有用である。As described above, the flexible printed circuit board of the present invention eliminates pinholes by performing coating twice, and by changing the size of the window opening between the first and second coatings, the positioning accuracy is not so high in the second coating. Since this method eliminates the need for additional steps, it is extremely useful in increasing manufacturing efficiency.
第１図イ，口は本発明にかかるフレキシブルプリント回
路基板の説明図で、１はフレキシブルなベースフイルム
、２は接着剤層、３は導体、４はオーバーレイ用第１回
目コーテイング樹脂層、５はオーバーレイ用第２回目コ
ーテイング樹脂層、６，７は窓あき部、３−１はランド
部である。Figure 1 A is an explanatory diagram of a flexible printed circuit board according to the present invention, in which 1 is a flexible base film, 2 is an adhesive layer, 3 is a conductor, 4 is a first coating resin layer for overlay, and 5 is a In the second coating resin layer for overlay, 6 and 7 are window openings, and 3-1 is a land portion.
Claims (1)
レキシブルプリント回路基板において、導体は窓あき部
を有するオーバーレイ用コーティング樹脂層でおおわれ
、更に上記コーティング樹脂層は上記窓あき部よりわず
かに大きい窓あき部を有する別のオーバーレイ用コーテ
ィング樹脂層によつておおわれたことを特徴とするフレ
キシブルプリント回路基板。1. In a flexible printed circuit board having a conductor on a flexible base film, the conductor is covered with an overlay coating resin layer having a window aperture, and the coating resin layer further has a window aperture slightly larger than the window aperture. A flexible printed circuit board characterized in that it is covered with another overlay coating resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50150856A JPS5931238B2 (en) | 1975-12-17 | 1975-12-17 | flexible print warmer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50150856A JPS5931238B2 (en) | 1975-12-17 | 1975-12-17 | flexible print warmer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5273381A JPS5273381A (en) | 1977-06-20 |
| JPS5931238B2 true JPS5931238B2 (en) | 1984-07-31 |
Family
ID=15505854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50150856A Expired JPS5931238B2 (en) | 1975-12-17 | 1975-12-17 | flexible print warmer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931238B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6233436A (en) * | 1985-08-07 | 1987-02-13 | Shin Etsu Handotai Co Ltd | Wafer case for transport |
| JPH0231789Y2 (en) * | 1989-05-02 | 1990-08-28 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS605240B2 (en) * | 1980-02-05 | 1985-02-08 | 松下電器産業株式会社 | flexible printed wiring board |
| JPS58147273U (en) * | 1982-03-29 | 1983-10-03 | アイワ株式会社 | Solder plated printed wiring board |
| JP3205548B2 (en) | 1999-10-01 | 2001-09-04 | ソニーケミカル株式会社 | Multi-layer flexible wiring board |
| JP5106726B2 (en) * | 2001-08-10 | 2012-12-26 | イビデン株式会社 | Wiring board manufacturing method |
| JP4622308B2 (en) * | 2004-05-19 | 2011-02-02 | パナソニック株式会社 | Flexible printed wiring board |
| WO2008023506A1 (en) * | 2006-08-02 | 2008-02-28 | Murata Manufacturing Co., Ltd. | Chip device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503503A (en) * | 1973-04-11 | 1975-01-14 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5547070Y2 (en) * | 1971-09-17 | 1980-11-05 | ||
| JPS4911253U (en) * | 1972-05-02 | 1974-01-30 |
-
1975
- 1975-12-17 JP JP50150856A patent/JPS5931238B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503503A (en) * | 1973-04-11 | 1975-01-14 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6233436A (en) * | 1985-08-07 | 1987-02-13 | Shin Etsu Handotai Co Ltd | Wafer case for transport |
| JPH0231789Y2 (en) * | 1989-05-02 | 1990-08-28 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5273381A (en) | 1977-06-20 |
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