JPS60186086A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board that incorporates leadless electronic components together with various electronic components to constitute a circuit unit of an electronic device.

Conventional configurations and their problems Recently, automatic mounting methods for electronic devices, such as automatic insertion of discrete components and automatic soldering, have been increasing.As electronic devices become smaller, lighter, and thinner, leadless The use of parts is increasing rapidly.

Recent mounting methods that use adhesives to attach leadless electronic components to a printed wiring board and automatically solder them simultaneously or separately with discrete components have created new problems that have not been experienced before. are doing.

One of them is the positional relationship of leadless electronic components mounted on a printed wiring board. Electronic components that are mounted on printed wiring boards or mounted on a printed wiring board are small, and there is nothing to restrict their position, so they may bend or shift in position. This is a major factor that affects quality and productivity.

As a characteristic of leadless electronic components, the component body is fixed with adhesive in addition to soldering, so if a problem such as bending or misalignment occurs, corrections can be made as easily as with discrete components. This was a major disadvantage as it not only required many man-hours to make repairs, but also caused damage to parts.

OBJECTS OF THE INVENTION It is an object of the present invention to eliminate the drawbacks of the above-mentioned conventional examples and to provide a printed wiring board on which leadless electronic components can be mounted with high accuracy.

Structure of the Invention The present invention reads a predetermined position from a finished printed wiring board using numerical control, creates a recording tape, and automatically attaches leadless electronic components to the printed wiring board based on the recording tape. In this case, the object of the invention is achieved by forming on the printed wiring board a symbol mark indicating the length and width corresponding to the external dimensions of the leadless electronic component and a symbol mark indicating the position of adhesive application.

In other words, the positional dimensions are read from the symbol mark that clearly indicates the position of adhesive application, and the recording tape is used.

The degree of position M is high because adhesive is applied and leadless electronic components are mounted based on the tape. While designing the positions of the no-turns, lands, holes, etc. of a printed wiring board, a tape indicating the position of leadless electronic components may be created using a computer at the same time, but as is well known, in the manufacturing process of printed wiring boards, printing, There are a number of moisture absorption and heat treatments such as etching and, in some cases, plating, and there are dimensional changes and alignment factors during that process, so variations are common. However, as in the present invention, f.

Since the dimensions are read from the symbol mark of the finished product as a single lint wiring board, it is possible to automatically mount leadless components with the most certainty and precision.

Since it has a symbol mark indicating the length and width according to the external dimensions of the leadless part, if the part is bent or misaligned, the symbol mark will protrude greatly, making it easy to inspect.

Description of Examples (Example 1) As shown in FIGS. 1 and 2, copper foil circuits 2a and 2b are formed on one side (or both sides) of an insulating substrate 10 made of a laminate, and terminals of leadless components 3 are formed. When soldering 4a and 4b, after forming a solder mask 6 leaving the copper foil lands 5a and 6b to be connected, apply a symbol mark in a bright color such as white or yellow to a symbol mark that is approximately the same length as the leadless electronic component 3. Two parallel lines 7a + 7b of length are printed so that the width is almost the same as the width of the leadless part 3, and a small dot shape indicating the position where the adhesive 8 for fixing the leadless part 3 is applied is printed. A printed wiring board is produced on which the symbol mark 9 is printed and formed at the same time.

A recording tape is created by reading data indicating positions for a numerically controlled leadless component automatic mounting machine from a plurality of symbol marks 9 indicating adhesive application positions on the printed wiring board produced as described above. Next, based on the tape, adhesive is applied to a predetermined position using a dispenser, etc. Based on the tape, leadless electronic components are mounted and bonded with adhesive, and then the adhesive is cured by ultraviolet curing or heat curing. After doing so, the leadless electronic components may become misaligned.
After inspecting for dropouts, etc., the terminal portion 4a of the leadless electronic component 3 is soldered using an automatic soldering inspection device.
, 4b and the copper foil land portion 5a.

Connect 5b.

<Example 2> As shown in Fig. 3, one side (
After forming the copper foil circuits 2a and 2b on the copper foil circuits 2a and 2b (or both sides) and forming the solder resist 6 on the parts where the copper foil lands 5a and 5b to which the leadless components are soldered are left, a symbol mark in a bright color such as white or yellow is applied. By printing with ink, an H-shaped symbol mark with a small dot-like notch in the center indicating the position of adhesive and leadless component attachment is formed. In that case, the size of the H-shape should be approximately the same as the length and width of the external dimensions of the leadless electronic component to be mounted.

The leadless electronic components were mounted on the printed wiring board produced as described above in the same manner as in Example 1.

Effect of the invention As described above, according to the present invention, the parts diagram.

It is possible to easily form a symbol mark indicating the position of a leadless component and its adhesive application position at the same time as printing a service map, etc., and it also eliminates the influence of variations due to dimensional changes in the printed wiring board manufacturing process. The automatic mounting of parts can be performed with high precision, and inspection work can be simplified, so it is of great industrial value.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, FIG. 2 is a sectional view showing a state in which IJ-dress components are mounted on the same printed wiring board, and FIG. 3 is another embodiment of the present invention. It is a top view of the printed wiring board in an example. 1...Insulated substrate, 2...Copper foil circuit, 3
...Leadless parts, 4a, 4b...Terminals of leadless parts, 6a, 6b River...Copper foil land, 6
... Solder register y, g, 7a, 7b, old...
Parallel line symbol mark, 8...Adhesive, 9.
... Symbol mark indicating the adhesive application position. Name of agent Patent attorney Toshio Nakao 1 person Written amendment of procedure April 1985 teDl case indication 1986 Patent Application No. 18614 Relationship with the 2nd title of invention case Patent application Office Osaka 1006 Kadoma, Fukadoma City Name (
58,2) Matsushita Electric Industrial Co., Ltd. t1, Representative Yamashita
Toshihiko 4 Agent 571 Address 2, Matsushita Electric Industrial Co., Ltd., 1006 Oaza Kadoma, Kadoma City, Osaka Prefecture Claims (1) Symbol mark indicating the length and width according to the external dimensions of leadless electronic components and a symbol mark clearly indicating the position of adhesive application. @) Two parallel lines spaced so that the symbol mark is approximately equal to the length of the leadless electronic component and approximately equal to the width of the leadless electronic component, and an adhesive that secures the leadless electronic component. 2. The printed wiring board according to claim 1, comprising a spot indicating the position of the printed wiring board. (3) The symbol mark is in the shape of a figure 8 with dimensions approximately equal to the length and width of the leadless electronic component, and the adhesive for fixing the leadless electronic component is located in the center of the symbol mark in the shape of the 8 shape. The printed wiring board according to claim 1, wherein a notch is provided in a portion indicating the position of the agent.

Claims (3)

[Claims] (1) A printed wiring board characterized by having a symbol arc that indicates a length and width that match the external dimensions of a leadless electronic component, and a symbol mark that clearly indicates the position of adhesive application. (2) Is the symbol mark 11 the length of leadless electronic components? ! Claim 1 consisting of two parallel lines spaced equally and approximately equal to the width of the leadless electronic component, and a spot indicating the position of the adhesive that fixes the leadless electronic component. Printed wiring board as described in section. (3) The symbol mark is H-shaped with dimensions approximately equal to the length and width of the leadless electronic component, and the leadless electronic part is fixed to the center of the H-shaped symbol mark. The printed wiring board according to claim 1, wherein a notch is provided in a portion indicating the position of the adhesive.