JPS5925236A - Mounting structure of semiconductor functional element - Google Patents
Mounting structure of semiconductor functional elementInfo
- Publication number
- JPS5925236A JPS5925236A JP13413782A JP13413782A JPS5925236A JP S5925236 A JPS5925236 A JP S5925236A JP 13413782 A JP13413782 A JP 13413782A JP 13413782 A JP13413782 A JP 13413782A JP S5925236 A JPS5925236 A JP S5925236A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor functional
- bump
- functional elements
- mounting structure
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ）発明の技術分野
本発明は半導体機能素子の実装構造に係り、特にパンフ
接続を行う半導体機能素子の実装に先だって行う電気的
特性の測定、及びフェースボンディングによって相互に
バンプ接続してなる１対の半導体機能素子の何れか一方
の該素子の取り外し、取り替え等と、容易化した半導体
機能素子の実装構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to the mounting structure of semiconductor functional devices, and in particular to the measurement of electrical characteristics prior to the mounting of semiconductor functional devices that performs pamphlet bonding, and the mutual bonding through face bonding. The present invention relates to a mounting structure for semiconductor functional elements that facilitates the removal and replacement of one of a pair of semiconductor functional elements formed by bump-connecting the semiconductor functional elements.
（ｂ）従来技術と問題点
一般に複数の受光部を２次元に構成した例えばフォトダ
イオードアレーからなる光電変換素子を、該素子の出力
信号を処理する信号処理回路素子に実装する一方法とし
て例えば第１図に示すように前記光電変換素子１の各電
極接続部、および該各電極接続部と対応する前記信号処
理回路素子２の各配線接続部に比較的軟らかい低融点金
属、例えばインジウム（Ｉｎ）から成る柱状の金属バン
プ３ａ〜３ｄ、４ａ〜４ｄを設けておき、上記の光電変
換素子１を信号処理回路素子２（以下回路素子と略称す
る）上に直接双方の金属バンプ３ａ〜３ｄと４ａ〜４ｄ
を介して互いに対向した状態でフェースボンディング法
により固着することによって第２図に示すように、上記
光電変換素子１を回路素子２上に機械的結合と電気的接
続とを同時に行うことが知られている。(b) Prior Art and Problems In general, one method of mounting a photoelectric conversion element, for example, a photodiode array, in which a plurality of light receiving sections are two-dimensionally configured, into a signal processing circuit element that processes the output signal of the element is as follows. As shown in FIG. 1, each electrode connection portion of the photoelectric conversion element 1 and each wiring connection portion of the signal processing circuit element 2 corresponding to each electrode connection portion are coated with a relatively soft low melting point metal, such as indium (In). Columnar metal bumps 3a to 3d and 4a to 4d are provided, and the photoelectric conversion element 1 is directly placed on both metal bumps 3a to 3d and 4a on the signal processing circuit element 2 (hereinafter abbreviated as circuit element). ~4d
It is known that the photoelectric conversion element 1 is mechanically bonded and electrically connected to the circuit element 2 at the same time, as shown in FIG. ing.
ところで上述のように金属バンプ３、４を用いた実装構
造にあっては、前記回路素子２に一旦実装された光電変
換素子１を取り外して再度別の光電変換素子をバンプ接
続することが不可能であるため、実装接続不良や、実装
接続された双方の素子のうち何れか一方の素子が不良に
なると他方の素子も使用不能となる不都合があった。ま
たパンプ接続によって実装する光電変換素子１の電気的
特性の測定を、実装に先だって行う際に、該素子２の各
金属バンプ３ａ〜３ｄを変形、破損しやすい欠点があり
、実装直前に金属バンプに損傷を与えることなく容易に
測定できる構成も要望されている。However, in the mounting structure using the metal bumps 3 and 4 as described above, it is impossible to remove the photoelectric conversion element 1 once mounted on the circuit element 2 and connect another photoelectric conversion element to the bumps again. Therefore, if there is a defective mounting connection or one of the two mounted and connected elements becomes defective, the other element also becomes unusable. In addition, when measuring the electrical characteristics of the photoelectric conversion element 1 to be mounted by pump connection prior to mounting, there is a drawback that the metal bumps 3a to 3d of the element 2 are easily deformed and damaged. There is also a need for a configuration that allows easy measurement without damaging the device.
（ｃ）発明の目的
本発明は前述の問題点を解決したもので、金属バンプ接
続によって実装された半導体機能素子、あるいは非実装
側の半導体機能素子を容易に取替得ることができ、さら
に実装前に金属バンプを変形、破損させることなく簡単
に電気的特性を測定し得る新規な半導体機能素子の実装
構造を提供することを目的とするものである。(c) Purpose of the Invention The present invention solves the above-mentioned problems, and it is possible to easily replace the semiconductor functional element mounted by metal bump connection or the semiconductor functional element on the non-mounted side, and furthermore, the present invention The object of the present invention is to provide a novel mounting structure for a semiconductor functional element, in which electrical characteristics can be easily measured without deforming or damaging metal bumps beforehand.
（ｄ）発明の構成
そしてこの目的は本発明によれば、１対の半導体機能素
子をフェースボンディング方式で相互に接続してなる構
成において、前記半導体機能素子間に中継接続板を設け
、該中継接続板を介して上記１対の半導体機能素子を接
続してなることを特徴とする半導体機能素子の実装構造
を提供することによって達成される。(d) Structure and object of the invention According to the present invention, in a structure in which a pair of semiconductor functional elements are connected to each other by a face bonding method, a relay connection board is provided between the semiconductor functional elements, and the relay connection plate is provided between the semiconductor functional elements. This is achieved by providing a mounting structure for semiconductor functional elements, characterized in that the pair of semiconductor functional elements are connected via a connection plate.
（ｅ）発明の実施例
以下図面を用いて本発明の好ましい実施例について詳細
に説明する。(e) Embodiments of the invention Preferred embodiments of the invention will now be described in detail with reference to the drawings.
第３図および第４図は本発明に係る半導体機能素子の実
装構造の一実施例を示す要部断面図である。なお以下の
各図において第１図と同等部分は同一符号で示す。まず
第３図に示すように本実施例においては、各電極接続部
にそれぞれ低融点金属の例えばインジウム（Ｉｎ）から
なる柱状の金属バンプ３ａ〜３ｄが配設された例えば複
数の受光部を２次元に構成したフォトダイオードアレー
からなる半導体機能素子、即ち光電変換素子１を、前記
素子１の各金属バンプ３ａ〜３ｄと対応するようにスル
ーホール３２が穿設され、かつ該スルーホール３２を通
して両板面に図示のように接続導体３３が設けられた例
えばセラミックまたはサファイヤ等からなる中継接続板
３１にフェースボンディングによってバンプ接続し、固
着一体化する。そしてこのように構成された前記中継接
続板３１の各接続導体３３の他端部を利用して前記光電
変換素子１の電気的特性を測定するようにすれば従来の
如き各金属バンプ３ａ〜３ｄを損傷させることがなくな
る。しかる後前記中継接続板３１の各接続導体３３の他
端部を、実装すべき対の半導体機能素子、例えば、前記
光電変換素子１の出力信号を処理する信号処理回路素子
２のインジュウム（Ｉｎ）等から成る各金属バンプ４ａ
〜４ｄに当接してフェースボンディングによってバンプ
接続し、固着することにより、第４図に示すように前記
光電変換素子１と対向する信号処理回路素子２とが中継
接続板３１を中間に介してバンプ接続により一体的に構
成される。従って第４図のように実装された構成におけ
る光電変換素子１が不良となった場合、前記中継接続板
３１より信号処理回路素子２側のバンプ接続状態を破損
させることなく、簡単に前記不良の光電変換素子１を各
バンプ３ａ〜３ｄ毎取り外し、取替えることが可能とな
る。勿論逆に信号処理回路素子２も同様に取替えること
ができ、両者の組合せ構造を再生することが容易になる
。FIGS. 3 and 4 are sectional views of essential parts showing an embodiment of a mounting structure for a semiconductor functional element according to the present invention. In each figure below, parts equivalent to those in FIG. 1 are indicated by the same reference numerals. First, as shown in FIG. 3, in this embodiment, for example, a plurality of light receiving sections are provided, each of which has columnar metal bumps 3a to 3d made of a low melting point metal such as indium (In) arranged at each electrode connection section. Through holes 32 are formed to correspond to the respective metal bumps 3a to 3d of the element 1, and through the through holes 32, a semiconductor functional element consisting of a photodiode array, that is, a photoelectric conversion element 1, is formed. A bump connection is made by face bonding to a relay connection plate 31 made of, for example, ceramic or sapphire, on which a connection conductor 33 is provided as shown in the figure, and the connection conductor 33 is fixed and integrated. If the electrical characteristics of the photoelectric conversion element 1 are measured using the other end of each connection conductor 33 of the relay connection board 31 configured in this way, each of the metal bumps 3a to 3d as in the conventional method can be measured. will not cause any damage. Thereafter, the other end of each connection conductor 33 of the relay connection board 31 is connected to a pair of semiconductor functional elements to be mounted, for example, indium (In) of a signal processing circuit element 2 that processes the output signal of the photoelectric conversion element 1. Each metal bump 4a consisting of
4d and are bump-connected and fixed by face bonding, as shown in FIG. Integrated by connection. Therefore, if the photoelectric conversion element 1 in the mounted configuration as shown in FIG. The photoelectric conversion element 1 can be removed and replaced every bump 3a to 3d. Of course, conversely, the signal processing circuit element 2 can also be replaced in the same way, making it easy to reproduce the combination structure of the two.
なお以上の実施例では光電変換素子と該素子の出力信号
を処理する信号処理回路素子とをバンプ接続する場合の
例について説明したが、本発明の構成はこれに限定され
るものではなく、例えば各種ハイブリッドＩＣの組立等
に適用可能なことはいうまでもない。In the above embodiments, an example was explained in which a photoelectric conversion element and a signal processing circuit element that processes an output signal of the element are bump-connected, but the configuration of the present invention is not limited to this, and for example, Needless to say, it is applicable to the assembly of various hybrid ICs.
（ｆ）発明の効果
以上の説明から明らかなように本発明に係る半導体機能
素子の実装構造によれば、１対の半導体機能素子間に中
継接続板を設け、該中継接続板を介して両半導体機能素
子をバンプ接続した構成がとられているので、かかる構
成において不良となった何れか一方の半導体機能素子を
、他方の半導体機能素子側のバンプ接続状態を損傷させ
ることなく簡単に取り外したり、また取り替えることが
できる利点を有し、また単体の状態では接続バンプが破
損され電気的な特性を測定し難い半導体機能素子も中継
接続板にバンプ接続した状態で前記特性測定が容易化さ
れる等、優れた効果が発揮され等、各種ハイブリッドＩ
Ｃの組立等に適用して極めて有利である。(f) Effects of the Invention As is clear from the above explanation, according to the mounting structure of semiconductor functional elements according to the present invention, a relay connection plate is provided between a pair of semiconductor functional elements, and both Since the semiconductor functional elements are configured to be bump-connected, it is possible to easily remove one of the semiconductor functional elements that has become defective without damaging the bump-connected state of the other semiconductor functional element. , it also has the advantage of being replaceable, and also makes it easier to measure the characteristics of semiconductor functional elements whose connection bumps are damaged and the electrical characteristics are difficult to measure when they are connected to the relay connection board by bumps. etc., various hybrid I have been shown to have excellent effects.
It is extremely advantageous when applied to the assembly of C, etc.
第１図および第２図は従来の半導体機能素子の実装構造
を説明する要部断面図、第３図および第４図は本発明に
係る半導体機能素子の実装構造の一実施例を示す要部断
面図である。
図面において、１は光電変換素子、２は信号処理回路素
子、３ａ〜３ｄおよび４ａ〜４ｄは金属バンプ、３１は
中継接続板、３２はスルーホール、３３は接続導体を示
す。FIGS. 1 and 2 are cross-sectional views of main parts explaining a conventional mounting structure of a semiconductor functional element, and FIGS. 3 and 4 are main parts showing an embodiment of a mounting structure of a semiconductor functional element according to the present invention. FIG. In the drawings, 1 is a photoelectric conversion element, 2 is a signal processing circuit element, 3a to 3d and 4a to 4d are metal bumps, 31 is a relay connection board, 32 is a through hole, and 33 is a connection conductor.
Claims (1)
互に接続してなる構成において、前記半導体機能素子間
に中継接続板を設け、該中継接続板を介して上記１対の
半導体機能素子を接続してなることを特徴とする半導体
機能素子の実装構造。In a configuration in which a pair of semiconductor functional elements are connected to each other by a face bonding method, a relay connecting plate is provided between the semiconductor functional elements, and the pair of semiconductor functional elements are connected via the relay connecting plate. A mounting structure for a semiconductor functional element characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13413782A JPS5925236A (en) | 1982-07-30 | 1982-07-30 | Mounting structure of semiconductor functional element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13413782A JPS5925236A (en) | 1982-07-30 | 1982-07-30 | Mounting structure of semiconductor functional element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5925236A true JPS5925236A (en) | 1984-02-09 |
Family
ID=15121331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13413782A Pending JPS5925236A (en) | 1982-07-30 | 1982-07-30 | Mounting structure of semiconductor functional element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5925236A (en) |
-
1982
- 1982-07-30 JP JP13413782A patent/JPS5925236A/en active Pending
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