JPH08181338A - Optical receiver - Google Patents

Optical receiver

Info

Publication number
JPH08181338A
JPH08181338A JP6322241A JP32224194A JPH08181338A JP H08181338 A JPH08181338 A JP H08181338A JP 6322241 A JP6322241 A JP 6322241A JP 32224194 A JP32224194 A JP 32224194A JP H08181338 A JPH08181338 A JP H08181338A
Authority
JP
Japan
Prior art keywords
terminal
photocurrent
metal wiring
potential
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6322241A
Other languages
Japanese (ja)
Inventor
Yutaka Sadohara
豊 佐土原
Hisato Takahashi
久人 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP6322241A priority Critical patent/JPH08181338A/en
Publication of JPH08181338A publication Critical patent/JPH08181338A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages

Landscapes

  • Light Receiving Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE: To reduce current leakage between terminals or wirings or prevent the generation of current leakage by interposing a photoelectric current terminal and the same potential terminal between the photoelectric current terminal and a second terminal when laying out the second terminal which has electric potential different from that of the photoelectric current terminal at a location close to the photoelectric current terminal where photoelectric current is flowing. CONSTITUTION: When a second terminal 4-2 having an electric current different from that of a photoelectric current terminal 4-1 is laid out near a metal wiring 4-1 installed on a wiring board 10 where photoelectric current is flowing, the metal wiring 4-1 to which electric potential piled up in the current is applied and a third metal wiring 4-3 to which the same potential is applied, are interposed between the photoelectric current terminal 4-1 and the second terminal 4-2, thereby generating current leakage between the terminals 4-2 and 4-3 having different electric potential from each other, but it is difficult to generate the current leakage between the same potential wirings 4-1 and 4-3. It is, therefore, possible to inhibit the generation of current leakage between the terminals or the wirings and monitor an accurate behavior of the photoelectric current.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、光電流のリーク防止を
施した光受信装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical receiver which prevents leakage of photocurrent.

【０００２】[0002]

【従来の技術】光通信において、フォトダイオードを用
いた光受信装置は光通信信号を受信する外、受光レベル
をモニタする装置としても使用され、重要な役割を占め
ている。一方、かかる装置は機能の高速化、小型化に伴
い、配線間隔あるいはその端子間隔を狭くした結果、そ
れらの間で塵芥あるいは半田フラックス等を介して電流
のリークが生じやすくなった。2. Description of the Related Art In optical communication, an optical receiving device using a photodiode is used not only for receiving an optical communication signal but also as a device for monitoring a light receiving level, and plays an important role. On the other hand, with the speeding up and downsizing of the function of such a device, the distance between the wirings or the distance between the terminals is narrowed, and as a result, a current is apt to leak between them through dust or solder flux.

【０００３】[0003]

【発明が解決しようとする課題】このような受光装置を
用いた場合、特に、塵芥が原因でリークが発生する場合
は、光受信装置を製造した当初は問題ないが時間の経過
と共にリーク電流が増大し、光電流の正確なモニタがで
きなくなるという問題が生じた。そこで本発明は、かか
る問題点を解決して光電流のリーク防止を施した光受信
装置を提供することを目的とする。When such a light receiving device is used, particularly when a leak occurs due to dust, there is no problem at the beginning of manufacturing the optical receiving device, but the leak current is reduced as time passes. However, there is a problem in that the photocurrent cannot be accurately monitored. Therefore, an object of the present invention is to provide an optical receiving device that solves the above problems and prevents leakage of photocurrent.

【０００４】[0004]

【課題を解決するための手段】本発明に係わる光受信装
置は、多数の端子を設けた配線板と、配線板上には少な
くとも電圧を印加した光電変換素子と光電流を増幅する
増幅回路ならびに金属配線を備えた光受信装置であっ
て、光電流が流れる光電流端子と近接する位置に光電流
端子と異なる電位を有する第２の端子が配置される場
合、光電流端子と第２の端子との間に光電流端子と同電
位の端子を介在させたこと、あるいは他の回路から独立
させ、かつ無電位である端子を介在させたことを特徴と
する。An optical receiving apparatus according to the present invention includes a wiring board having a large number of terminals, a photoelectric conversion element to which at least a voltage is applied on the wiring board, and an amplifier circuit for amplifying a photocurrent. An optical receiving device provided with a metal wiring, wherein when a second terminal having a potential different from that of the photocurrent terminal is arranged at a position close to the photocurrent terminal through which the photocurrent flows, the photocurrent terminal and the second terminal And a terminal having the same potential as the photocurrent terminal, or a terminal having no potential and being independent of other circuits.

【０００５】前記光受信装置において、光電流が流れる
光電流端子と近接する位置に光電流端子と異なる電位を
有する第２の端子が配置される場合、光電流端子の周り
に光電流端子と同電位のガードピンを設けたことを特徴
とする。In the above optical receiving device, when the second terminal having a potential different from that of the photocurrent terminal is arranged at a position close to the photocurrent terminal through which the photocurrent flows, the photocurrent terminal is provided around the photocurrent terminal. It is characterized in that a potential guard pin is provided.

【０００６】前記光受信装置において、光電流が流れる
光電流端子と近接する位置に光電流端子と異なる電位を
有する第２の端子が配置される場合、光電流端子の周り
に絶縁体からなるパイプを設けたことを特徴とする。In the above optical receiving device, when the second terminal having a potential different from that of the photocurrent terminal is arranged in the vicinity of the photocurrent terminal through which the photocurrent flows, a pipe made of an insulator is provided around the photocurrent terminal. Is provided.

【０００７】前記光受信装置において、光電流が流れる
金属配線の近傍に光電流に重畳された電位と異なる電位
を有する第２の金属配線が配置される場合、光電流が流
れる金属配線と第２の金属配線の間に光電流に重畳され
た電位と同電位を印加した第３の金属配線を設けたこと
を特徴とする。In the above optical receiving device, when the second metal wiring having a potential different from the potential superimposed on the photocurrent is arranged in the vicinity of the metal wiring through which the photocurrent flows, the metal wiring and the second metal wiring through which the photocurrent flows. The third metal wiring to which the same potential as the potential superimposed on the photocurrent is applied is provided between the metal wirings.

【０００８】前記光受信装置において、光電流が流れる
金属配線の近傍に光電流に重畳された電位と異なる電位
を有する第２の金属配線が配置される場合、光電流が流
れる金属配線上には絶縁層を設けたことを特徴とする。In the above optical receiving device, when the second metal wiring having a potential different from the potential superimposed on the photocurrent is arranged in the vicinity of the metal wiring through which the photocurrent flows, the metal wiring through which the photocurrent flows is disposed on the second metal wiring. It is characterized in that an insulating layer is provided.

【０００９】[0009]

【作用】上記の構成によれば、本発明に係わる光受信装
置は、光電流が流れる第１の端子とこれと近接する第２
の端子があり、かつ異なる電位を有する場合は、両者の
間に第１端子と同一の電位を付与した第３端子を介在さ
せることによって、同一電位間に生じる電流リークを減
少させたものである。また、第３端子を他の回路等から
独立させ、かつ無電位にすることによって塵埃等が堆積
してもこれが直接的にリークと結びつかないようにして
いる。さらに、第１端子の周りにこれと同電位のガード
ピンを設けることによっても、同様に同一電位間の電流
リークを起こり難くすることができ、あるいは第１端子
に絶縁体のパイプを被せることによって外部から遮断し
てリークを防止することができる。光電流が流れる金属
配線についても同様の考えに基づいて、リーク電流の減
少あるいは防止を図ったものである。According to the above structure, the optical receiving apparatus according to the present invention has the first terminal through which the photocurrent flows and the second terminal close to the first terminal.
When there are two terminals and they have different potentials, a third terminal, to which the same potential as the first terminal is applied, is interposed between them to reduce the current leak occurring between the same potentials. . Further, by making the third terminal independent of other circuits and making it non-potential, even if dust or the like is accumulated, it is not directly connected to the leak. Further, by providing a guard pin having the same potential as the first terminal around the same, it is possible to similarly prevent current leakage between the same potentials, or by covering the first terminal with an insulating pipe. It is possible to prevent the leak by shutting off from. With respect to the metal wiring through which the photocurrent flows, the leak current is reduced or prevented based on the same idea.

【００１０】[0010]

【実施例】以下、添付図面を参照して本発明の実施例を
説明する。なお、図面の説明において同一要素には同一
符号を付し、重複する説明を省略する。図６は本発明に
係わる光受信装置の全体斜視図であり、図７は装置の内
部構造を示す斜視図である。本実施例の光受信装置は、
メッキを施したコバールあるいは４２アロイからなる多
数の端子１を設けたエポキシガラスあるいはセラミック
の配線板１０と、この配線板上には少なくとも光信号を
電気信号に変換する光電変換素子１１と光電流を増幅す
る増幅回路等からなるＩＣ１２とコンデンサ等の回路部
品１３ならびにこれらを電気的に接続するための金、金
パラジウム合金あるいは銅、アルミ等からなる金属配線
４を備えて形成される。ここで、光電変換素子１１には
電圧が印加されている。Embodiments of the present invention will be described below with reference to the accompanying drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description. FIG. 6 is an overall perspective view of the optical receiving device according to the present invention, and FIG. 7 is a perspective view showing the internal structure of the device. The optical receiver of this embodiment is
An epoxy glass or ceramic wiring board 10 provided with a number of terminals 1 made of plated Kovar or 42 alloy, a photoelectric conversion element 11 for converting at least an optical signal into an electric signal and a photocurrent on the wiring board. It is formed by including an IC 12 including an amplifying circuit for amplifying, a circuit component 13 such as a capacitor, and a metal wiring 4 made of gold, a gold-palladium alloy, copper, aluminum or the like for electrically connecting them. Here, a voltage is applied to the photoelectric conversion element 11.

【００１１】光ファイバ２０を伝送してきた光信号はレ
ンズ１４によって収光されて光電変換素子１１に入射
し、また、光電変換素子１１あるいはＩＣ１２等に印加
するために外部から入力されるされる電圧並びに配線板
１０から外部へ取り出される光電流等は夫々端子１を介
して行なわれる。The optical signal transmitted through the optical fiber 20 is collected by the lens 14 and is incident on the photoelectric conversion element 11, and a voltage input from the outside to be applied to the photoelectric conversion element 11 or the IC 12 or the like. In addition, the photocurrent and the like taken out from the wiring board 10 to the outside is carried out via the terminals 1, respectively.

【００１２】図１は、配線板１０に設けられた多数の端
子１、１ー１、１ー２、１ー３を示す側面図である。こ
こで、光電流が流れる光電流端子１ー１と近接する位置
に光電流端子と異なる電位を有する第２の端子１ー２が
配置される場合、光電流端子１ー１と第２の端子１ー２
との間に第３の端子１ー３を介在させることである。端
子１−１と１−２との間隔を実質的に広げてリークを減
少させるためである。光電流端子１ー１と近接する位置
とは通常はすぐ隣の位置を表すがこれより広がる場合も
ある。FIG. 1 is a side view showing a large number of terminals 1, 1-1, 1-2, 1-3 provided on a wiring board 10. Here, when the second terminal 1-2 having a potential different from that of the photocurrent terminal is arranged at a position close to the photocurrent terminal 1-1 through which the photocurrent flows, the photocurrent terminal 1-1 and the second terminal 1-2
That is, the third terminals 1-3 are interposed between and. This is because the gap between the terminals 1-1 and 1-2 is substantially widened to reduce the leak. The position close to the photocurrent terminal 1-1 usually means the position immediately adjacent to the photocurrent terminal 1-1, but it may be wider than this.

【００１３】これに対して、端子１ー１と１ー２の間に
光電流端子と同電位に印加した第３の端子１ー３を介在
させると、電流のリークは電圧の異なる端子１ー２と１
ー３の間で起こり、同電位の端子１ー１と１ー３の間で
は起こり難くなる。従って、同電位とは実質上リ−クが
生じ難くなる範囲を含むものである。また、第３の端子
１ー３を他の回路等から独立させ、かつ無電位とした場
合は、端子１ー１と１ー２の間隔が近接していないこ
と、さらに端子１ー３は他の回路またはアースと無関係
なので、塵埃等が堆積してもこれが直接的にリークと結
びつかない。On the other hand, when the third terminal 1-3 applied to the same electric potential as the photocurrent terminal is interposed between the terminals 1-1 and 1-2, current leakage is caused by the terminals 1-1-2 having different voltages. 2 and 1
-3, and it becomes difficult to occur between terminals 1-1 and 1-3 of the same potential. Therefore, the same electric potential includes a range in which leakage hardly occurs. When the third terminal 1-3 is independent of other circuits and has no potential, the terminals 1-1 and 1-2 are not close to each other, and the terminal 1-3 is not Since it has nothing to do with the circuit or the ground, even if dust or the like is accumulated, it is not directly connected to the leak.

【００１４】図２は、光電流端子１ー１と近接する位置
に光電流端子と異なる電位を有する第２の端子１ー２が
配置される場合、光電流端子１ー１の両側に光電流端子
１ー１と同電位に印加したガードピン２を設けた構成を
示す。この場合も電流のリークは電圧の異なる端子１ー
２とガードピン２の間で起こり、同電位の端子１ー１と
ガードピン２の間では起こり難くなる。FIG. 2 shows that when the second terminal 1-2 having a potential different from that of the photocurrent terminal is arranged at a position close to the photocurrent terminal 1-1, the photocurrent is provided on both sides of the photocurrent terminal 1-1. A configuration is shown in which a guard pin 2 applied to the same potential as the terminals 1-1 is provided. Also in this case, current leakage occurs between the terminals 1-2 and the guard pin 2 having different voltages, and is less likely to occur between the terminals 1-1 and the guard pin 2 having the same potential.

【００１５】図３は、光電流端子１ー１と近接する位置
に光電流端子と異なる電位を有する第２の端子１ー２が
配置される場合、光電流端子１ー１の周りにプラスチッ
ク等の絶縁体のパイプ３を被せて端子１ー１を端子１ー
２から電気的に遮断して光電流のリークを防止すること
ができる。In FIG. 3, when the second terminal 1-2 having a potential different from that of the photocurrent terminal is arranged in the vicinity of the photocurrent terminal 1-1, plastic or the like is provided around the photocurrent terminal 1-1. It is possible to prevent the leakage of the photocurrent by covering the terminal 1-1 with the insulating pipe 3 and electrically disconnecting the terminal 1-1 from the terminals 1-2.

【００１６】図４は、光電流が流れる金属配線４ー１の
近傍に光電流に重畳された電位と異なる電位を有する第
２の金属配線４ー２が配置される場合、金属配線４ー１
と第２の金属配線４ー２の間に光電流に重畳された電位
と同電位を印加した第３の金属配線４ー３を設けた構成
を示す。この場合も電流のリークは電位の異なる金属配
線４ー２と４ー３の間で起こり、同電位の金属配線４ー
１と４ー３の間では起こり難くなる。In FIG. 4, when the second metal wiring 4-2 having a potential different from the potential superimposed on the photocurrent is arranged near the metal wiring 4-1 through which the photocurrent flows, the metal wiring 4-1 is arranged.
The third metal wiring 4-3, to which the same potential as the potential superimposed on the photocurrent is applied, is provided between the second metal wiring 4-2 and the second metal wiring 4-2. Also in this case, current leakage occurs between the metal wirings 4-2 and 4-3 having different potentials, and it becomes difficult to occur between the metal wirings 4-1 and 4-3 having the same potential.

【００１７】図５は、光電流が流れる金属配線４ー１の
近傍に光電流に重畳された電位と異なる電位を有する第
２の金属配線４ー２が配置される場合、金属配線４ー１
の上に絶縁層５を設けた構成を示す。この場合も金属配
線４ー１を金属配線４ー２から電気的に遮断して光電流
のリークを防止することができる。勿論、スペース等の
都合により、金属配線４ー１と４ー２を絶縁層５で被う
こともある。In FIG. 5, when the second metal wiring 4-2 having a potential different from the potential superimposed on the photocurrent is arranged near the metal wiring 4-1 through which the photocurrent flows, the metal wiring 4-1 is arranged.
A structure in which an insulating layer 5 is provided on the above is shown. Also in this case, the metal wiring 4-1 can be electrically cut off from the metal wiring 4-2 to prevent leakage of photocurrent. Of course, the metal wirings 4-1 and 4-2 may be covered with the insulating layer 5 due to space limitations.

【００１８】[0018]

【発明の効果】以上説明したように、本発明に係わる光
受信装置は、端子間あるいは配線間の電流リークを減少
又は防止することができるので、光電流を正確にモニタ
することができる。As described above, the optical receiver according to the present invention can reduce or prevent current leakage between terminals or between wirings, so that the photocurrent can be accurately monitored.

【図面の簡単な説明】[Brief description of drawings]

【図１】本実施例に係わる端子の構成を示す側面図であ
る。FIG. 1 is a side view showing the configuration of a terminal according to this embodiment.

【図２】本実施例に係わる端子の他の構成を示す側面図
である。FIG. 2 is a side view showing another configuration of the terminal according to the present embodiment.

【図３】本実施例に係わる端子の別の構成を示す側面図
である。FIG. 3 is a side view showing another configuration of the terminal according to the present embodiment.

【図４】本実施例に係わる金属配線の構成を示す斜視図
である。FIG. 4 is a perspective view showing a configuration of metal wiring according to the present embodiment.

【図５】本実施例に係わる金属配線の構成を示す斜視図
である。FIG. 5 is a perspective view showing a configuration of metal wiring according to the present embodiment.

【図６】本実施例に係わる光受信装置の全体斜視図であ
る。FIG. 6 is an overall perspective view of the optical receiving device according to the present embodiment.

【図７】本実施例に係わる光受信装置の内部構造を示す
斜視図である。FIG. 7 is a perspective view showing the internal structure of the optical receiver according to the present embodiment.

【符号の説明】[Explanation of symbols]

１：端子 １ー１：光電流端子（第１端子） １ー２：第２端子 １ー３：第３端子 ２：ガードピン ３：絶縁パイプ ４：金属配線 ４ー１：光電流が流れる金属配線 ４ー２：第２の金属配線 ４ー３：第３の金属配線 ５：絶縁層 １０：配線板 １１：フォトダイオード １２：ＩＣ １３：コンデンサ １４：レンズ １５：ケース ２０：光ファイバ ２１：光コネクタ ２２：レンズホルダ 1: Terminal 1-1: Photocurrent terminal (first terminal) 1-2: Second terminal 1-3: Third terminal 2: Guard pin 3: Insulation pipe 4: Metal wiring 4-1: Metal wiring through which photocurrent flows 4-2: Second metal wiring 4-3: Third metal wiring 5: Insulating layer 10: Wiring board 11: Photodiode 12: IC 13: Capacitor 14: Lens 15: Case 20: Optical fiber 21: Optical connector 22: Lens holder

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 多数の端子を設けた配線板と、配線板上
には少なくとも電圧を印加した光電変換素子と光電流を
増幅する増幅回路ならびに金属配線を備えた光受信装置
であって、光電流が流れる光電流端子と近接する位置に
光電流端子と異なる電位を有する第２の端子が配置され
る場合、光電流端子と第２の端子との間に光電流端子と
同電位の端子を介在させたことを特徴とする光受信装
置。1. An optical receiver comprising a wiring board provided with a large number of terminals, a photoelectric conversion element to which at least a voltage is applied, an amplifier circuit for amplifying a photocurrent, and a metal wiring on the wiring board. When the second terminal having a potential different from that of the photocurrent terminal is arranged in a position close to the photocurrent terminal through which the current flows, a terminal having the same potential as the photocurrent terminal is provided between the photocurrent terminal and the second terminal. An optical receiving device characterized by being interposed. 【請求項２】 多数の端子を設けた配線板と、配線板上
には少なくとも電圧を印加した光電変換素子と光電流を
増幅する増幅回路ならびに金属配線を備えた光受信装置
であって、光電流が流れる光電流端子と近接する位置に
光電流端子と異なる電位を有する第２の端子が配置され
る場合、光電流端子と第２の端子との間に他の回路から
独立させ、かつ無電位である端子を介在させたことを特
徴とする光受信装置。2. An optical receiver comprising a wiring board having a large number of terminals, a photoelectric conversion element to which at least a voltage is applied, an amplifier circuit for amplifying a photocurrent, and a metal wiring on the wiring board. When the second terminal having a potential different from that of the photocurrent terminal is arranged in the vicinity of the photocurrent terminal through which the current flows, the photocurrent terminal and the second terminal are independent from other circuits and An optical receiving device characterized in that an electric potential terminal is interposed. 【請求項３】 多数の端子を設けた配線板と、配線板上
には少なくとも電圧を印加した光電変換素子と光電流を
増幅する増幅回路ならびに金属配線を備えた光受信装置
であって、光電流が流れる光電流端子と近接する位置に
光電流端子と異なる電位を有する第２の端子が配置され
る場合、光電流端子の周りに光電流端子と同電位のガー
ドピンを設けたことを特徴とする光受信装置。3. An optical receiver comprising a wiring board having a large number of terminals, a photoelectric conversion element to which at least a voltage is applied, an amplifier circuit for amplifying a photocurrent, and a metal wiring on the wiring board. When the second terminal having a potential different from that of the photocurrent terminal is arranged in a position close to the photocurrent terminal through which the current flows, a guard pin having the same potential as the photocurrent terminal is provided around the photocurrent terminal. Optical receiving device. 【請求項４】 多数の端子を設けた配線板と、配線板上
には少なくとも電圧を印加した光電変換素子と光電流を
増幅する増幅回路ならびに金属配線を備えた光受信装置
であって、光電流が流れる光電流端子と近接する位置に
光電流端子と異なる電位を有する第２の端子が配置され
る場合、光電流端子の周りに絶縁体からなるパイプを設
けたことを特徴とする光受信装置。4. An optical receiving device comprising a wiring board having a large number of terminals, a photoelectric conversion element to which at least a voltage is applied, an amplifier circuit for amplifying photocurrent, and a metal wiring on the wiring board. When the second terminal having a potential different from that of the photocurrent terminal is arranged in the vicinity of the photocurrent terminal through which the current flows, a pipe made of an insulator is provided around the photocurrent terminal. apparatus. 【請求項５】 多数の端子を設けた配線板と、配線板上
には少なくとも電圧を印加した光電変換素子と光電流を
増幅する増幅回路ならびに金属配線を備えた光受信装置
であって、光電流が流れる金属配線の近傍に光電流に重
畳された電位と異なる電位を有する第２の金属配線が配
置される場合、光電流が流れる金属配線と第２の金属配
線の間に光電流に重畳された電位と同電位を印加した第
３の金属配線を設けたことを特徴とする光受信装置。5. An optical receiving device comprising a wiring board having a large number of terminals, a photoelectric conversion element to which at least a voltage is applied, an amplifier circuit for amplifying photocurrent, and a metal wiring on the wiring board. When a second metal wiring having a potential different from the potential superimposed on the photocurrent is arranged in the vicinity of the metal wiring through which the current flows, the photocurrent is superimposed between the metal wiring through which the photocurrent flows and the second metal wiring. An optical receiving device characterized in that a third metal wiring to which the same potential as the applied potential is applied is provided. 【請求項６】 多数の端子を設けた配線板と、配線板上
には少なくとも電圧を印加した光電変換素子と光電流を
増幅する増幅回路ならびに金属配線を備えた光受信装置
であって、光電流が流れる金属配線の近傍に光電流に重
畳された電位と異なる電位を有する第２の金属配線が配
置される場合、光電流が流れる金属配線上には絶縁層を
設けたことを特徴とする光受信装置。6. A light receiving device comprising a wiring board having a large number of terminals, a photoelectric conversion element to which at least a voltage is applied, an amplifier circuit for amplifying photocurrent, and a metal wiring on the wiring board. When the second metal wiring having a potential different from the potential superimposed on the photocurrent is arranged near the metal wiring through which the current flows, an insulating layer is provided on the metal wiring through which the photocurrent flows. Optical receiver.
JP6322241A 1994-12-26 1994-12-26 Optical receiver Pending JPH08181338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6322241A JPH08181338A (en) 1994-12-26 1994-12-26 Optical receiver

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6322241A JPH08181338A (en) 1994-12-26 1994-12-26 Optical receiver

Publications (1)

Publication Number Publication Date
JPH08181338A true JPH08181338A (en) 1996-07-12

Family

ID=18141495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6322241A Pending JPH08181338A (en) 1994-12-26 1994-12-26 Optical receiver

Country Status (1)

Country Link
JP (1) JPH08181338A (en)

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