JPS5924758U - スパツタリング装置 - Google Patents

スパツタリング装置

Info

Publication number
JPS5924758U
JPS5924758U JP11867182U JP11867182U JPS5924758U JP S5924758 U JPS5924758 U JP S5924758U JP 11867182 U JP11867182 U JP 11867182U JP 11867182 U JP11867182 U JP 11867182U JP S5924758 U JPS5924758 U JP S5924758U
Authority
JP
Japan
Prior art keywords
forming element
container forming
plated
sputtering apparatus
selectively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11867182U
Other languages
English (en)
Japanese (ja)
Other versions
JPS621228Y2 (enExample
Inventor
潮田　友四郎
Original Assignee
株式会社徳田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社徳田製作所 filed Critical 株式会社徳田製作所
Priority to JP11867182U priority Critical patent/JPS5924758U/ja
Publication of JPS5924758U publication Critical patent/JPS5924758U/ja
Application granted granted Critical
Publication of JPS621228Y2 publication Critical patent/JPS621228Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP11867182U 1982-08-04 1982-08-04 スパツタリング装置 Granted JPS5924758U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11867182U JPS5924758U (ja) 1982-08-04 1982-08-04 スパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11867182U JPS5924758U (ja) 1982-08-04 1982-08-04 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS5924758U true JPS5924758U (ja) 1984-02-16
JPS621228Y2 JPS621228Y2 (enExample) 1987-01-13

Family

ID=30272665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11867182U Granted JPS5924758U (ja) 1982-08-04 1982-08-04 スパツタリング装置

Country Status (1)

Country Link
JP (1) JPS5924758U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102918622A (zh) * 2010-05-11 2013-02-06 应用材料公司 用于物理气相沉积的腔室

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102918622A (zh) * 2010-05-11 2013-02-06 应用材料公司 用于物理气相沉积的腔室
JP2013530308A (ja) * 2010-05-11 2013-07-25 アプライド マテリアルズ インコーポレイテッド 物理的気相堆積用のチャンバ
JP2016148106A (ja) * 2010-05-11 2016-08-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 物理的気相堆積用のチャンバ
EP2709138B1 (en) * 2010-05-11 2016-11-30 Applied Materials, Inc. Chamber for physical vapor deposition

Also Published As

Publication number Publication date
JPS621228Y2 (enExample) 1987-01-13

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