JPS5923600A - Electronic part supply device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Recent industrial applications include mini mold (trade name of NEC Corporation)
Chip components with legs, called ``chip components'', have come into use. These chip parts with legs make up transistors and diodes.

For example, as shown in FIG. 1, a plurality of plate-shaped leads (2a), (2b), and (2c) are made to protrude from the side wall surface of a rectangular parallelepiped main body (1).

This chip component with legs is used when it is desired to effectively use the dead space of an insertion component. It is also used as a component for sub-boards of hybrid (hybrid) ICs.

That is, as shown in FIG. 2, when the insertion component (4) is mounted on the printed circuit board (3), the chip component (5) with legs is mounted on the back side thereof. The chip component (5) with legs is mounted by temporarily fixing it with cream solder, for example, and then dipping it. Also, in Figure 3 (6)
indicates a ceramic sub-board of a hybrid IC,
Cream solder (6) is applied to this sub-board (6) as described above.
In step a), the chip component with legs (5) is mounted. This chip component with legs (5) is reliably fixed in a subsequent heating process. According to the present invention, for example, a chip component with legs called a mini mold is supplied to a mount head.

The present invention relates to an electronic component supply device that allows automatic mounting later.

BACKGROUND TECHNOLOGY AND PROBLEMS There has been a growing demand for automatic mounting of electronic components in recent years. In response to these demands, small electronic parts called leadless components, such as square or cylindrical resistors, capacitors, transistors, diodes, etc., have come to be automatically mounted. These automatic mounting machines for leadless components are broadly classified into simultaneous type and sequential type.

Further, the following sequential formulas have been proposed.

■ The pre-taped components are transported as they are to the head position, then the cover tape is removed and the components inside are suctioned and mounted.

■ Separate the taped parts one by one from the tape and arrange them in any order on the transport jig.

Thereafter, the transport jig is guided to the position of the head.

■ Stock individual parts in multiple parts feeders, pick up the parts in the parts feeders by suction using the same number of suction heads, arrange them in any order on a transport jig, and then remove them from the transport jig. is used to transport it to the head position.

■ Each part is stocked in a plurality of parts feeders, and the parts feeder is moved to the head position, and the parts in the parts feeder are directly suction-mounted using the mount head.

■ Parts are loaded into prismatic magazines in advance, and these magazines are mounted on a rotatable cylindrical jig. The cylindrical jig is rotated to the desired angular position, and then the lid of the jig is opened and the mounting head picks up and mounts the components inside the magazine.

■ Components are arranged in a line in advance in a linear magazine with the top open, the components are sent to the forward end by vibration, and the sent components are picked up and mounted as a set.

■ Parts taken out one by one from a parts feeder etc. are fed into a transport tube with a rectangular cross section, and a plurality of parts with the same shape but different constants are transported in an arbitrary order to the position of the mount head.

In the above parts supply system, ■, ■, ■, ■
In the system (2), it is usually necessary to drive the tape, etc. in the direction in which the tape is lined up on the Z-axis, for example, in the system (2), to feed the necessary parts to the head position. For this reason, when the number of products to be mounted increases, there is a drawback that it takes time to send parts randomly. In the system of ■ and ■, if you try to arrange the parts in any order on the transport jig, more parts than the supplied types will be lined up between the two parts supply parts and the mount head, and if the mounting on the board fails, it will be repeated again. It becomes difficult to supply the same parts immediately. In other words, recovery becomes impossible. The system (2) does not have the above-mentioned disadvantages because the parts are transported one by one using a transport pipe. However, with this system, the applicable components are limited to leadless components and cannot be applied to chip components with legs, which is the object of the present invention.

As described above, at present, an electronic component supply apparatus that is optimal for supplying a so-called mini-mold chip component with legs to a mount head has not been realized.

For example, when mounting chip components with legs, the following methods have been proposed. In FIG. 4, (forces) indicate magazines filled with footed chip parts, and bases (8) are provided around these magazines (forces). A movable part (9) is attached to move in the Y-axis direction, and another movable part (I(ll) is attached to move in the Y-axis direction with respect to this movable part (9). ) is attached to the mount head 0υ (12+). Movable part (9),
By the reciprocating motion of (10), a chip component with legs is sucked and taken out from a desired magazine (7), and then mounted on a board. In this system, the reciprocating movement of the movable part (9) αO) takes time, making high-speed mounting impossible.

As described above, under the present circumstances, no method has been proposed that can supply the footed depth parts to the mount head at high speed and in an arbitrary order.

Purpose of the Invention The present invention was made in consideration of the above circumstances, and an object of the present invention is to provide an electronic component supply device that can supply chip components with legs to a mount head at high speed and in an arbitrary order. .

Summary of the Invention In order to achieve the above-mentioned objects, this invention feeds a chip component with legs from a magazine to a sub-track by suction, uses this sub-track to transport the chip component with legs to a merging section, and at this juncture. Any electronic component carried from each subtruck is transferred to a main truck, and chip components with legs are supplied to the mount head via this main truck. In this invention, the sub-track and the main track can transport the chip parts with legs to the mount-rad at high speed. Moreover, by switching the merging portions, the chip components with legs can be mounted in any order.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings from FIG. 5 onwards.

FIG. 5 shows the main parts of the electronic component supply apparatus of this embodiment as a whole, and FIG. 6 shows a part thereof in detail. In these Figures 5 and 6, the electronic component supplying device of one example is roughly divided into a magazine storage section +21), a main body block @, a sub-track (C), a rotary plate 04), and a main track (29, etc.). A plurality of sets are formed for each of these tracks except for the main track (C).

Briefly speaking, Tsuga 2 F0 phrase is taken out from the magazine storage CD, and the chip parts with legs @ (see Figure 7) in this magazine are inserted into the main body block (23) and the sub-tracks (23) one by one. The chip parts with legs (27) thus transferred are transferred to the sub-track (c) and the one-turn plate (24).
) and to the main truck) through the mounting head (2
8) It is conveyed to the position.

A plurality of sets of magazine storage units υ are prepared (only one is shown in the figure). Magazines t2e with cases are stacked and stored in these storage units (20).

One storage section (21) stores a magazine (26) of chip components with legs of the same standard. 1
Store the standard magazine Q6) in the two storage compartments (21).

By storing magazine blanks of different standards in the other storage section (21), it is possible to sequentially mount a plurality of types of chip components with legs. This will be understood later.

As shown in FIG. 7, the magazine body (26a) is filled with legged chip parts (27). This magazine body (
%aC has a plurality of notches (26b) in addition to the central groove (26b).
6C) (26d) are formed, and these notches (26c)
(26d) is a chip component with legs (2-force lead (27)
8) can be placed. The magazine body (26a) f filled with the legged chip parts Qη is covered by a rectangular cylindrical case (26e). In this way, a magazine with a case eO is formed.

Such a magazine storage section Cυ is provided with a slide plate (2) and an extrusion rod (3i. In this case.

The slide plate (2) slides the lowermost magazine with case (26) as shown in Fig. 8. In this state, the magazine with case Q0 is moved using the specified parts of the main body block (24, which will be described in detail later). The case (26e) is locked.Then, the push rod 13(1) is pushed out as shown by the arrow, and the magazine body (26a) is pushed out.
) is sent to the subsequent main body block 021.

The number of main body blocks (2 units) corresponds to the magazine storage section (21) mentioned above.
At 23, the magazine body (26a) is pitch-fed.

In synchronization with this, the chip component (27) with legs in the magazine body (26a) is sent out to the sub-track (2) side.

These main body blocks (2) are provided with a feeding mechanism (3I), a nozzle device (33), a feeding rod (c), etc.

The feeder 'J/yIIOυ (see Figure 5) is equipped with two feed claws (31a) and (31b).
a) and (31b) are engaged with the notch (26d) of the magazine main body (26a), thereby pitch feeding is performed by a distance corresponding to one chip component with legs (2η).Nozzle device G Then, the nozzle (32a) sucks the upper part of the chip component Q with two legs, and the chip component C2 with two legs is removed.
7) can be taken out, and this nozzle device is reciprocated as shown by the arrow by a cam 04) and a lever 0ω. That is, the nozzle device (371) is engaged with one end of the hook-shaped lever (c), and the cam C (4) is engaged with the side wall of the lever 0. The cam t34. When rotated, the lever G51 swings as shown by the arrow. And this allows the nozzle device (
321 moves back and forth. Note that 06) indicates a compression coil spring, and C37) indicates a tension coil spring.

One end of the delivery rod (c) is engaged with the other drive end of the other lever C35), and this delivery rod (to) is connected to the sixth
It moves back and forth as shown by the arrow in the figure.

This delivery rod 03) transfers the footed chip component (27) sucked by the nozzle (32a) to the sub-truck (2) in the latter stage.
).

That is, as shown in FIG. 9A, the nozzle (32a) is initially retracted upward. As the cam 014) (FIG. 6) rotates, the delivery rod 0J retreats to the left side in FIG. 9, and at the same time, the nozzle (32a) descends toward the chip component 07) (FIG. 9B). The chip component 07) with legs is attracted by the nozzle (32a) that has descended in this way, and then the nozzle (32a) moves upward (FIG. 9C). In this case, the earth wall part (22) formed by the frame of the main block (22)
When the nozzle (32a) rises beyond the point a), the chip component 07) moves to the soil wall part (2) based on the suction of the nozzle (32a).
2a) becomes adsorbed. After this, the delivery rod 0 will move to the right side of the figure, and its base (33a
A chip component (27) is placed on the chip (27) and sent out to the subsequent sub-track (c) (FIG. 9D).

The sub-track (c) is connected to the final stage of the main block (221), and its cross-sectional shape corresponds to the chip component with legs (27) as shown in FIG. 10. Details will be explained later. The main track (25) to be described also has the same shape.

The sending end of the sub-track (231) is coupled to the rotary disk Q4. These rotary disks (24I are of course provided in the same number as the magazine storage section eυ.These rotary disks 0
4) is rotatably attached to the substrate (to). It can be rotated by 90 degrees by driving the motor C3e. Transmission of rotation from the end of the motor is controlled by a clutch, allowing the rotary disk (24) to rotate at any angle. The turntable e4) has a channel section (
24a) and a recess (24b) located at an angular position 90 degrees away from this
) (24c) are formed. This recess (24b)
(24C) are communicated by a tunnel (not shown).

Normally, the rotary disk 124) is in the state shown by ■, and the chip component (27) conveyed on the sub-track c23) is stopped in the recess (24b). When the rotary disk (24) on which the chip component eη is stopped in this way is rotated to the angular position indicated by @, the channel (24) of the rotary disk (goods)
Air is blown so as to pass through the recess (24).
The chip component (27) placed on the main truck (25) will be transported on the main truck (25). This rotary disk allows various chip components to be transferred to the main truck in any order. This will be understood later.

The main track (25) also has a shape as shown in FIG. 10, similar to the sub-track (c). A rotary disk (40) is provided at the transfer end of this main track (2).

This rotary disk (40 has a recess (40) at an angle position of 180 degrees
a), (40b) are formed, and these recesses (40a)
, (40b) are connected by a channel (not shown). The chip component (5) transferred on the main truck (c) first stops at the fourth section (40a), and then the rotary plate rotates 180 degrees to place this chip component 07) below the mount head (to). Place it on. Then, the mount head (mark 2 descends and picks up the chip component C27). The chip component (27) is finely adjusted to the correct position by the positioning claw G11).

Next, the operation of this embodiment will be explained. Since the operation of each part has already been explained, detailed explanation thereof will not be repeated.

First, the nozzle device C3 of the main body block (2'jJ) corresponding to the chip component (27) of the required standard is driven to transfer the required chip component to the corresponding sub-track. The corresponding nozzle device 032+ is driven so that the chip parts (27) are replenished to the parts (rotary disk C24 whose 2θ is empty).For example, the chip parts (27) of A, B, and C standards are refilled. are 2 each
, 3, or 4, the corresponding 9 body blocks (
The two-function nozzle device (3) is driven and the desired chip component Cη is transferred to the corresponding sub-track (C). Then, the empty rotary disk (24) is replenished. The chip parts 0'7) that have been transferred are made to wait in the recesses (24b) of the rotary disk C24). After this, the corresponding rotary disks (24) are driven to rotate according to the order of the chip components (27I) to be mounted.For example, the third, second, and first rotary disks C2 from the front in FIG.
4) If you want to mount the waiting chip components on the rotary disk (2) in order, the third, second, and first chip components
) to rotate. In this case, if the rotary disk C24) is alternatively set to the state indicated by @, the chip component (27) will be transferred to the position of the mount head (28) without staying in the recess (24c) of the rear rotary disk C24). be done. In this way, each chip component C77) is transported along the main truck (b) in the order in which it is mounted.

゛Main truck (chip parts transferred from 2nd grade)
As mentioned above, 27I is a rotary disk (400 recess (40a)
The device is placed on standby and moved to the mounting position using this turntable (40) during mounting. The mount head marked C repeats mounting each time the chip component 07) is transferred, and it is possible to mount a predetermined chip component (27) at a predetermined position.

In this example, the rotary disk is driven to the position shown by @ in FIG. 5, and the chip component 0'? ) is transferred to the main truck (25), the rotary disk (24) is immediately driven to the state shown by ■. In this case, the angular position is 18 from the original state.
It is rotated 0 degrees. That is, the recesses (24b) and (24c
) are in the opposite position. For this reason, the chip parts (21) remain even after being transferred to the recess (24b) of the rotary disk (241).

Even if foreign matter remains, the air that will be sent for later replenishment of the chip component 07) will pass through the tunnel, allowing the unnecessary chip component 07) and foreign matter to be discharged. This also applies to the turntable (40) at the end of the main track 05). Preferably, the end of the sub-track I23 and the main track (c) should not be opened to atmospheric pressure (such as connected to a vacuum generator). In this way, active discharge becomes possible.

Furthermore, as described above, since the chip component 07) is replenished immediately after being transferred, even if the chip component (27) is not transferred to the mount head (to) for some reason, it is immediately transferred again. This can save you 2 hours. Also, in this example, the sub-track (c), turntable G! 4) and the main track Q→ are arranged on the same plane, and by providing a transparent plate (4) on the top, the transfer status of the chip component (5) can be determined at a glance, which is extremely effective. There is.

Effects of the Invention According to the present invention, the chip parts with legs loaded in the magazine are sent to the sub-track by suction. Therefore, the chip components can be reliably transferred to the sub-track without disrupting the spatial arrangement of the chip components with legs. Thereafter, the chip components can be transported to the mount head at high speed via the sub-track, rotary disk, and main track. Furthermore, since any parts can be transferred in a predetermined order using a rotary disk, it is extremely flexible.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a chip component with legs according to the present invention, FIGS. 2 and 3 are sectional views for explaining the chip component with legs shown in FIG. 1, and FIG. 4 is a schematic diagram showing a conventional example. Figure, 5th
The figure is a perspective view showing the main parts of one embodiment of the present invention as a whole, FIG. 6 is a perspective view showing a part of the embodiment shown in FIG. 5 on an enlarged scale,
FIG. 7 is an enlarged perspective view of the magazine body (26a) in FIG. 5, FIG. 8 is a sectional view for explaining the slide plate C29) in FIG. Rod (2)
10 is a cross-sectional view for explaining the sub-track (
FIG. 3 is a sectional view for explaining c). 01) is the magazine storage section, Q-bama sub-track, 04)
(2 are the main tracks, e6) is the magazine, (2 are the chip parts with legs 2, C is the mount head, and 0 is the nozzle device.) Matsukuma Hide Mori 471' No. Figure 7 2cc Figure 8 Figure 10 Figure 9

Claims (1)

[Claims] In an electronic component supply device that takes a chip component with legs loaded in a magazine out of the magazine and then guides it to a mount head, the electronic component supply device includes a plurality of magazine storage parts,
A plurality of sub-tracks are provided for each of these magazine storage sections and transport the chip components using compressed air, and a plurality of sub-tracks are provided for taking out the chip components from the magazine storage section by suction and sending them to the corresponding sub-tracks. a main track that is connected to the mount head and transfers the chip components to the mount head using compressed air; and a main track that is provided for each sub-track and transfers the chip components that have been transferred through the sub-tracks to the main track. An electronic component supply device characterized by having a merging section for merging with the .