WO2022157856A1

WO2022157856A1 - Component mounting machine

Info

Publication number: WO2022157856A1
Application number: PCT/JP2021/001859
Authority: WO
Inventors: 誠次柴田
Original assignee: 株式会社Fuji
Priority date: 2021-01-20
Filing date: 2021-01-20
Publication date: 2022-07-28
Also published as: JPWO2022157856A1; CN116803225A

Abstract

This component mounting machine includes a substrate conveying unit, a component supply unit, a component mounting unit, and a control unit. A plurality of trays provided in the component supply unit are each movable between a storage position and a component removal position. The component mounting unit sucks a component out from the tray moved to the component removal position and mounts the component on a substrate at a component installation position. The control unit controls the substrate conveying unit, the component supply unit, and the component mounting unit. The control unit alternately executes first mounting processing and second mounting processing on a plurality of substrates conveyed to the component installation position. In the first mounting processing, the components housed in the trays are mounted on the substrate in ascending order from the first stage tray to the nth stage tray. In the second mounting processing, the components housed in the trays are mounted on the substrate in descending order from the nth stage tray to the first stage tray.

Description

Mounting machine

This specification relates to a component mounter that mounts components on a board.

A component mounter that mounts components on a board may use a tray-type component supply unit. An example of a component mounter having a tray-type component supply unit is disclosed in Japanese Patent Application Laid-Open No. 2001-85889. A tray-type component supply unit includes a plurality of trays for storing components and a stocker for storing the plurality of trays. Each of the plurality of trays accommodates components of the same type inside and is movable between a storage position and a component extraction position. When mounting a component on a board, first, the board transport unit carries the board into the component mounting position in the mounting machine. Then, the tray containing the type of component to be mounted first (hereinafter sometimes referred to as the first tray) moves vertically in the stocker to the storage position, and then moves from the storage position to the component extraction position. pulled out to Next, the component mounting unit picks up the component from the tray pulled out to the component pickup position, and mounts the picked component on the board. When the component is mounted on the board, the first tray pulled out to the component pick-up position moves to the storage position. Next, the tray containing the second type of component to be mounted (hereinafter sometimes referred to as the second tray) moves vertically in the stocker to the storage position, and then moves from the storage position to the component extraction position. pulled out to When the second tray is pulled out to the component picking position, the second type of component is mounted on the board by the component mounting unit in the same manner as the first type of component. Following the same procedure, the components up to the type to be mounted last are mounted on the board. After all the components are mounted, the board transfer unit carries the board out of the component mounter from the component mounting position.

As described above, in this type of component mounter, after the production of a board is finished, before the production of the next board is started, a tray containing the last type of component to be mounted (hereinafter referred to as the last tray) is used. ) must be stored in the storage position, and the first tray must be moved to the storage position and pulled out from the storage position to the component extraction position. Generally, the stocker stores the first tray to the last tray in the order of mounting. Therefore, the distance that the first tray moves in the stocker becomes long from the state where the last tray is stored in the storage position to the state where the first tray is moved to the storage position. As a result, it takes time until the first tray is pulled out to the component pick-up position, and the component mounting unit may have to wait.

This specification discloses a technique for suppressing waiting time in the component mounting unit when starting production of the next board after the production of the board is finished.

The component mounter disclosed in this specification is a component mounter that mounts components on a board, and includes a board transfer unit, a component supply unit, a component mounting unit, and a control unit. The board transport unit carries the board into the component mounting position and unloads the board from the component mounting position. The component supply unit includes a tray magazine having a plurality of trays for storing components, and each of the plurality of trays is configured to be movable between a storage position and a component extraction position. The component mounting unit sucks the component from the tray moved to the component picking position in a state where the tray moves from the storage position to the component picking position, and mounts the sucked component on the board carried to the component mounting position. The control unit controls the board transfer unit, the component supply unit and the component mounting unit. The control unit is configured to alternately perform the first mounting process and the second mounting process on the plurality of boards carried into the component mounting position. Here, in the first mounting process, the components accommodated in each of the first to n-th trays (n is an integer equal to or greater than 2) of the tray magazine are mounted on the board, and The components accommodated in each tray are mounted on the board in ascending order from the tray to the n-th tray. In the second mounting process, the components accommodated in the first to n-th trays of the tray magazine to which the components were supplied in the first mounting process are mounted on the board, and the components are mounted on the board from the n-th tray. Components accommodated in each tray are mounted on the board in descending order up to the first tray. Alternately executing the first mounting process and the second mounting process means that once the first mounting process is executed, the second mounting process is executed before the next first mounting process is executed. Similarly, when the second mounting process is performed, it means that the first mounting process is performed before the next second mounting process is performed. Therefore, the first mounting process and the second mounting process do not need to be alternately and continuously performed, and another mounting process may be performed between the first mounting process and the next second mounting process. Another mounting process may be performed between the second mounting process and the next first mounting process.

1 is a side view schematically showing the configuration of a component mounter of an embodiment; FIG. FIG. 2 is a block diagram showing the configuration of the control system of the component mounter of the embodiment; FIG. 4 is a schematic diagram for comparing and explaining procedures for mounting components on a substrate by component mounters of the embodiment and the conventional example; FIG. 4 is a schematic diagram for comparing and explaining procedures for mounting components on a substrate by component mounters of the embodiment and the conventional example; FIG. 4 is a diagram schematically showing the configuration of a component supply unit provided with two tray magazines; FIG. 6 is a schematic diagram illustrating a procedure for mounting components supplied from the component supply unit shown in FIG. 5 on a board;

In the component mounter disclosed in this specification, the first mounting process and the second mounting process are alternately performed on a plurality of boards brought into the component mounting position. Therefore, for example, when the first mounting process is executed for the first board, the second mounting process is executed for the second board. are executed alternately. Therefore, the production of the next board can be started without replacing the tray pulled out to the component pick-up position when the production of the board is finished. Therefore, it is possible to prevent the component mounting unit from standing by when the production of the next board is started after the production of the board is finished.

Further, in the component mounter disclosed in this specification, by arranging the first tray to the n-th tray in order, the immediately preceding tray can be placed in both the first mounting process and the second mounting process. The switching time from one tray to the next tray can be shortened, and the occurrence of standby time in the component mounting unit can be suppressed.

In the component mounter disclosed in this specification, an input unit for inputting a first mounting program for causing the control unit to execute the first mounting process; It may further include an arithmetic unit that generates a second implementation program for causing the control unit to execute the second implementation process based on the first implementation program. According to such a configuration, when the first implementation program is input, the second implementation program is automatically generated. Therefore, it is not necessary for the worker to perform the task of generating the second mounting program.

In the component mounter disclosed in this specification, the first mounting process may include a specific first mounting process of mounting two or more specific components at the same position on the board. The order of mounting the two or more specific components on the board may be set in advance. In this case, when a first implementation program for causing the control unit to execute a specific first implementation process is input to the input unit, the arithmetic unit performs a second implementation process corresponding to the specific first implementation process. It may output that the second implementation program to be executed by the control unit cannot be generated. 2. Description of the Related Art Some boards manufactured by a component mounter have a plurality of components mounted at the same position on the board, and the mounting order of these components is set in advance. For example, electronic components are mounted on a substrate, and a shield cover is attached to the substrate so as to cover the electronic components. In such a case, the electronic components are always mounted first, and then the shield cover is mounted. In the case of the first mounting process (that is, the specific first mounting process) including such a process, simply reversing the mounting order on the board cannot produce the board. In the component mounter described above, when the first mounting program for executing the specific first mounting process is input to the input unit, the arithmetic unit executes the second mounting process corresponding to the specific first mounting process. It determines that the second implementation program cannot be generated, and outputs that the second implementation program cannot be generated. This can prevent erroneous automatic execution of the second mounting process corresponding to the specific first mounting process.

A component mounter 10 according to an embodiment will be described below with reference to the drawings. The component mounter 10 is a device for mounting a predetermined component 4 at a predetermined position on the board 2 . The component mounter 10 is also called a surface mounter, a chip mounter, or the like. The component mounter 10 is installed side by side with a solder printer, other component mounters and board inspection machines to form a series of mounting lines. As shown in FIG. 1, the component mounter 10 includes a board transfer unit 20, a component supply unit 30, a component mounting unit 40, and a control device 50. As shown in FIG.

The board transport unit 20 moves the board 2 supplied to the loading port of the component mounter 10 in the X direction (perpendicular to the paper surface of FIG. 1) and carries it into the component mounting position P3. Further, the board transfer unit 20 unloads the board 2 on which components have been mounted from the component mounting position P<b>3 and moves it to the unloading port of the component mounter 10 . The component-mounted board 2 sent to the carry-out port is shipped as a final product, or sent to a post-process as a semi-finished product. A conventionally known configuration can be adopted as the substrate transport unit 20 . For example, a unit including a pair of belt conveyors and a substrate holding section that is attached to the belt conveyors and supports the substrate 2 from below may be employed, but is not limited to this.

The component supply unit 30 is a so-called tray feeder (tray-type component supply unit). The parts supply unit 30 comprises a housing 32 with a tray station 38 extending from one side thereof. The upper surface side area of the tray station 38 and the internal space of the housing 32 communicate with each other through an opening 36 provided in the housing 32 . The housing 32 includes a plurality of trays TR (TR1, TR2, TR3, . A plurality of stages of slots 35 are formed in the stocker 34 . Each slot 35 accommodates one tray TR horizontally. A plurality of trays TR contain the same type of components CH (CH1, CH2, CH3, . . . ) inside. For example, the first tray TR1 is the first type of component CH (CH1) to be loaded, the second tray TR2 is the second type of component CH (CH2) to be loaded, and the third tray TR3 is the third to be loaded. The n-th tray TRn accommodates the component CH (CH3) of the type to be mounted, and the component CH of the type to be mounted n-th.

Each of the plurality of trays TR in the component supply unit 30 is movable between the storage position P1 and the component extraction position P2. The storage position P1 is set at a height position where the opening 36 is located in the internal space of the housing 32 . The component pick-up position P2 is set in the upper surface side area of the tray station 38 . The component supply unit 30 includes a tray transfer device (not shown) that moves the tray TR in the horizontal direction (Y direction in FIG. 1) between the storage position P1 and the component extraction position P2. The component supply unit 30 also has a lifting device (not shown) that moves the stocker 34 in the vertical direction (the Z direction in FIG. 1). The lifting device vertically moves the slot 35 accommodating the tray TR in the stocker 34 to the storage position P1 so that one specific tray TR in the stocker 34 can be pulled out. In the case of the component supply unit 30 shown in FIG. 1, both the housing 32 and the tray station 38 are arranged inside the component mounter 10, but only the tray station 38 is arranged inside and the housing 32 is arranged outside. may be placed.

The component mounting unit 40 picks up the component CH from the tray TR moved to the component extraction position P2 while the tray TR is moved from the storage position P1 to the component extraction position P2. Then, the component mounting unit 40 mounts the sucked component CH on the board 2 carried into the component mounting position P3. The component mounting unit 40 includes a moving device 42, a head unit 44, a suction nozzle 46, and the like. The moving device 42 moves the head unit 44 in the X direction and the Y direction. The moving device 42 includes a guide rail for guiding the head unit 44, a moving mechanism for moving the head unit 44 along the guide rail, a motor for driving the moving mechanism, and the like. The moving device 42 is arranged above the component supply unit 30 and the board 2 . The head unit 44 moves in the space above the component supply unit 30 and the substrate 2 by the moving device 42 . The head unit 44 is capable of mounting a suction nozzle 46 having a shape and size corresponding to the type of the component CH, and moves the mounted suction nozzle 46 in the Z direction. The suction nozzle 46 sucks the component CH at its tip and releases the component CH at a predetermined position on the substrate 2 .

FIG. 2 shows the configuration of the control system of the component mounter 10 of the embodiment. The control device 50 is configured using a computer having a CPU, ROM, and RAM. The control device 50 is communicably connected to the board transfer unit 20, the component supply unit 30, the component mounting unit 40, the touch panel 54 (shown in FIG. 1), and the transmission/reception circuit 58. FIG. The touch panel 54 is a display device that provides various types of information about the mounter 10 to the operator, and is an input device that receives instructions and information from the operator. The transmitting/receiving circuit 58 is communicably connected to a production control computer 52 (illustrated in FIG. 1) that controls the mounter 10 . The transmission/reception circuit 58 functions as an input/output interface interposed between the production control computer 52 and the controller 50 . The transmission/reception circuit 58 receives the production program sent from the production control computer 52 and loads it into the controller 50 . The captured production program is stored in the RAM of the controller 50 and read from there as needed. The number of component mounters 10 managed by the production management computer 52 is usually plural, and the number is not particularly limited.

The control device 50 mounts the component CH on the board 2 by controlling the operation of each part of the component mounter 10 based on the production program. That is, the control device 50 functions as a control unit that controls the board transfer unit 20, the component supply unit 30, the component mounting unit 40, and the like.

Next, the component mounting process executed by the control device 50 will be described. The control device 50 is configured to alternately perform a first mounting process and a second mounting process on a plurality of boards 2 carried into the component mounting position P3.

The first implementation process is executed based on the first implementation program. The first mounting process is a process of mounting, on the substrate 2, the components CH accommodated in the trays TR of the first stage to the nth stage (n is an integer equal to or greater than 2). In the first mounting process, the components CH accommodated in each tray TR are mounted on the substrate 2 in ascending order from the first tray TR1 to the n-th tray TRn. The first mounting program is a kind of production program sent from the production management computer 52, and is a program for causing the control unit to execute the first mounting process. The first implementation program is taken into the controller 50 via the transmission/reception circuit 58, which is an input unit. The control device 50 functioning as a control unit reads the first mounting program from the RAM and executes the first mounting process based on the first mounting program.

The second implementation process is executed based on the second implementation program. The second mounting process is a process of mounting on the board 2 the components CH accommodated in the first to n-th trays TR. In the second mounting process, the components CH accommodated in each tray TR are mounted on the substrate 2 in descending order from the nth tray TRn to the first tray TR1. The second mounting program is a program for causing the control unit to execute the second mounting process, but is not included in the production program sent from the production control computer 52 . When the first implementation program is input to the control device 50 from the transmission/reception circuit 58, which is an input unit, the control device 50, which also functions as an arithmetic unit, generates the second implementation program based on the input first implementation program. do. The generated second mounting program is stored in the RAM of the control device 50, like the first mounting program.

A specific example of component mounting processing by the component mounter 10 of this embodiment will be described below with reference to FIGS. 3 and 4. FIG. In this example, it is assumed that two or more specific parts (for example, a part and a cover that covers the part) are not mounted at the same position on the substrate 2 . Therefore, the first mounting process does not include a specific first mounting process for mounting two or more specific components at the same position on the board 2 . Therefore, in this example, a normal first implementation program that does not perform a specific first implementation process is input to the input unit. Based on this input, the computing unit determines that it can execute the second implementation process corresponding to the normal first implementation process. Then, the control device 50, which is an arithmetic unit, automatically generates the second mounting program and outputs to the touch panel 54 that the second mounting program has been generated. Then, the touch panel 54 displays that the second mounting program has been generated. According to this configuration, since the second mounting program is automatically generated, there is no need for the operator to perform the task of generating the second mounting program.

When the start button of the component mounter 10 is turned on, the first mounting process is executed based on the first mounting program, and component mounting on the first board 2 is started. At this time, first, the board transfer unit 20 carries the board 2 into the component mounting position P3 in the component mounter 10 . Then, the stocker 34 of the component supply unit 30 is driven, and the first slot 35 starts moving toward the storage position P1 (see FIGS. 3(a) and 3(b)). When the slot 35 in the first stage accommodating the first tray TR1 reaches the storage position P1, the first tray TR1 is pulled out from the storage position P1 and placed on the component extraction position P2 on the tray station 38. (See FIG. 3(c)). Next, the component mounting unit 40 sucks the component CH (CH1) from the first tray TR1 pulled out to the component picking position P2 and mounts the sucked component CH (CH1) on the substrate 2 . When the component CH (CH1) is mounted on the board 2, the first tray TR1 pulled out to the component take-out position P2 is stored again in the storage position P1 (see FIG. 3(d)).

Next, the stocker 34 of the component supply unit 30 is driven, and the second slot 35 containing the second tray TR2 moves to the storage position P1 (see FIG. 3(e)). After that, the second tray TR2 is pulled out from the storage position P1 and placed at the component extraction position P2 on the tray station 38 (see FIG. 3(f)). The component mounting unit 40 sucks the component CH (CH2) from the second tray TR2 pulled out to the component picking position P2 and mounts the sucked component CH (CH2) on the board 2 . When the component CH (CH2) is mounted on the board 2, the second tray TR2 pulled out to the component take-out position P2 is stored again in the storage position P1 (see FIG. 3(g)).

Next, the stocker 34 of the component supply unit 30 is driven, and the third slot 35 containing the third tray TR3 moves to the storage position P1 (see FIG. 3(h)). After that, the third tray TR3 is pulled out from the storage position P1 and placed at the component pick-up position P2 on the tray station 38 (see FIG. 4A). The component mounting unit 40 sucks the component CH (CH3) from the third tray TR3 pulled out to the component pick-up position P2 and mounts the sucked component CH (CH3) on the board 2 . By executing the above procedure, all the parts CH (CH1, CH2, CH3) are mounted in the order of "CH1->CH2->CH3". That is, in this example, the components CH (CH1, CH2, CH3) accommodated in the respective trays TR1, TR2, TR3 are mounted on the board 2 in ascending order from the first tray TR1 to the third tray TR3. be. When the component mounting on the first board 2 is completed, the board transfer unit 20 unloads the first board 2 on which the components have been mounted from the component mounting position P3, and moves the second board 2 to the component mounting position. Carry in to P3. A series of procedures up to this point are common to the embodiment and the conventional example.

4(b) to (d) show procedures for mounting components on the second substrate 2 by the component mounter 10 of the embodiment. When the production of the first substrate 2 is completed, the third tray TR3, which is the last tray, is still placed at the component pick-up position P2 (see FIG. 4A). In this embodiment, the second mounting process is executed based on the second mounting program without replacing the third tray TR3 pulled out to the component pick-up position P2, and components are mounted on the second board 2. Start. First, the component mounting unit 40 picks up the component CH (CH3) from the third tray TR3 pulled out to the component pickup position P2 and mounts the picked component CH (CH3) on the board 2 . When the component CH (CH3) is mounted on the board 2, the third tray TR3 pulled out to the component take-out position P2 is stored again in the storage position P1 (see FIG. 4(b)).

Next, the stocker 34 of the component supply unit 30 is driven, and the second slot 35 accommodating the second tray TR2 moves to the storage position P1 (see FIG. 4(c)). After that, the second tray TR2 is pulled out from the storage position P1 and placed at the component extraction position P2 on the tray station 38 (see FIG. 4(d)). The component mounting unit 40 sucks the component CH (CH2) from the second tray TR2 pulled out to the component picking position P2 and mounts the sucked component CH (CH2) on the board 2 . When the component CH (CH2) is mounted on the board 2, the second tray TR2 pulled out to the component take-out position P2 is stored again in the storage position P1. After that, the first tray TR1 is pulled out and the component CH (CH1) is picked up and mounted in the same procedure. By executing the above procedure, all the parts CH (CH3, CH2, CH1) are mounted in the order of "CH3->CH2->CH1". That is, in this example, the components CH (CH3, CH2, CH1) contained in the respective trays TR3, TR2, TR1 are mounted on the board 2 in descending order from the third tray TR3 to the first tray TR1. be. As a result, component mounting on the second board 2 is completed. The odd-numbered boards 2 are produced by executing the first mounting process based on the first mounting program, similarly to the first board 2 described above. The even-numbered boards 2 are produced by executing the second mounting process based on the second mounting program, similarly to the second board 2 described above.

On the other hand, FIGS. 4(e) to 4(g) show procedures for mounting components on the second substrate 2 by the conventional component mounter 10. FIG. In the conventional example, the first mounting process is executed based on the first mounting program to mount the components CH on the second and subsequent boards 2 as well. When the production of the first substrate 2 is finished, the third tray TR3, which is the last tray, is still pulled out to the component extraction position P2. Therefore, before mounting components on the second substrate 2, the third tray TR3 located at the component pick-up position P2 is stored in the storage position P1 (see FIG. 4(e)). Next, the stocker 34 of the component supply unit 30 is driven, and the first stage slot 35 moves to the storage position P1 (see FIG. 4(f)). Then, the first tray TR1 is pulled out from the storage position P1 and placed at the component extraction position P2 (see FIG. 4(g)). Next, after the component CH (CH1) is picked up and mounted, the first tray TR1 is stored. Thereafter, by executing the same procedure, all the parts CH (CH1, CH2, CH3) are mounted in the order of "CH1->CH2->CH3."

Next, a case where the first mounting process includes a specific first mounting process for mounting two or more specific components at the same position on the board 2 will be described. In the component mounter 10 of this embodiment, a first mounting program for executing a specific first mounting process may be input to the control device 50 via the transmission/reception circuit 58, which is an input unit. At this time, the control device 50 determines that the second mounting process corresponding to the specific first mounting process cannot be executed. Then, the control device 50 outputs to the touch panel 54 that the second implementation program cannot be generated without generating the second implementation program. Then, the touch panel 54 displays that the second mounting program cannot be generated. This display allows the worker to recognize that the second mounting process will not be executed.

As described in detail above, in the component mounter 10 of this embodiment, the first mounting process and the second mounting process are alternately performed on the plurality of boards 2 carried into the component mounting position P3. Therefore, for example, when the first mounting process is executed for the first board 2, the second mounting process is executed for the second board 2. Hereinafter, the first mounting process and the second mounting process are performed. and the mounting process are alternately executed. Therefore, the production of the next board 2 can be promptly started without replacing the tray TR pulled out to the component pick-up position P2 when the production of the board 2 is finished. Therefore, it is possible to prevent the component mounting unit 40 from standing by when the production of the next board 2 is started after the production of the board 2 is completed. Incidentally, in this embodiment, the steps enclosed by the two-dot chain line in FIG. 4 can be omitted, so the time required to produce one substrate 2 can be shortened accordingly. In addition, the vertical and horizontal movements of the component supply unit 30 can be reduced. Therefore, the life of the component supply unit 30 can be extended.

Further, in the present embodiment, the so-called single-lane component mounter 10 having only one board transfer unit 20 has been described as an example, but the technology disclosed in this specification includes two board transfer units 20 It may be applied to a so-called double-lane mounter 10 . In the case of the double-lane mounter 10, while the component 2 is being mounted in one lane, the board 2 can be carried in and out in the other lane. Even in such a case, if the technique disclosed in this specification is used, the first mounting process and the second mounting process are alternately performed on the plurality of boards 2 carried into the component mounting position P3. be. Therefore, it is possible to effectively prevent the component mounting unit 40 from standing by when the production of the next board 2 is started after the production of the board 2 is completed.

In the above embodiment, an example of mounting three types of components CH (CH1, CH2, CH3) on the board 2 has been described, but the types of components mounted on the board 2 are not limited to three types. For example, it can also be used when mounting four types of components CH (CH1, CH2, CH3, CH4) on the substrate 2 . In this case, the components are mounted on the first substrate 2 in the order of CH1→CH2→CH3→CH4, and on the second substrate 2 in the order of CH4→CH3→CH2→CH1. Implement parts. Even with such a configuration, the type CH4 of the component to be mounted last on the first board and the type CH4 of the component to be mounted first on the second board are the same, so the production of the next board starts after the production of the board ends. can shorten the time to When the component CH is to be mounted on the first board 2, the stocker 34 is lifted to pull out the trays TR from the adjacent slots 35. When the component CH is to be mounted on the second board 2, the stocker As the tray 34 descends, the tray TR is pulled out from the adjacent slot 35 in order. Therefore, the amount of movement of the stocker 35 between parts can be reduced, and the time from storing a tray TR to pulling out the next tray TR can be shortened.

Further, in the above-described embodiment, the component supply unit 30 has one stocker 34, but the technique disclosed in this specification is applied to a component supply unit having a plurality of stockers. good too. For example, as shown in FIG. 5, the component supply unit 60 includes a first stocker 62 (an example of a first tray magazine in the claims) housed in a housing 66 and a second stocker 64 (an example of a first tray magazine in the claims). An example of a 2-tray magazine).

A plurality of slots are formed in the first stocker 62, and each of the slots accommodates one tray 62a to 62c horizontally. Parts of the same type are accommodated in the plurality of trays 62a to 62c. For example, the first tray 62a contains the first type of component, the second tray 62b contains the second type of component, and the third tray 62c contains the third type of component. is doing.

Similarly to the first stocker 62, the second stocker 64 is also formed with a plurality of stages of slots, and each slot accommodates one tray 64a to 64c horizontally. The plurality of trays 64a to 64c store components of the same type in the same order as the first stocker 62, from the first stage to the lower stage. For example, the first tray 64a contains the first type of component, the second tray 64b contains the second type of component, and the third tray 64c contains the third type of component. is doing. Although FIG. 5 shows that each

stocker

62, 64 is provided with only three trays 62a to 62c, 64a to 64c, the number of

trays

62, 64 is not limited to three. Any number can be taken.

A tray station 68 extends from the side surface of the housing 66 . A component pickup position is set on the upper surface of the tray station 68 . Although not shown in FIG. 5, a storage position is set in the housing 66, and the storage position is set at substantially the same height as the component pick-up position (upper surface of the tray station 68). Each tray 62a-62c, 64a-64c of each

stocker

62, 64 can be moved from a storage position in the housing 66 to a component pick-up position on the upper surface of the tray station 68. As shown in FIG. That is, the first stocker 62 can move up and down in the housing 66, and the trays 62a to 62c can be taken out to the component extraction positions. It is movable between a retracted position (position at the upper end of the housing shown in FIG. 5) from which it cannot be removed immediately. By vertically moving the first stocker 62 so that the trays 62a to 62c are in the storage position, the trays 62a to 62c can be moved to the component pick-up position on the upper surface of the tray station 68. FIG. The second stocker 64 can also move up and down in the housing 66, and the trays 64a to 64c can be taken out to the parts take-out position, and the trays 64a to 64c can take out to the parts take-out position. It is movable between the retracted position (the position of the lower end of the housing 66 shown in FIG. 5) where it becomes impossible. By vertically moving the second stocker 64 so that the trays 64a to 64c are in the storage position, the trays 64a to 64c can be moved to the component pick-up position on the upper surface of the tray station 68. FIG.

The position of the tray station 68 in the height direction is set between the position of the first stocker 62 at the retracted position and the position of the second stocker 64 at the retracted position. As a result, in the component mounting process to be described later, when the third tray 62c of the first stocker 62 at the retracted position is moved to the storage position, or when the first tray 64a of the second stocker 64 at the retracted position is moved, The amount of movement of each

stocker

62, 64 when moving to the storage position can be reduced. The time taken to withdraw is shortened.

A specific example of component mounting processing using the component supply unit 60 described above will be described with reference to FIG. As shown in FIG. 6A, it is assumed that both the first stocker 62 and the second stocker 64 are positioned at the retracted position when the component mounting process is started. First, as shown in FIG. 6B, the first stocker 62 is lowered, and the first tray 62a of the first stocker 62 is positioned at the storage position. Next, the components stored in the first tray 62a of the first stocker 62 and the components in the third tray 62c are mounted on the board in ascending order (FIG. 6B→FIG. 6C). . This completes the mounting of components on the first board.

After the components have been mounted on the first board, the first stocker 62 moves to the retracted position, and at the same time, the first tray 64a of the second stocker 64 moves to the storage position (see FIG. 6 ( d)). Next, the components stored in the first tray 64a of the second stocker 64 and the components in the third tray 64c are mounted on the board in ascending order (Fig. 6(d) -> Fig. 6(e)). This completes the mounting of components on the second board.

When the mounting of the components on the second substrate is completed, next, the components stored in the third tray 64c of the second stocker 64 and the components on the first tray 64a are mounted on the substrate in descending order. (FIG. 6(e)→FIG. 6(f)). This completes the mounting of components on the third board.

When the components are mounted on the third board, the second stocker 64 moves to the retracted position, and at the same time, the third tray 62c of the first stocker 62 moves to the storage position (FIG. 6(g)). . Next, the components stored in the third tray 62c of the first stocker 62 and the components in the first tray 62a are mounted on the board in descending order (FIG. 6(g)→FIG. 6(h)). . This completes the mounting of components on the fourth board. Thereafter, the mounting process from FIG. 6(b) to FIG. 6(h) is repeatedly executed. Even in such an example, since the component to be mounted last on the board and the component to be mounted first on the next board are of the same type, it is possible to eliminate the replacement of trays when changing the board to be produced. can be done. This allows efficient production of a plurality of substrates.

In the above example, the parts were stored in the same order from the first stage to the third stage in the trays 62a to 62c of the first stocker 62 and the trays 64a to 64c of the second stocker 64. It is not limited to such examples. For example, in the first stocker 62, the first type of component to be loaded on the first tray 62a, the second type of component to be loaded on the second tray 62b, and the third type of component to be loaded on the third tray 62c. , respectively, in the second stocker 64, the type of component to be mounted third on the first tray 62a, the type of component to be mounted second on the second tray 64b, and the third tray 64c may contain components of the type that are mounted first. In this case, for example, when producing the second substrate in FIG. 6 (FIG. 6(d)→FIG. 6(e)), components are mounted in ascending order from the first tray 64a to the third tray 64c. Therefore, the components are mounted on the board in order from the third mounted component to the first mounted component. Such a form can also achieve the same effect as the above example.

Specific examples of the technology disclosed in this specification have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. In addition, the technical elements described in this specification or in the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques exemplified in this specification or drawings achieve multiple purposes at the same time, and achieving one of them has technical utility in itself.

2 Boards 4, 4A, 4B, 4C Components 10 Component mounter 20 Board transfer unit 30 Component supply unit 40 Component mounting unit 50 Control device 52 functioning as a control unit and an arithmetic unit Transmission/reception circuit P1 as an input unit Storage position P2 Component pickup Position P3 Component mounting position TR, TR1, TR2, TR3 Tray

Claims

A component mounter for mounting components on a substrate,
a board transfer unit that carries a board into a component mounting position and carries out the board from the component mounting position;
a component supply unit comprising a tray magazine having a plurality of trays for storing components, each of the plurality of trays being configured to be movable between a storage position and a component extraction position;
With the tray moved from the storage position to the component extraction position, the component is sucked from the tray moved to the component extraction position, and the sucked component is mounted on the board carried into the component mounting position. a component mounting unit;
A control unit that controls the substrate transport unit, the component supply unit, and the component mounting unit, the control unit comprising:
(1) A first mounting process for mounting components accommodated in respective trays of the first stage to the n-th stage (n is an integer equal to or greater than 2) of the tray magazine on the substrate, In the mounting process, the components accommodated in each tray are mounted on the board in ascending order from the first tray to the n-th tray;
(2) A second mounting process for mounting, onto the substrate, components accommodated in the first to n-th trays of the tray magazine to which the components have been supplied in the first mounting process. , in the second mounting process, the components accommodated in each tray are mounted on the board in descending order from the nth tray to the first tray;
for a plurality of boards carried into the component mounting position alternately;
A component mounter.
an input unit for inputting a first mounting program for causing the control unit to execute the first mounting process;
An operation for generating a second implementation program for causing the control unit to execute the second implementation process based on the input first implementation program when the first implementation program is input from the input unit. a unit;
The component mounter according to claim 1, further comprising:
The first mounting process includes a specific first mounting process of mounting two or more specific components at the same position on the substrate,
The order of mounting the two or more specific components on the substrate is set in advance,
When a first implementation program for causing the control unit to execute the specific first implementation process is input to the input unit, the arithmetic unit outputs the second implementation corresponding to the specific first implementation process. 3. The component mounter according to claim 2, which outputs that the second mounting program for causing the control unit to execute processing cannot be generated.
The component supply unit comprises a first tray magazine comprising a plurality of trays containing components, and a second tray magazine comprising a plurality of trays containing components,
The storage position and the component extraction position are provided between the first tray magazine at the retracted position and the second tray magazine at the retracted position,
each of the plurality of trays of the first tray magazine and the second tray magazine is configured to be movable between the storage position and the component extraction position;
In the first tray magazine at the retracted position, the n-th tray is positioned closer to the component pick-up position than the first tray, and
In the second tray magazine at the retracted position, the first stage tray is positioned closer to the component pick-up position than the nth tray, and
The control unit is
(1) A first mounting process for mounting components accommodated in respective trays of the first to n-th stages (n is an integer equal to or greater than 2) of the first tray magazine, In the first mounting process, the components accommodated in each tray are mounted on the board in ascending order from the first tray to the n-th tray;
(2) A second mounting process for mounting components accommodated in the first to n-th trays of the first tray magazine onto the board, wherein the second mounting process includes: the second mounting process of mounting the components accommodated in each tray on the board in descending order from the nth tray to the first tray;
(3) A third mounting process for mounting components accommodated in the first to n-th trays (n is an integer of 2 or more) of the second tray magazine on the substrate, In the third mounting process, the components accommodated in each tray are mounted on the board in ascending order from the first tray to the n-th tray;
(4) A fourth mounting process for mounting components accommodated in the first to n-th trays of the second tray magazine on the board, wherein the fourth mounting process includes: the fourth mounting process of mounting the components accommodated in each tray on the board in descending order from the nth tray to the first tray;
, in the order of the first mounting process, the third mounting process, the fourth mounting process, and the second mounting process.