JPS59232436A - 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法 - Google Patents

多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Info

Publication number
JPS59232436A
JPS59232436A JP58108421A JP10842183A JPS59232436A JP S59232436 A JPS59232436 A JP S59232436A JP 58108421 A JP58108421 A JP 58108421A JP 10842183 A JP10842183 A JP 10842183A JP S59232436 A JPS59232436 A JP S59232436A
Authority
JP
Japan
Prior art keywords
sheet
ring
wafer ring
wafer
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58108421A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6329412B2 (enFirst
Inventor
Susumu Kamiyama
進 神山
Takeshi Sato
武 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58108421A priority Critical patent/JPS59232436A/ja
Publication of JPS59232436A publication Critical patent/JPS59232436A/ja
Publication of JPS6329412B2 publication Critical patent/JPS6329412B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Dicing (AREA)
JP58108421A 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法 Granted JPS59232436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58108421A JPS59232436A (ja) 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58108421A JPS59232436A (ja) 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Publications (2)

Publication Number Publication Date
JPS59232436A true JPS59232436A (ja) 1984-12-27
JPS6329412B2 JPS6329412B2 (enFirst) 1988-06-14

Family

ID=14484333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58108421A Granted JPS59232436A (ja) 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Country Status (1)

Country Link
JP (1) JPS59232436A (enFirst)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378242A (ja) * 1989-08-22 1991-04-03 Hiyuuguru Electron Kk 粘着性フイルムの固定方法及びその装置
JP2008135513A (ja) * 2006-11-28 2008-06-12 Disco Abrasive Syst Ltd テープ拡張装置
JP2008140874A (ja) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2012178471A (ja) * 2011-02-25 2012-09-13 Lintec Corp シート貼付装置および貼付方法
JP2023147552A (ja) * 2022-03-30 2023-10-13 株式会社東京精密 拡張保持リング取り外し治具及び拡張保持リング取り外し方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5831696B2 (ja) * 2011-09-14 2015-12-09 株式会社東京精密 ダイボンダ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378242A (ja) * 1989-08-22 1991-04-03 Hiyuuguru Electron Kk 粘着性フイルムの固定方法及びその装置
JP2008135513A (ja) * 2006-11-28 2008-06-12 Disco Abrasive Syst Ltd テープ拡張装置
JP2008140874A (ja) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2012178471A (ja) * 2011-02-25 2012-09-13 Lintec Corp シート貼付装置および貼付方法
JP2023147552A (ja) * 2022-03-30 2023-10-13 株式会社東京精密 拡張保持リング取り外し治具及び拡張保持リング取り外し方法

Also Published As

Publication number Publication date
JPS6329412B2 (enFirst) 1988-06-14

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