JPS59224358A - 熱インク・ジエツト・ヘツド - Google Patents
熱インク・ジエツト・ヘツドInfo
- Publication number
- JPS59224358A JPS59224358A JP59100214A JP10021484A JPS59224358A JP S59224358 A JPS59224358 A JP S59224358A JP 59100214 A JP59100214 A JP 59100214A JP 10021484 A JP10021484 A JP 10021484A JP S59224358 A JPS59224358 A JP S59224358A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ink
- silicon
- ink jet
- jet head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 13
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 19
- 238000002161 passivation Methods 0.000 abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 12
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 9
- 239000000377 silicon dioxide Substances 0.000 abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract 3
- 229920001296 polysiloxane Polymers 0.000 abstract 3
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 58
- 239000010410 layer Substances 0.000 description 50
- 238000000034 method Methods 0.000 description 23
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US497774 | 1983-05-25 | ||
| US06/497,774 US4513298A (en) | 1983-05-25 | 1983-05-25 | Thermal ink jet printhead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59224358A true JPS59224358A (ja) | 1984-12-17 |
| JPH0327027B2 JPH0327027B2 (enExample) | 1991-04-12 |
Family
ID=23978251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59100214A Granted JPS59224358A (ja) | 1983-05-25 | 1984-05-18 | 熱インク・ジエツト・ヘツド |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4513298A (enExample) |
| JP (1) | JPS59224358A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189950A (ja) * | 1985-02-19 | 1986-08-23 | ゼロツクス コーポレーシヨン | サーマルインクジエツトプリンターに用いるためのインクジエツトプリントヘツド |
| WO1993008989A1 (fr) * | 1991-11-06 | 1993-05-13 | Canon Kabushiki Kaisha | Plaque de support a base de silicium polycristallin pour tete d'impression a jet de liquide, fabrication de ladite plaque, tete d'impression a jet de liquide montee sur ladite plaque, et appareil d'impression a jet de liquide |
| WO1993009953A1 (fr) * | 1991-11-12 | 1993-05-27 | Canon Kabushiki Kaisha | Plaque de support a base de silicium polycristallin pour tete d'impression a jet de liquide, procede de fabrication de ladite plaque, tete d'impression a jet de liquide montee sur ladite plaque, et appareil d'impression a jet de liquide |
Families Citing this family (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2144081B (en) * | 1983-07-23 | 1987-10-28 | Pa Consulting Services | Postal franking machines |
| JPH062416B2 (ja) * | 1984-01-30 | 1994-01-12 | キヤノン株式会社 | 液体噴射記録ヘッドの製造方法 |
| US4716423A (en) * | 1985-11-22 | 1987-12-29 | Hewlett-Packard Company | Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture |
| US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| US4847630A (en) * | 1987-12-17 | 1989-07-11 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| US4956653A (en) * | 1989-05-12 | 1990-09-11 | Eastman Kodak Company | Bubble jet print head having improved multi-layer protective structure for heater elements |
| JPH03506004A (ja) * | 1989-05-12 | 1991-12-26 | イーストマン・コダック・カンパニー | バブルジェット印刷ヘッド用の改善された液滴エジェクタ要素及び製造方法 |
| US4951063A (en) * | 1989-05-22 | 1990-08-21 | Xerox Corporation | Heating elements for thermal ink jet devices |
| JP2824123B2 (ja) * | 1989-05-30 | 1998-11-11 | キヤノン株式会社 | インクジェットヘッド及び該ヘッドを形成するために用いるインクジェットヘッド用基体 |
| US5122812A (en) * | 1991-01-03 | 1992-06-16 | Hewlett-Packard Company | Thermal inkjet printhead having driver circuitry thereon and method for making the same |
| US5159353A (en) * | 1991-07-02 | 1992-10-27 | Hewlett-Packard Company | Thermal inkjet printhead structure and method for making the same |
| US5250107A (en) * | 1991-07-31 | 1993-10-05 | Hewlett-Packard Company | Water-fast ink composition and method for making the same |
| US5188664A (en) * | 1991-11-26 | 1993-02-23 | Hewlett-Packard Company | Anti-coalescent ink composition and method for making the same |
| US5498850A (en) * | 1992-09-11 | 1996-03-12 | Philip Morris Incorporated | Semiconductor electrical heater and method for making same |
| EP0603821B1 (en) * | 1992-12-22 | 1999-08-11 | Canon Kabushiki Kaisha | Ink-jet printhead, production method thereof and printing apparatus with the ink-jet printhead |
| US6070969A (en) * | 1994-03-23 | 2000-06-06 | Hewlett-Packard Company | Thermal inkjet printhead having a preferred nucleation site |
| US5635968A (en) * | 1994-04-29 | 1997-06-03 | Hewlett-Packard Company | Thermal inkjet printer printhead with offset heater resistors |
| DE19536429A1 (de) | 1995-09-29 | 1997-04-10 | Siemens Ag | Tintenstrahldruckkopf und Verfahren zum Herstellen eines solchen Tintenstrahldruckkopfes |
| US5718044A (en) * | 1995-11-28 | 1998-02-17 | Hewlett-Packard Company | Assembly of printing devices using thermo-compressive welding |
| EP0776767B1 (en) | 1995-12-01 | 1999-06-16 | National Starch and Chemical Investment Holding Corporation | Ink-jet recording sheet and a method for its preparation |
| US6758552B1 (en) | 1995-12-06 | 2004-07-06 | Hewlett-Packard Development Company | Integrated thin-film drive head for thermal ink-jet printer |
| US5883650A (en) * | 1995-12-06 | 1999-03-16 | Hewlett-Packard Company | Thin-film printhead device for an ink-jet printer |
| US6239820B1 (en) | 1995-12-06 | 2001-05-29 | Hewlett-Packard Company | Thin-film printhead device for an ink-jet printer |
| US6113221A (en) * | 1996-02-07 | 2000-09-05 | Hewlett-Packard Company | Method and apparatus for ink chamber evacuation |
| US6003977A (en) * | 1996-02-07 | 1999-12-21 | Hewlett-Packard Company | Bubble valving for ink-jet printheads |
| DE69618559T2 (de) | 1996-02-14 | 2002-08-14 | Stmicroelectronics S.R.L., Agrate Brianza | Kapazitiver Abstandssensor, insbesondere zur Erfassung von Fingerabdrücken |
| US6320394B1 (en) | 1996-02-14 | 2001-11-20 | Stmicroelectronics S.R.L. | Capacitive distance sensor |
| US6114862A (en) | 1996-02-14 | 2000-09-05 | Stmicroelectronics, Inc. | Capacitive distance sensor |
| EP0794057B1 (en) | 1996-03-04 | 2002-07-03 | Hewlett-Packard Company, A Delaware Corporation | Ink jet pen with a heater element having a contoured surface |
| US5861902A (en) * | 1996-04-24 | 1999-01-19 | Hewlett-Packard Company | Thermal tailoring for ink jet printheads |
| US5901425A (en) | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
| KR100225082B1 (ko) * | 1997-01-15 | 1999-10-15 | 윤종용 | 프린트 헤드의 잉크 분사 장치 구조 |
| US6483931B2 (en) | 1997-09-11 | 2002-11-19 | Stmicroelectronics, Inc. | Electrostatic discharge protection of a capacitve type fingerprint sensing array |
| KR100232853B1 (ko) * | 1997-10-15 | 1999-12-01 | 윤종용 | 잉크젯 프린터 헤드의 가열장치 및 이의 제조방법 |
| US6191593B1 (en) | 1997-12-17 | 2001-02-20 | Stmicroelectronics, Inc. | Method for the non-invasive sensing of physical matter on the detection surface of a capacitive sensor |
| US6091082A (en) * | 1998-02-17 | 2000-07-18 | Stmicroelectronics, Inc. | Electrostatic discharge protection for integrated circuit sensor passivation |
| US20030164225A1 (en) * | 1998-04-20 | 2003-09-04 | Tadashi Sawayama | Processing apparatus, exhaust processing process and plasma processing |
| US6293654B1 (en) * | 1998-04-22 | 2001-09-25 | Hewlett-Packard Company | Printhead apparatus |
| US6126277A (en) * | 1998-04-29 | 2000-10-03 | Hewlett-Packard Company | Non-kogating, low turn on energy thin film structure for very low drop volume thermal ink jet pens |
| US6315384B1 (en) | 1999-03-08 | 2001-11-13 | Hewlett-Packard Company | Thermal inkjet printhead and high-efficiency polycrystalline silicon resistor system for use therein |
| US6331049B1 (en) | 1999-03-12 | 2001-12-18 | Hewlett-Packard Company | Printhead having varied thickness passivation layer and method of making same |
| US6417248B1 (en) | 1999-04-21 | 2002-07-09 | Hewlett-Packard Company | Preparation of improved inks for inkjet printers |
| EP1046685B1 (en) | 1999-04-21 | 2003-06-25 | Hewlett-Packard Company, A Delaware Corporation | Preparation of improved inks for ink-jet printers using specific polymers |
| US6299294B1 (en) * | 1999-07-29 | 2001-10-09 | Hewlett-Packard Company | High efficiency printhead containing a novel oxynitride-based resistor system |
| US6336713B1 (en) * | 1999-07-29 | 2002-01-08 | Hewlett-Packard Company | High efficiency printhead containing a novel nitride-based resistor system |
| US6132032A (en) * | 1999-08-13 | 2000-10-17 | Hewlett-Packard Company | Thin-film print head for thermal ink-jet printers |
| US6273555B1 (en) | 1999-08-16 | 2001-08-14 | Hewlett-Packard Company | High efficiency ink delivery printhead having improved thermal characteristics |
| EP1092544B1 (en) * | 1999-10-12 | 2009-03-11 | Canon Kabushiki Kaisha | Ink jet printing apparatus and method |
| US6267471B1 (en) * | 1999-10-26 | 2001-07-31 | Hewlett-Packard Company | High-efficiency polycrystalline silicon resistor system for use in a thermal inkjet printhead |
| US6512381B2 (en) | 1999-12-30 | 2003-01-28 | Stmicroelectronics, Inc. | Enhanced fingerprint detection |
| US7239227B1 (en) | 1999-12-30 | 2007-07-03 | Upek, Inc. | Command interface using fingerprint sensor input system |
| US6971170B2 (en) * | 2000-03-28 | 2005-12-06 | Microjet Technology Co., Ltd | Method of manufacturing printhead |
| US6481831B1 (en) | 2000-07-07 | 2002-11-19 | Hewlett-Packard Company | Fluid ejection device and method of fabricating |
| EP1172212B1 (en) * | 2000-07-11 | 2007-02-28 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead |
| JP3710364B2 (ja) * | 2000-07-31 | 2005-10-26 | キヤノン株式会社 | インクジェットヘッド |
| US6457814B1 (en) * | 2000-12-20 | 2002-10-01 | Hewlett-Packard Company | Fluid-jet printhead and method of fabricating a fluid-jet printhead |
| US6585367B2 (en) | 2001-01-29 | 2003-07-01 | Hewlett-Packard Company | Inkjet printed images with wettable, fusible toner |
| US6457815B1 (en) | 2001-01-29 | 2002-10-01 | Hewlett-Packard Company | Fluid-jet printhead and method of fabricating a fluid-jet printhead |
| US20020158945A1 (en) * | 2001-04-30 | 2002-10-31 | Miller Richard Todd | Heating element of a printhead having resistive layer over conductive layer |
| US6623109B2 (en) | 2001-08-23 | 2003-09-23 | Microjet Technology Co., Ltd. | Structure of printhead |
| US7025894B2 (en) * | 2001-10-16 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Fluid-ejection devices and a deposition method for layers thereof |
| KR100438709B1 (ko) * | 2001-12-18 | 2004-07-05 | 삼성전자주식회사 | 잉크 젯 프린트 헤드 |
| KR100436760B1 (ko) * | 2001-12-20 | 2004-06-23 | 삼성전자주식회사 | 잉크젯 프린터의 헤드 및 그 제조방법 |
| US6747684B2 (en) | 2002-04-10 | 2004-06-08 | Hewlett-Packard Development Company, L.P. | Laser triggered inkjet firing |
| US6799819B2 (en) | 2002-06-07 | 2004-10-05 | Hewlett-Packard Development Company, L.P. | Photosensor activation of an ejection element of a fluid ejection device |
| US6705701B2 (en) * | 2002-06-07 | 2004-03-16 | Hewlett-Packard Development Company, L.P. | Fluid ejection and scanning system with photosensor activation of ejection elements |
| US7083250B2 (en) * | 2002-06-07 | 2006-08-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection and scanning assembly with photosensor activation of ejection elements |
| US7104623B2 (en) * | 2002-06-07 | 2006-09-12 | Hewlett-Packard Development Company, L.P. | Fluid ejection system with photosensor activation of ejection element |
| US7297454B2 (en) | 2002-07-30 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Colorless inkjet ink compositions for improved image quality |
| KR100438842B1 (ko) * | 2002-10-12 | 2004-07-05 | 삼성전자주식회사 | 금속 노즐 플레이트를 가진 일체형 잉크젯 프린트헤드 및그 제조방법 |
| US6755509B2 (en) * | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
| KR100472485B1 (ko) * | 2002-12-20 | 2005-03-09 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| US6857727B1 (en) * | 2003-10-23 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | Orifice plate and method of forming orifice plate for fluid ejection device |
| US9296214B2 (en) * | 2004-07-02 | 2016-03-29 | Zih Corp. | Thermal print head usage monitor and method for using the monitor |
| US7641961B2 (en) * | 2004-10-20 | 2010-01-05 | Hewlett-Packard Development Company, L.P. | Ink solvent assisted heat sealable media |
| AU2005330071B2 (en) | 2005-04-04 | 2009-11-19 | Memjet Technology Limited | MEMS fluid sensor |
| JP4847360B2 (ja) * | 2006-02-02 | 2011-12-28 | キヤノン株式会社 | 液体吐出ヘッド基体、その基体を用いた液体吐出ヘッドおよびそれらの製造方法 |
| KR100850648B1 (ko) * | 2007-01-03 | 2008-08-07 | 한국과학기술원 | 산화물을 이용한 고효율 열발생 저항기, 액체 분사 헤드 및장치, 및 액체 분사 헤드용 기판 |
| US8115497B2 (en) * | 2007-11-13 | 2012-02-14 | Authentec, Inc. | Pixel sensing circuit with common mode cancellation |
| US8187898B2 (en) * | 2007-12-21 | 2012-05-29 | Canon Kabushiki Kaisha | Method for manufacturing liquid discharge head |
| US8925835B2 (en) * | 2008-12-31 | 2015-01-06 | Stmicroelectronics, Inc. | Microfluidic nozzle formation and process flow |
| CN102947099B (zh) | 2010-04-29 | 2015-11-25 | 惠普发展公司，有限责任合伙企业 | 流体喷射装置 |
| EP3322591A4 (en) * | 2015-07-15 | 2019-03-13 | Hewlett-Packard Development Company, L.P. | LIABILITY AND ISOLATION LAYER |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128466A (en) * | 1979-03-27 | 1980-10-04 | Canon Inc | Liquid drip jetting recording device |
| JPS5693563A (en) * | 1979-12-28 | 1981-07-29 | Canon Inc | Liquid-droplet jetting recording head |
| JPS5836465A (ja) * | 1981-08-14 | 1983-03-03 | Yokogawa Hewlett Packard Ltd | インクジエツト・プリンタ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335389A (en) * | 1979-03-27 | 1982-06-15 | Canon Kabushiki Kaisha | Liquid droplet ejecting recording head |
| US4429321A (en) * | 1980-10-23 | 1984-01-31 | Canon Kabushiki Kaisha | Liquid jet recording device |
| US4438191A (en) * | 1982-11-23 | 1984-03-20 | Hewlett-Packard Company | Monolithic ink jet print head |
-
1983
- 1983-05-25 US US06/497,774 patent/US4513298A/en not_active Expired - Lifetime
-
1984
- 1984-05-18 JP JP59100214A patent/JPS59224358A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128466A (en) * | 1979-03-27 | 1980-10-04 | Canon Inc | Liquid drip jetting recording device |
| JPS5693563A (en) * | 1979-12-28 | 1981-07-29 | Canon Inc | Liquid-droplet jetting recording head |
| JPS5836465A (ja) * | 1981-08-14 | 1983-03-03 | Yokogawa Hewlett Packard Ltd | インクジエツト・プリンタ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189950A (ja) * | 1985-02-19 | 1986-08-23 | ゼロツクス コーポレーシヨン | サーマルインクジエツトプリンターに用いるためのインクジエツトプリントヘツド |
| WO1993008989A1 (fr) * | 1991-11-06 | 1993-05-13 | Canon Kabushiki Kaisha | Plaque de support a base de silicium polycristallin pour tete d'impression a jet de liquide, fabrication de ladite plaque, tete d'impression a jet de liquide montee sur ladite plaque, et appareil d'impression a jet de liquide |
| WO1993009953A1 (fr) * | 1991-11-12 | 1993-05-27 | Canon Kabushiki Kaisha | Plaque de support a base de silicium polycristallin pour tete d'impression a jet de liquide, procede de fabrication de ladite plaque, tete d'impression a jet de liquide montee sur ladite plaque, et appareil d'impression a jet de liquide |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0327027B2 (enExample) | 1991-04-12 |
| US4513298A (en) | 1985-04-23 |
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