JPS5922335A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable to obtain systems having different functions by a method wherein bonding pads connected to integrated circuits are arranged as to surround the integrated circuits of the plural number, and the bonding pads thereof are selected. CONSTITUTION:The group of the integrated circuits 2 consisting of the integrated circuits I -VI is provided at the central part of a semiconductor chip 1, and moreover the bonding pads 3 of the plural number are arranged as to surround the group of the integrated circuits 2 at the circumferential part of the chip 1. The group of the pads I -VI is connected to the integrated circuits I -VI corresponding respectively. The system A can be constructed by selecting the group of the pads (provided that the group of the pads IV is excluded) surrounded by the alternate long and short dash line 4, and the system B can be constructed by selecting the group of the pads (provided that the group of the III is excluded) surrounded by the altenate long and two short dashes line 5. The systems A, B are constructed of the integrated circuits shown on the right sides of the following formulas. System A= I +III+IV+V. System B=II+IV+V+VI.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to semiconductor devices, and particularly to improvements in the arrangement of bonding pads in semiconductor devices in which a plurality of integrated circuits are formed on the same chip.

[Technical background of the invention and its problems]

In recent years, with the miniaturization of semiconductor devices, the chip area has been rapidly reduced. However, when bending, there is a limit to the thickness of the gold wire that becomes the lead wire.
:] A size of 100 [μm] must be secured. Therefore, in one chip, the area occupied by the integrated circuit tends to decrease and the area occupied by the bonding pad tends to increase.

Furthermore, as a recent trend, a technique is being used in which a plurality of integrated circuits are formed on the same chip, and these are appropriately selected to realize different systems. However, in this case, in order to select the required one from a plurality of integrated circuits, it is necessary to change the four turns of the wiring mask, which increases manufacturing costs and complicates the process.

[Purpose of the invention]

An object of the present invention is to provide a semiconductor device that allows a plurality of integrated circuits to be selected on the same chip without changing the mask pattern, and that allows different systems to be realized easily and at low cost.

[Summary of the invention]

The gist of the present invention is to select a desired one from a plurality of integrated circuits by selecting a denting pad.

That is, the present invention provides a semiconductor device in which a plurality of integrated circuits are formed on one chip, in which bonding pads connected to the integrated circuits are arranged so as to surround each of the integrated circuits, and the selection of these binding pads is performed. This system is designed to realize systems with different functions.

〔Effect of the invention〕

According to the present invention, various systems with different functions can be realized in the same process by selecting binding pads. Therefore, it is extremely useful in the field of semiconductor technology. Furthermore, since there is no need to change the wiring mask pattern, it can be easily realized without increasing costs.

[Embodiments of the invention]

FIG. 1 is a schematic configuration diagram schematically showing an embodiment of the present invention. A plurality of integrated circuits 1.
An integrated circuit group 2 consisting of n, III, IV, V, and M is formed. Furthermore, a plurality of denting pads 3 are arranged at the periphery of the chip 1 so as to surround the integrated circuit group 2 . These dending pads 3 have pad groups r, n, m, y, v, and w on one side of the integrated circuit I,
~, ■ are connected respectively.

The first pad group is composed of the pad groups ■, ~, and ■, and the second pad group is composed of the pad groups t and n arranged outside the first pad group. It has become something that

With such a configuration, pad groups I, -.

(2) By appropriately selecting the integrated circuit I.

It is possible to obtain a system having different functions consisting of the necessary ones among . By selecting the pad group surrounded by the one-dot chain line 4 in FIG. ), system B can be obtained. It is assumed that systems A and B are composed of integrated circuits of the following formula.

Here, since the integrated circuits V and Vl are circuits that are commonly used in the systems AtBK, their node groups v and 2 are arranged as shown in FIG. Thus, according to this embodiment, depending on the selection of the zoning module 3, two types of systems A and B with different functions are arranged.
can be realized. In addition, it is possible to prevent gold wires etc. from overlapping during bending, and it is possible to perform reliable bending.

FIG. 2 is a schematic configuration diagram schematically showing another embodiment.

Note that the same parts as in FIG. 1 are given the same reference numerals, and detailed explanation thereof will be omitted. In this embodiment, the number of integrated circuit groups 2 is increased, and the /4' nodes 3 are arranged in duplicate. That is, the integrated circuit group 2 includes a plurality of integrated circuits 1.
II.

111, IV, V, Vl, ■, ■, and around these pad groups V, ~, ■, the first No. and Rad groups are arranged, and surrounding the first pad group No. 4 Tsudo groups! ,~,■
A second pad group consisting of the following is arranged.

With such a configuration, by selecting the node group surrounded by the solid line 6, the broken line 7, the one-dot chain line 8, or the two-dot chain line 9 in the figure, the system A t B # shown by the following formula can be created.
CtD can be realized.

Therefore, it goes without saying that the same effects as in the previous embodiment can be achieved.

Note that the present invention is not limited to the embodiments described above. For example, the number of integrated circuits, the number of pad groups, etc. may be determined as appropriate according to specifications. In addition to the integrated circuit and sensor components on one chip, we also use printing technology to draw out lead wires outside of one chip. It is also possible to apply this method to semiconductor devices in which the bonding layer is provided outside the chip. In addition, various modifications can be made without departing from the spirit of the present invention.

[Brief explanation of drawings]

FIG. 1 is a schematic structural diagram schematically showing a semiconductor device according to one embodiment of the present invention, and FIG. 2 is a schematic structural diagram schematically showing another embodiment. 1... Semiconductor chip, 2... Integrated circuit group, 3...
Ponding pad. Applicant's representative Patent attorney Takehiko Suzue Figure 1! . Figure 2 13

Claims (2)

[Claims] (1) In a semiconductor device in which a plurality of integrated circuits are formed on one chip, landing pads connected to the integrated circuits are arranged so as to surround each of the integrated circuits, and these ? A semiconductor device characterized in that it realizes a system with different functions depending on the selection of a terminal node. (2) The Dending I4 pad includes a first pad group connected to a part of the plurality of integrated circuits, and a second pad group connected to the remaining integrated circuits and arranged outside the first pad group. 2. The semiconductor device according to claim 1, wherein the semiconductor device is comprised of two arm groups.