JPS5922325B2 - Hidoudenseibutsutsuno Dodenshiyorihohou - Google Patents

Hidoudenseibutsutsuno Dodenshiyorihohou

Info

Publication number
JPS5922325B2
JPS5922325B2 JP13021175A JP13021175A JPS5922325B2 JP S5922325 B2 JPS5922325 B2 JP S5922325B2 JP 13021175 A JP13021175 A JP 13021175A JP 13021175 A JP13021175 A JP 13021175A JP S5922325 B2 JPS5922325 B2 JP S5922325B2
Authority
JP
Japan
Prior art keywords
nickel
conductive
master
liquid
lacquer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13021175A
Other languages
Japanese (ja)
Other versions
JPS5254193A (en
Inventor
正夫 斉藤
新一 倉橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Columbia Co Ltd
Original Assignee
Nippon Columbia Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Columbia Co Ltd filed Critical Nippon Columbia Co Ltd
Priority to JP13021175A priority Critical patent/JPS5922325B2/en
Publication of JPS5254193A publication Critical patent/JPS5254193A/en
Publication of JPS5922325B2 publication Critical patent/JPS5922325B2/en
Expired legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electric Cables (AREA)

Description

【発明の詳細な説明】 本発明は非導電性物質の導電化処理方法に係わり、特に
ニッケルスプレィ法に於いて未反応液が残つて生ずる不
均一な被膜を不活性気体を吹付けることで均一化するよ
うにした非導電性物質の導電化処理方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for making a non-conductive material conductive, and in particular, it can be used to uniformize a non-uniform coating caused by unreacted liquid remaining in the nickel spray method by spraying an inert gas. The present invention relates to a method for making a non-conductive substance conductive.

従来から、非導電性物質の導電化方法として、ニッケル
液とホウ水素化合物の還元剤液とを非導電物質の表面に
吹付けて、ニッケル金属層を形成する様にした導電化方
法は公知である。
Conventionally, as a method for making a non-conductive material conductive, a method for making a non-conductive material conductive involves spraying a nickel solution and a reducing agent solution of a borohydride compound onto the surface of the non-conductive material to form a nickel metal layer. be.

今、この製造方法をレコード用原盤製造方法について第
1乃至第8図を用いて説明する。
This manufacturing method will now be described with reference to FIGS. 1 to 8 regarding a method for manufacturing a record master.

図に於て、1はアルミニウムより成るアルミ盤で、この
アルミ盤上に硝酸セルローズを主体としたラツカ層2を
設け、アルミ盤1とラツカ層2とより成るラツカ盤3上
にカッタによる音溝4を形成(第1図参照)し、このラ
ツカ原盤3上に電鋳を施すために、ニッケル液と還元液
とをスプレィにより吹付け、ラツカ盤3上にニッケルを
還元析出せしめて、導電層5を形成し、更にその上にニ
ッケル電鋳により補強層6を形成(第2図参照)した後
、ラツカ原盤3から補強層6を剥離し、ラツカ原盤3の
音溝4に対応する凸凹溝4を有するマスターTを得る(
第3図参照)。
In the figure, reference numeral 1 is an aluminum plate made of aluminum. A lacquer layer 2 mainly made of cellulose nitrate is provided on this aluminum plate, and a sound groove is cut by a cutter on a lacquer plate 3 consisting of the aluminum plate 1 and the lacquer layer 2. 4 (see Figure 1), and in order to perform electroforming on this lacquer master plate 3, a nickel solution and a reducing liquid are sprayed to reduce and deposit nickel on the lacquer plate 3, thereby forming a conductive layer. 5 is formed, and a reinforcing layer 6 is further formed thereon by nickel electroforming (see Fig. 2), and then the reinforcing layer 6 is peeled off from the lacquer master 3 to form uneven grooves corresponding to the sound grooves 4 of the lacquer master 3. We get the master T with 4 (
(See Figure 3).

次に、マスターTに酸化膜処理を行ない剥離膜を形成し
た後、ニッケル電鋳8を行つて(第4図参照)、マザー
9を作製する(第5図)。その後、マザー9にニッケル
電鋳10を行い(第6図)、これを剥離し、スタンバー
11を形成する(第T図)。次に、このスタンバー11
を使用して、加熱圧縮成形、又は射出成形によりレコー
ド盤12を製作する(第8図)。上記したマスターTを
得るのに、ニッケル液と還元剤であるホウ水素化合物と
をスプレィ法にてラツカ原盤3上に吹付け、ニッケル膜
即ち補強層6を形成するが、ラツカ盤3などの形状によ
つては、凹部に還元生成物や未反応液等が残り、新しい
液のラツカ盤表面への供給が不十分となり、均・一な被
膜を得るのが困難になる欠点を生ずる。
Next, after performing an oxide film treatment on the master T to form a peeling film, nickel electroforming 8 is performed (see FIG. 4) to produce a mother 9 (see FIG. 5). Thereafter, nickel electroforming 10 is applied to the mother 9 (FIG. 6), and this is peeled off to form a stub bar 11 (FIG. T). Next, this stand bar 11
A record disc 12 is manufactured by heat compression molding or injection molding using the following (FIG. 8). To obtain the master T described above, a nickel solution and a borohydride compound as a reducing agent are sprayed onto the lacquer master 3 using a spray method to form a nickel film, that is, a reinforcing layer 6. In some cases, reduction products, unreacted liquid, etc. remain in the recesses, and the supply of new liquid to the surface of the coating plate becomes insufficient, resulting in the disadvantage that it becomes difficult to obtain a uniform coating.

本発明の主目的は上記のニッケルスプレィ法の欠点を回
避しようとするもので、ニッケルスプレィを行いながら
同一又は別のスプレィノズルから不活性気体を吹付け、
還元生成物や未反応液を凹部より除去しながら、ニッケ
ル薄膜を生成せしめることを特徴とする非導電性物質の
導電処理方法を提供せんとするものである。本発明によ
る方法の利点は、凹部等に残つた反応生成物や未反応液
に不活性気体を吹付け、これ等を除去しながら新しい液
を吹付けるため、常時反応速度が一定に保たれ、均一な
ニッケル薄膜が得られる。
The main objective of the present invention is to avoid the above-mentioned disadvantages of the nickel spraying method, by spraying an inert gas from the same or a separate spray nozzle while nickel spraying.
It is an object of the present invention to provide a method for conductive treatment of a non-conductive substance, which is characterized by forming a nickel thin film while removing reduction products and unreacted liquid from the recesses. The advantage of the method according to the present invention is that inert gas is sprayed onto the reaction products and unreacted liquid remaining in the recesses, etc., and new liquid is sprayed while removing these, so the reaction rate is always kept constant. A uniform nickel thin film can be obtained.

又、凹部等に発生した水素ガスや異物も除去し得るため
、ニツケル被膜のピンホールの発生を防止し得るもので
ある。次に具体的な実施例を掲げて本発明を説明しよう
Furthermore, since hydrogen gas and foreign matter generated in the recesses etc. can be removed, the occurrence of pinholes in the nickel coating can be prevented. Next, the present invention will be explained with reference to specific examples.

実施例 1 音溝4の刻設されたラツカ盤3上に、ニツケル液として
、塩化ニツケル509/11塩化アンモニウム50g/
11を、還元液としてホウ水素化ナトリウム1g/11
水酸化ナトリウム4g/lを、液温を15℃〜35℃に
、且つPH=12に調整してスプレイにより吹付けると
共に、他のスプレイにより不活性気体として窒素ガス1
〜21<g/dを吹付けて、導電層5を形成し、この導
電層5上にスルタミン酸ニツケル4009/11硼酸3
59/lを液温40℃、PH=4のメツキ液にて、0.
5〜30A/dイの電流で厚さ、0.31mの補強層6
を形成してマスター7を得た。
Example 1 Nickel chloride 509/11 ammonium chloride 50g/509/11 ammonium chloride was added as a nickel liquid onto a lacquer plate 3 in which sound grooves 4 were carved.
11, sodium borohydride 1g/11 as a reducing solution
4 g/l of sodium hydroxide was sprayed at a liquid temperature of 15°C to 35°C and a pH of 12, and 1 liter of nitrogen gas was added as an inert gas by another spray.
~21<g/d to form a conductive layer 5, and on this conductive layer 5, nickel sultamate 4009/11 boric acid 3
59/l in a plating solution with a liquid temperature of 40°C and a pH of 4.
Reinforcement layer 6 with a thickness of 0.31 m at a current of 5 to 30 A/d
was formed to obtain Master 7.

実施例 2 実施例1と同一条件で、不活性気体としてアルゴンガス
1〜2kg/Cdを吹付け、厚さ0.311の補強層6
を形成してマスター7を得た。
Example 2 Under the same conditions as Example 1, 1 to 2 kg/Cd of argon gas was sprayed as an inert gas, and a reinforcing layer 6 with a thickness of 0.311 was formed.
was formed to obtain Master 7.

上述の如く得られた本発明によるマスター7によつて、
通常のレコード原盤製造工程と同様にマザーを得、この
マザーによりスタンパ一を得てレコード盤を加熱圧縮成
型又は射出成形により製作したところ従来の方法で製作
したレコード盤に比べ原音を極めて忠実に再現し得るレ
コード盤を得ることが出来た。
With the master 7 according to the present invention obtained as described above,
A mother is obtained in the same way as in the normal record master production process, a stamper is obtained using this mother, and a record is produced by heat compression molding or injection molding, which reproduces the original sound extremely faithfully compared to records produced by conventional methods. I was able to get a record that I could do.

この理由は、マスター7を得る場合に、ニツケル液と還
元剤であるホウ水素化合物とをラツカ原盤3上に吹付け
、ニツケル薄膜を形成する時に、ラツカ盤の溝等に還元
生成物や未反応液が残つているが、これを不活性気体に
よつて溝部から吹き飛ばしつつニツケル薄膜を形成する
ために、これらが完全に除去されると共に、これに使用
するのが不活性気体であるため、未反応液等との反液も
なく、反応速度が一定に保たれ、溝に発生した水素ガス
や異物も完全に除かれて、ピンホールのないニツケル薄
膜が得られるためである。
The reason for this is that when obtaining Master 7, nickel liquid and a borohydride compound, which is a reducing agent, are sprayed onto the lacquer master disk 3 to form a thin nickel film. Although some liquid remains, this is completely removed in order to form a nickel thin film by blowing it out of the groove with an inert gas, and since an inert gas is used for this, no remaining liquid is left behind. This is because there is no reaction with the reaction solution, the reaction rate is kept constant, and hydrogen gas and foreign matter generated in the grooves are completely removed, resulting in a pinhole-free nickel thin film.

【図面の簡単な説明】[Brief explanation of the drawing]

第1乃至第8図はレコード盤の成形工程を示す工程図で
ある。 図に於て、1はアルミ盤、2はラツカ層、3はラツカ原
盤、4は音溝、5はニツケル薄膜、6は補強層、7はマ
スター、8はニツケル層、9はマザー、10はニツケル
層、11はスタンパ一、12はレコード盤である。
1 to 8 are process diagrams showing the process of molding a record disc. In the figure, 1 is an aluminum disc, 2 is a lacquer layer, 3 is a lacquer master disc, 4 is a sound groove, 5 is a nickel thin film, 6 is a reinforcing layer, 7 is a master, 8 is a nickel layer, 9 is a mother, and 10 is a The nickel layer, 11 is the stamper, and 12 is the record.

Claims (1)

【特許請求の範囲】[Claims] 1 非導電性物質にニッケル液とホウ水素化合物の還元
剤液とをスプレイ法によつて吹付け、ニッケル金属層を
形成する様にした導電処理方法に於て、ニッケル金属層
形成時に不活性気体を吹付けて反応残存物質を除去しな
がらニッケル金属層を形成することを特徴とする非導電
性物質の導電処理法。
1 In a conductive treatment method in which a nickel liquid and a reducing agent liquid of a borohydride compound are sprayed onto a non-conductive substance to form a nickel metal layer, an inert gas is used when forming the nickel metal layer. A method for conductive treatment of non-conductive materials, characterized by forming a nickel metal layer while removing residual reaction materials by spraying.
JP13021175A 1975-10-29 1975-10-29 Hidoudenseibutsutsuno Dodenshiyorihohou Expired JPS5922325B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13021175A JPS5922325B2 (en) 1975-10-29 1975-10-29 Hidoudenseibutsutsuno Dodenshiyorihohou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13021175A JPS5922325B2 (en) 1975-10-29 1975-10-29 Hidoudenseibutsutsuno Dodenshiyorihohou

Publications (2)

Publication Number Publication Date
JPS5254193A JPS5254193A (en) 1977-05-02
JPS5922325B2 true JPS5922325B2 (en) 1984-05-25

Family

ID=15028736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13021175A Expired JPS5922325B2 (en) 1975-10-29 1975-10-29 Hidoudenseibutsutsuno Dodenshiyorihohou

Country Status (1)

Country Link
JP (1) JPS5922325B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0443620Y2 (en) * 1985-12-28 1992-10-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0443620Y2 (en) * 1985-12-28 1992-10-15

Also Published As

Publication number Publication date
JPS5254193A (en) 1977-05-02

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