JPS59210935A - エポキシ樹脂用硬化剤 - Google Patents
エポキシ樹脂用硬化剤Info
- Publication number
- JPS59210935A JPS59210935A JP8499283A JP8499283A JPS59210935A JP S59210935 A JPS59210935 A JP S59210935A JP 8499283 A JP8499283 A JP 8499283A JP 8499283 A JP8499283 A JP 8499283A JP S59210935 A JPS59210935 A JP S59210935A
- Authority
- JP
- Japan
- Prior art keywords
- phenol
- epoxy resins
- curing
- hardener
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 22
- 239000000203 mixture Substances 0.000 title claims description 11
- 239000004848 polyfunctional curative Substances 0.000 title abstract 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 12
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003054 catalyst Substances 0.000 abstract description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 3
- 229930003836 cresol Natural products 0.000 abstract description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract description 2
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 abstract description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 abstract 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 21
- 239000004593 Epoxy Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- -1 phenylene diane Chemical compound 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000012756 surface treatment agent Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WEZHJSFDIFQAFL-UHFFFAOYSA-N 2-[2-(methylamino)propan-2-yl]phenol Chemical compound CNC(C)(C)C1=CC=CC=C1O WEZHJSFDIFQAFL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- XYOVOXDWRFGKEX-UHFFFAOYSA-N azepine Chemical compound N1C=CC=CC=C1 XYOVOXDWRFGKEX-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- PVWYTIFUYYJMQO-UHFFFAOYSA-N butyl(phenyl)phosphane Chemical compound CCCCPC1=CC=CC=C1 PVWYTIFUYYJMQO-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003869 coulometry Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- SWMBQMGPRYJSCI-UHFFFAOYSA-N octylphosphane Chemical compound CCCCCCCCP SWMBQMGPRYJSCI-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8499283A JPS59210935A (ja) | 1983-05-17 | 1983-05-17 | エポキシ樹脂用硬化剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8499283A JPS59210935A (ja) | 1983-05-17 | 1983-05-17 | エポキシ樹脂用硬化剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59210935A true JPS59210935A (ja) | 1984-11-29 |
| JPH0344094B2 JPH0344094B2 (enrdf_load_stackoverflow) | 1991-07-04 |
Family
ID=13846123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8499283A Granted JPS59210935A (ja) | 1983-05-17 | 1983-05-17 | エポキシ樹脂用硬化剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59210935A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0959333A (ja) * | 1995-08-21 | 1997-03-04 | Hitachi Chem Co Ltd | フェノール化合物及びその製造方法並びに熱硬化性樹脂組成物 |
| WO1997012925A1 (en) * | 1995-09-29 | 1997-04-10 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
| US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4878254A (enrdf_load_stackoverflow) * | 1972-01-20 | 1973-10-20 | ||
| JPS5491598A (en) * | 1977-12-27 | 1979-07-20 | Texaco Development Corp | Hardener for epoxy resin and rapidly hardening method of said epoxy resin |
| JPS5527364A (en) * | 1978-08-18 | 1980-02-27 | Sanyo Chem Ind Ltd | Epoxy resin curing agent |
| JPS5538836A (en) * | 1978-09-11 | 1980-03-18 | Sanyo Chem Ind Ltd | Epoxy resin curing agent |
| JPS57195119A (en) * | 1981-05-25 | 1982-11-30 | Mitsubishi Gas Chem Co Inc | Preparation of curing agent for epoxy resin |
-
1983
- 1983-05-17 JP JP8499283A patent/JPS59210935A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4878254A (enrdf_load_stackoverflow) * | 1972-01-20 | 1973-10-20 | ||
| JPS5491598A (en) * | 1977-12-27 | 1979-07-20 | Texaco Development Corp | Hardener for epoxy resin and rapidly hardening method of said epoxy resin |
| JPS5527364A (en) * | 1978-08-18 | 1980-02-27 | Sanyo Chem Ind Ltd | Epoxy resin curing agent |
| JPS5538836A (en) * | 1978-09-11 | 1980-03-18 | Sanyo Chem Ind Ltd | Epoxy resin curing agent |
| JPS57195119A (en) * | 1981-05-25 | 1982-11-30 | Mitsubishi Gas Chem Co Inc | Preparation of curing agent for epoxy resin |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0959333A (ja) * | 1995-08-21 | 1997-03-04 | Hitachi Chem Co Ltd | フェノール化合物及びその製造方法並びに熱硬化性樹脂組成物 |
| WO1997012925A1 (en) * | 1995-09-29 | 1997-04-10 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
| US5955184A (en) * | 1995-09-29 | 1999-09-21 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same |
| US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0344094B2 (enrdf_load_stackoverflow) | 1991-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201125838A (en) | Polyhydroxy compound, method for producing the same and epoxy resin composition and cured product thereof | |
| JPS59210935A (ja) | エポキシ樹脂用硬化剤 | |
| JP2003213081A (ja) | エポキシ樹脂組成物および半導体装置 | |
| JPS62290720A (ja) | 電子部品封止用エポキシ樹脂成形材料 | |
| JP2000103941A (ja) | エポキシ樹脂組成物及び半導体封止材料 | |
| JPH0733430B2 (ja) | エポキシ樹脂組成物 | |
| JP2002003577A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JPH02302421A (ja) | エポキシ樹脂組成物 | |
| JP2823632B2 (ja) | 高耐熱性エポキシ樹脂組成物 | |
| JPH10324733A (ja) | エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料 | |
| JPS6337118A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPS58225120A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JP3807188B2 (ja) | エポキシ樹脂と無機成分の複合体及びその製造方法 | |
| JPH0535175B2 (enrdf_load_stackoverflow) | ||
| JPH06841B2 (ja) | 電子部品封止用エポキシ樹脂成形材料 | |
| JP2823636B2 (ja) | 高耐熱性エポキシ樹脂組成物 | |
| JPH01313519A (ja) | エポキシ樹脂組成物およびエポキシ樹脂成型材料およびエポキシ樹脂成型体 | |
| JPH08283534A (ja) | メラミン・フェノール樹脂組成物 | |
| JPS6159328B2 (enrdf_load_stackoverflow) | ||
| JPS6241968B2 (enrdf_load_stackoverflow) | ||
| JPH0597949A (ja) | シリコーン変性フエノール類ノボラツク樹脂、樹脂組成物及び硬化物 | |
| JPH04328117A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JP3154806B2 (ja) | フェノール樹脂組成物 | |
| CN116891564A (zh) | 环氧树脂组合物及硬化物 | |
| JPS6063218A (ja) | 臭素含有ノボラック型フェノ−ル樹脂のグリシジルエ−テルおよびこれを主成分とする封止剤 |