JPS59200444A - Epoxy resin sealed type semiconductor device - Google Patents

Abstract

PURPOSE:To improve damp proof and reliability by sealing a semiconductor element with an epoxy resin composition using a resol type phenol group resin as a curing agent. CONSTITUTION:A semiconductor element is sealed with an epoxy resin composition using a resol type phenol group resin as a curing agent. Additives, such as fillers, a catalyst, etc. are mixed as required besides an epoxy resin and the resol type phenol group resin, and mixed by using a roll kneader, an attritor, and a single spindle or double spindle kneading extruder. A semiconductor device is sealed by employing transfer molding, application, casting or a compression molding method with the obtained resin group composition, and heated and cured, thus acquiring a sealed type semiconductor device. A substance containing the 5-25wt% resol type phenol group resin, molecular weight thereof is 800 or more, is preferable as a material for the resol type phenol group resin. Curability and heat-resisting property lower when the material contains not more than 5-25wt% said resin. It is preferable that the resol type phenol group resin is compounded at 0.6-1.3 equivalent to the epoxy resin.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin-sealed semiconductor device using a resol-type phenolic street resin as a curing agent.

Up to C'n, epoxy resin and novolaf as a curing agent, resin phenolic resin and no catalyst, and tertiary amines, imidazoles, and quaternary ammonium as curing accelerator. Cattle conductor devices sealed using trenches are known. CrL-covered cow body equipment requires 100% especially moisture-resistant furnace material and can be used as a sealing material up to γL.
1ffi In terms of wet injection, novolak-type enol thread resin is most convenient for epoxy resin hardening agents, and n times 0.
The reason for this is that even though the deterioration due to moisture absorption is smaller than that of the conventional method, it has better moldability.

However, in recent years, as more reliable side grease-resistant conductor devices are required, it is no longer possible to use the conventional novolac type 2-enol thread with a thick conductor. Currently, it is used several times in the process. In order to suppress any ionic impurities that may be present in the sidewall material, the residues of catalysts such as hydrochloric acid, sulfuric acid, or RI additives that are removed during the formation of the novolak phenolic resin are removed. It's for a reason. For this reason, the use of novonkurnoenol resins has become extremely disadvantageous in terms of cost.

The present invention has been developed in view of the above points.

Resol type 2 enol yarn 1 (11i*) is an epoxy resin sealing type cattle-only device featuring semi-conducting cords sheathed with an epoxy resin composition using 11i* as a hardening agent. ＾Provided with equipment exclusively for cattle.

The resol type phenolic yarn 4B Shikanodaijō uses alkali catalysts such as aimonia and slaked lime, so it has a tsukudai composition?
! When manufacturing I and L, the resin composition using novolac type phenolic side fat is acidic, whereas it is neutral to weakly alkaline, which is advantageous against corrosion of aluminum wiring of the conductor device.

What's more, it is a hardening agent for epoxy resins, which have a hydrophilic group and a methylol group in their structure, and is also a resin-type phenolic resin! is self-hardening. Therefore, compared to the case of using novolac type aenol thread resin, the amount of unreacted substances is extremely small.And, due to the reason of CN et al., the dryness and sludge properties are improved.

In addition, it is preferable that the resol type phenolic A3 fat has a molecular weight of 800 or more in an amount of 5% to 25%. The hardening properties and heat resistance of the product decrease after being crushed.

The resol-type phenolic resin that can be used in the present invention is a condensation product of phenols such as phenol, cresol, and xylenol, formaldehyde, and esters under an alkaline catalyst. et al7
To adjust the molecular weight '+c of the resol type resin, use the molar ratio of the 21-nors and formaldehyde mentioned above and the catalyst that is conveniently used. For example, ammonia, slaked lime, caustic potash, or other metal salts such as ammonia, slaked lime, caustic potash, etc. can be used. Synthesis conditions include catalyst species and catalysts.

Although it cannot be definitively determined as it varies depending on the molar ratio, etc., it is easy to determine the condensation product using a liquid chroma dog.
It is preferable to use 0.6 to 1.6 epoxy resins for 0.6 to 1.6 epoxy resins. It means pregnancy in general.The analogy is screw 2. Bisphenol thread epoxy resin obtained from c-Nor A and epichlorohydrin, novolac epoxy resin obtained by reacting epichlorohydrin with Novo 2-ink resin, alicyclic compound such as cyclohexene, cyclopentadiene, and dicyclopentadiene. Epoxy resins obtained from polyhydric alcohols such as MJ resins, epoxy resins derived from vinyl polymers, and epoxy resins derived from polyhydric alcohols such as glycerin.

A few of these people are not used.

Uninvented epoxy resin set & t4T
In addition to the epoxy resins and resol-type phenolic resins mentioned above, inorganic light additives, catalysts, mold release agents, pigments,
Combine with hexagonal treatment agent, ifJ flexibility agent +or
It's lol. Effective ones include σ inorganic fillers such as silica, glass fiber, and alumina, catalysts such as 6-class amines such as benzyldimethylamine, imidazole, and surface treatment agents such as epoxy silane. 〇 IL epoxy used in the present invention The method for producing the fat composition is to mix the epoxy side fat and resol type phenolic resin with a saturate such as the above-mentioned agent catalyst according to the need for safety. Depending on the softening point of the resin used in the kneading extruder on the shaft,
It is preferable that the depth does not exceed 10''C.

Uninvented conductor device Itrr, Uro C epoxy resin display assembly parabolic transformer 21 molded or flea IJ or acI
E, model rumor) The compression molding method is often used to seal the product, and by adding curing, it is possible to use a stopper type dedicated device for the final purpose of clothing. f180 as graded rice crop
℃~9 o'crz O~50 minutes, 11) 0~1
Grading may be carried out at 20° C. for 20 to 60 minutes, at 150° C. to 18 U° C. for 60 minutes to 50 minutes, or immediately at 15° C. to 180° C.

1c of the cow fat body device and v, s, jθ in the present invention.

When it comes to LSIs, transistors, tie autos, +/Iristors, and high frit ICs, it's hard to fall asleep at a glance.

The present invention will now be described directly in accordance with Example VC.

Book @ Meishi There are no restrictions, so there is no. Toward, below
Even though it says ``part in one case'', it is a heavy duty part.

[Example 1 and Comparative Example 1] Formaldehyde and phenol at a molar ratio of 1.08°25
% ammonia and the entire catalyst solution in a flask @ temperature while stirring? 11 - React at 90°C for 120 minutes while flowing 1M of Mege, then lower the temperature of the liquid to 70°C and concentrate under reduced pressure? I:1
It lasted 20 minutes. Thereafter, it was charcoalized to normal pressure and condensed at 105°C for 15 minutes to obtain Reno-A [phenolic resin].

Liquid Chroma Dog 2 Eye (H, L, C) manufactured by Toyoonda Co., Ltd.
Columns G5000H and G2p 00H were combined and their presence was added 0. For comparison with the above resol type phenol street resin (4), the molar ratio of formaldehyde to phenol was 1.2, caustic The reaction was carried out for 110 minutes at 94℃ as a soda catalyst, and then the temperature of the liquid was lowered to 65℃, and the autumn pressing was carried out for 110 minutes. After that, return to normal pressure,
Concentrate at 05℃ for 20 minutes to obtain resol type phenolic resin)
Jojuta. What is the molecular weight of the obtained phenol soybean paste (6)? When looking at f-1111, the resin (8) contained approximately 7 to 10% of molecules with a molecular weight of 800 or higher, and the resin (B) contained 2 to 6% of molecules with a molecular weight of 800 or higher. Each resol type phenolic resin (8), (B
) 50 parts of tic Epicoat 1011 (shell split bisphenol type epoxy Tsukuda) 100 parts, imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) 1 part, methanol 80 parts were added and stirred with bee force to completely dissolve the resin composition. Things (D
[11), rl = 0 resin composition (1), resol type phenol resin (5) (*M Example 1), (I
I) H-resol type Funol Sanitizer (B)'r (Comparative Example 1
) Gel Time Toni,
Judgment was made based on the time required for fluidity to disappear at 150°C using a hot plate as specified in JIS-C2104. A sample with a secondary transition point was dried at 85°C for 60 minutes and at 110°C for 20 minutes, and this R' was pressure molded at 150°C (pressure cuff 0 kg/a).
11') to create a cured product with a hardness of O
k, second-order transition point 1"I 'l', M, A (Ther
malMechanical Analgsis) k
Usage. To create an extract, grind the above cured product at 121°C.
, and extracted with distilled water under 2 atm.

The resin composition (1) has a crystalline hardness and a secondary transition point (in addition, the lees of the extracted water bath liquid is also good) compared to the resin composition (II).

[Comparative Example 2] Formalin to phenol molar ratio a79. hydrochloric acid,#:
Using an acidic catalyst and stirring in a flask at 80℃ for 90 minutes,
The reaction was carried out at 100°C for 60 minutes under reflux, then heated and dehydrated under reduced pressure. When the temperature of the contents reached 160°C, Q was removed to obtain a Novo 2-type phenol fat (Q). Phenol resin (025 to 100 to epoxy resin Epicoat 1001 as in Example 1 and Comparative Example 1).

Imidazole C11Z11fi,) fi/-b 150 parts, completely dissolved in the mouth, and the resin composition (ill)...
Comparative Example 2 Characteristics of this resin a paraboloid (1) are also listed in Table 1. Comparison 9IJ2 resin composition gJ mark]
Compared to Example 1, the gel time was shorter and the hardness was lower.

Although it is equivalent to the second-order transition point, the field of the extracted water is acidic and the electrical conductivity is about twice that of the resin composition according to the present invention (*flow side 1).

# of fallen bottles in Example 1 and Comparative Examples 1 and 2! i parabola (1) ~
(Lit) K was used to seal Test Teds (FC type with aluminum wiring pattern formed), and its reliability was evaluated. After molding, drop it directly onto the testeg to a thickness of 1 m [11] and heat it at 85°C for 50 minutes and at 110°C for 20 minutes Yf1. Shun Toko, 50 at normal pressure 150℃
It was hardened. Table 2 shows the results of the wiring tests conducted at 121°C and 2 atmospheres of steam under 2 atmospheres of water vapor. Example 1
), it can be seen that it is resistant to moisture resistance tests even after one night.

[Example 2 and Comparative Example 6] The resol type phenolic resin (2) prepared in Example 1
4) 45 parts to 100 parts of EOCN102 (product name of Novolac type epoxy resin manufactured by Nippon Kagakusha) catalyst imidazole Cl
72 (Shikokuka M, manufactured by Co., Ltd.) 1.5 parts, 600 parts of silica powder, 2 parts of carnauba wax, and mixed with a pressure kneader for 60 parts.
A semi-solid epoxy backfat composition (
IV) (Example 2) A busy work was done. In Comparative Example 2, 45 parts of Novo 2-type phenol 1M fat (C) was added to l'Fi,
60 to 80 after applying the same material used in Example 2
Kneaded for 6 to 7 minutes with a hot roll, cooled and crushed to make epoxy resin m-acid [■] (Comparative Example 6).
7 Cocon et al. Epoxy resin composition (IV) (V) to 1
It was molded at 170° C. to 180° C. for 2 minutes at a pressure cuff of 0 kg/an′, and its reliability was evaluated using a test chip as in Example 1. Reduced size table - 6 is voted. The test method was to leave it under water vapor at 121°C and 2 atm. Semiconductor devices TIt sealed with the epoxy resin composition according to the present invention from Tatsu-6 were subjected to a moisture resistance test similar to the results in Table 2. Extremely good quality Merugawa Sword 0 Table 2 Table 6 *2 The numerator is the number of defects and the denominator is the total number.

As shown above, the cattle-dedicated device t of the present invention has excellent side heat properties and reliability.

Claims (1)

[Claims] 1. An epoxy resin-sealed semiconductor package with a resol-type phenolic side fat and an epoxy resin composition as a hardening agent, which is used to seal conductor elements and grape ridges.