JPS59196119A - ばり取り装置 - Google Patents

ばり取り装置

Info

Publication number
JPS59196119A
JPS59196119A JP7064583A JP7064583A JPS59196119A JP S59196119 A JPS59196119 A JP S59196119A JP 7064583 A JP7064583 A JP 7064583A JP 7064583 A JP7064583 A JP 7064583A JP S59196119 A JPS59196119 A JP S59196119A
Authority
JP
Japan
Prior art keywords
scraper
flash
scrapers
semiconductor device
boss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7064583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0425088B2 (enrdf_load_stackoverflow
Inventor
Katsuichi Inagaki
稲垣　勝一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IDEYA KK
Original Assignee
IDEYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IDEYA KK filed Critical IDEYA KK
Priority to JP7064583A priority Critical patent/JPS59196119A/ja
Publication of JPS59196119A publication Critical patent/JPS59196119A/ja
Publication of JPH0425088B2 publication Critical patent/JPH0425088B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP7064583A 1983-04-21 1983-04-21 ばり取り装置 Granted JPS59196119A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7064583A JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7064583A JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Publications (2)

Publication Number Publication Date
JPS59196119A true JPS59196119A (ja) 1984-11-07
JPH0425088B2 JPH0425088B2 (enrdf_load_stackoverflow) 1992-04-28

Family

ID=13437589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7064583A Granted JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Country Status (1)

Country Link
JP (1) JPS59196119A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6629880B1 (en) * 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
CN110576225A (zh) * 2019-09-25 2019-12-17 赣州经纬科技股份有限公司 一种去除毛刺设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5620169U (enrdf_load_stackoverflow) * 1979-07-24 1981-02-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5620169U (enrdf_load_stackoverflow) * 1979-07-24 1981-02-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6629880B1 (en) * 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
CN110576225A (zh) * 2019-09-25 2019-12-17 赣州经纬科技股份有限公司 一种去除毛刺设备

Also Published As

Publication number Publication date
JPH0425088B2 (enrdf_load_stackoverflow) 1992-04-28

Similar Documents

Publication Publication Date Title
US3090061A (en) Brush and brush material
JPS59196119A (ja) ばり取り装置
JP2001522718A (ja) 改良されたリブ構成を有する加工物洗浄要素
JP2017140609A (ja) タイヤ内表面のレーザークリーニング法及びタイヤ
JP2717228B2 (ja) 粉末プレス成型品バリ取り装置
WO1986001984A1 (en) Methods of making brushes, and brushes thus made
US3722022A (en) Rotating paint scraper
JPH09275090A (ja) ウェハーの洗浄装置
US1906809A (en) Powdering brush
RU2002127419A (ru) Устройство для нанесения гальванического покрытия и способ нанесения гальванического покрытия
CN211794839U (zh) 一种不会对口红造成损坏的成型模具取出结构
TWI400050B (zh) 洗淨筷、洗淨筷之製造方法及樹脂賦予裝置
JP6768166B2 (ja) 型枠の洗浄方法及びセラミックス成形体の製造方法
JP2008212770A (ja) 基板洗浄ブラシ
CN210907055U (zh) 一种虫草清洗机
JPH06278043A (ja) 成形品の研磨ブラシ及び研磨方法
JPS6337869Y2 (enrdf_load_stackoverflow)
JPH0134546Y2 (enrdf_load_stackoverflow)
US2303276A (en) Process and means for abrading bodies
JP6864351B2 (ja) 粉粒体分割装置
JPS58208958A (ja) テープ走行ガイドシャフトの製造方法
JP4562584B2 (ja) 円筒形フィンガーコンタクトの銀めっき仕上げ方法
JPH0129054Y2 (enrdf_load_stackoverflow)
JPH10113600A (ja) 鈑金面歪み部分のパテ整形方法
JPS63167447A (ja) デイスク製造方法