JPH0425088B2 - - Google Patents

Info

Publication number
JPH0425088B2
JPH0425088B2 JP58070645A JP7064583A JPH0425088B2 JP H0425088 B2 JPH0425088 B2 JP H0425088B2 JP 58070645 A JP58070645 A JP 58070645A JP 7064583 A JP7064583 A JP 7064583A JP H0425088 B2 JPH0425088 B2 JP H0425088B2
Authority
JP
Japan
Prior art keywords
scraper
deburring
burrs
tip
scrapers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58070645A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59196119A (ja
Inventor
Katsuichi Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IDEYA KK
Original Assignee
IDEYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IDEYA KK filed Critical IDEYA KK
Priority to JP7064583A priority Critical patent/JPS59196119A/ja
Publication of JPS59196119A publication Critical patent/JPS59196119A/ja
Publication of JPH0425088B2 publication Critical patent/JPH0425088B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP7064583A 1983-04-21 1983-04-21 ばり取り装置 Granted JPS59196119A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7064583A JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7064583A JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Publications (2)

Publication Number Publication Date
JPS59196119A JPS59196119A (ja) 1984-11-07
JPH0425088B2 true JPH0425088B2 (enrdf_load_stackoverflow) 1992-04-28

Family

ID=13437589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7064583A Granted JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Country Status (1)

Country Link
JP (1) JPS59196119A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6629880B1 (en) * 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
CN110576225B (zh) * 2019-09-25 2020-06-30 赣州经纬科技股份有限公司 一种去除毛刺设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727020Y2 (enrdf_load_stackoverflow) * 1979-07-24 1982-06-11

Also Published As

Publication number Publication date
JPS59196119A (ja) 1984-11-07

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