JPS59191338A - ワイヤボンダ用ツ−ル - Google Patents

ワイヤボンダ用ツ−ル

Info

Publication number
JPS59191338A
JPS59191338A JP58066221A JP6622183A JPS59191338A JP S59191338 A JPS59191338 A JP S59191338A JP 58066221 A JP58066221 A JP 58066221A JP 6622183 A JP6622183 A JP 6622183A JP S59191338 A JPS59191338 A JP S59191338A
Authority
JP
Japan
Prior art keywords
ball
chamfer
tapered
tool
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58066221A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03780B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tomio Kobayashi
十三男 小林
Hiroshi Ushiki
博 丑木
Masashi Kawamoto
川本　昌司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58066221A priority Critical patent/JPS59191338A/ja
Publication of JPS59191338A publication Critical patent/JPS59191338A/ja
Publication of JPH03780B2 publication Critical patent/JPH03780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4845—Details of ball bonds
    • H01L2224/48451—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78305—Shape of other portions
    • H01L2224/78306—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58066221A 1983-04-14 1983-04-14 ワイヤボンダ用ツ−ル Granted JPS59191338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58066221A JPS59191338A (ja) 1983-04-14 1983-04-14 ワイヤボンダ用ツ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066221A JPS59191338A (ja) 1983-04-14 1983-04-14 ワイヤボンダ用ツ−ル

Publications (2)

Publication Number Publication Date
JPS59191338A true JPS59191338A (ja) 1984-10-30
JPH03780B2 JPH03780B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-08

Family

ID=13309559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58066221A Granted JPS59191338A (ja) 1983-04-14 1983-04-14 ワイヤボンダ用ツ−ル

Country Status (1)

Country Link
JP (1) JPS59191338A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886200A (en) * 1988-02-08 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Capillary tip for bonding a wire
JPH0231438A (ja) * 1988-07-20 1990-02-01 Hitachi Ltd 半導体装置の製造方法。
US4974767A (en) * 1988-04-25 1990-12-04 Texas Instruments Incorporated Double cone wire bonding capillary
US5662261A (en) * 1995-04-11 1997-09-02 Micron Technology, Inc. Wire bonding capillary
US5884830A (en) * 1996-08-21 1999-03-23 Kabushiki Kaisha Shinkawa Capillary for a wire bonding apparatus
US5938105A (en) * 1997-01-15 1999-08-17 National Semiconductor Corporation Encapsulated ball bonding apparatus and method
US6065667A (en) * 1997-01-15 2000-05-23 National Semiconductor Corporation Method and apparatus for fine pitch wire bonding
US6165888A (en) * 1997-10-02 2000-12-26 Motorola, Inc. Two step wire bond process
US6213378B1 (en) 1997-01-15 2001-04-10 National Semiconductor Corporation Method and apparatus for ultra-fine pitch wire bonding
US6325269B1 (en) 1997-12-19 2001-12-04 Toto Ltd. Wire bonding capillary
US6581816B2 (en) * 2000-04-11 2003-06-24 Stmicroelectronics S.R.L. Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device
JP2007182256A (ja) * 2005-12-08 2007-07-19 Hitoshi Takahashi キャップ付き容器およびキャップ具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5670644U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-10-31 1981-06-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5670644U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-10-31 1981-06-11

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886200A (en) * 1988-02-08 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Capillary tip for bonding a wire
US4974767A (en) * 1988-04-25 1990-12-04 Texas Instruments Incorporated Double cone wire bonding capillary
JPH0231438A (ja) * 1988-07-20 1990-02-01 Hitachi Ltd 半導体装置の製造方法。
US5662261A (en) * 1995-04-11 1997-09-02 Micron Technology, Inc. Wire bonding capillary
US5884830A (en) * 1996-08-21 1999-03-23 Kabushiki Kaisha Shinkawa Capillary for a wire bonding apparatus
US5938105A (en) * 1997-01-15 1999-08-17 National Semiconductor Corporation Encapsulated ball bonding apparatus and method
US6065667A (en) * 1997-01-15 2000-05-23 National Semiconductor Corporation Method and apparatus for fine pitch wire bonding
US6213378B1 (en) 1997-01-15 2001-04-10 National Semiconductor Corporation Method and apparatus for ultra-fine pitch wire bonding
US6165888A (en) * 1997-10-02 2000-12-26 Motorola, Inc. Two step wire bond process
US6325269B1 (en) 1997-12-19 2001-12-04 Toto Ltd. Wire bonding capillary
US6581816B2 (en) * 2000-04-11 2003-06-24 Stmicroelectronics S.R.L. Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device
JP2007182256A (ja) * 2005-12-08 2007-07-19 Hitoshi Takahashi キャップ付き容器およびキャップ具

Also Published As

Publication number Publication date
JPH03780B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-08

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