JPS5918677Y2 - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS5918677Y2
JPS5918677Y2 JP1980113385U JP11338580U JPS5918677Y2 JP S5918677 Y2 JPS5918677 Y2 JP S5918677Y2 JP 1980113385 U JP1980113385 U JP 1980113385U JP 11338580 U JP11338580 U JP 11338580U JP S5918677 Y2 JPS5918677 Y2 JP S5918677Y2
Authority
JP
Japan
Prior art keywords
capillary
cam
arm
lever
cam lever
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980113385U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5737250U (enrdf_load_stackoverflow
Inventor
宏一 千葉
隆夫 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1980113385U priority Critical patent/JPS5918677Y2/ja
Publication of JPS5737250U publication Critical patent/JPS5737250U/ja
Application granted granted Critical
Publication of JPS5918677Y2 publication Critical patent/JPS5918677Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1980113385U 1980-08-12 1980-08-12 ワイヤボンデイング装置 Expired JPS5918677Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980113385U JPS5918677Y2 (ja) 1980-08-12 1980-08-12 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980113385U JPS5918677Y2 (ja) 1980-08-12 1980-08-12 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5737250U JPS5737250U (enrdf_load_stackoverflow) 1982-02-27
JPS5918677Y2 true JPS5918677Y2 (ja) 1984-05-30

Family

ID=29474404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980113385U Expired JPS5918677Y2 (ja) 1980-08-12 1980-08-12 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5918677Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130433A (ja) * 1983-01-17 1984-07-27 Toshiba Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
JPS5737250U (enrdf_load_stackoverflow) 1982-02-27

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