JPS59184599A - Part mounting device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a component mounting device that can mount a plurality of types of electronic components having different shapes, sizes, etc.

[Background technology and its problems]

Conventional component mounting apparatuses include those that are equipped with one type of suction nozzle unit for suctioning electronic components, and those that are equipped with multiple types of suction nozzle units.

In the former case, there is a problem in that the types of electronic components that can be mounted (for example, chip-shaped ICs, tantalum capacitors, etc.) are limited to those that can be picked up by one suction nozzle unit.

Further, even in the latter case, since a plurality of suction nozzle units (Y) are prepared and are replaced, there is a problem in that it takes an extremely long time to replace the suction nozzle units.

Furthermore, in any case with conventional devices, electronic components are picked up by suction with a suction nozzle unit, and the electronic components are transported from the pick-up position to the installation position using only the suction force.
There were problems such as the center position shifting due to the inertia of the electronic components during transportation.

[Purpose of the invention]

The present invention has been made in view of the above points, and provides a component mounting device that can mount a plurality of types of electronic components having different shapes, sizes, etc., without shifting their center positions.

[Summary of the invention]

In order to achieve the above object, the present invention picks up an electronic component supplied to a predetermined position with a pick-up suction nozzle unit corresponding to the electronic component, holds it with a holding claw unit, and uses this holding claw unit to pick up the electronic component. From the pick-up position to the mounting position K [Since the configuration is such that electronic components are transported and mounted using a mounting suction nozzle unit compatible with electronic components, multiple types of electronic components with different shapes and sizes can be mounted without shifting their center positions. It has been made possible.

〔Example〕

FIG. 1 is a plan view schematically showing the main parts of the invention, FIG. 2 is a partially omitted side view showing an embodiment of the invention, and FIG.
Figures (a), (b), and (e) are explanatory views of the operation of the holding claw unit. Note that the holding claw unit in FIG. 2 is shown as viewed from the side in FIG. 3.

In FIG. 1, 11 to 1. is a parts feeding device, the shape,
A component supply unit 2. supplies a plurality of electronic components E, ~E, of different sizes, etc. ~2. and the transported electronic components E1~
The table 3. shown in FIG. ~ Consists of 3B.

11 is a pick-up suction nozzle unit (hereinafter simply referred to as a suction nozzle unit) 121-12. corresponding to the electronic components E, ~E. In the pickup device equipped with
~3. Correspondingly, as shown in FIG. 2, the suction nozzle 13. ~1
3. and suction nozzle 13. -131I supporting rod 14. ~14° is biased upward in FIG. 2 by a spring (not shown).

21, to 218 are the suction nozzles 13. FIG. 2 shows a holding claw unit that positions and holds electronic components E, ~E, which were picked up at ~13 degrees, front, rear, left, and right.

As shown in FIG. 3, the operating rod 22 and the holding piece 23.2 which expands the holding pawl 24.24 when the operating rod 22 is pushed down.
3, and the holding piece 2 so that the holding claws 24 and 24 are always closed.
3.23 consists of a spring 25 that biases the spring 25. Note that the holding claw unit 21° to 21. is the supplied electronic component E
All types 1 to E can be retained. Further, the operating rod 22 is biased upward in FIG. 2 by a spring (not shown). 31 is a first index table in which the holding claw units 211 to 218 are arranged on a concentric circle at equal intervals, and 22 holding claws at the pick-up position holding electronic components E, -E, 21. ~216Yfe1st & (Holding claw unit 21.
position)) K is rotated and conveyed.

41, ~41. is the suction nozzle unit 12° to 12
．． The same attachment suction/slip unit (hereinafter referred to as
It is simply called a suction nozzle unit. ), the electronic components E, ~E, conveyed to the mounting position are suctioned and mounted on the board P shown in FIG. 2, and as shown in FIG.
~42. and suction nozzle 42. ~42Il'e Supporting rods 431~43. Consists of. In addition, the support rod 43
1 to 43 degrees is biased upward in FIG. 2 by a spring (not shown). 51 is the suction nozzle unit 411~
41. The second grid is arranged concentrically at equal intervals. In addition, holding claw, suction nozzle unit)21. .

Mounting positions were provided on both sides of the suction nozzle unit 41.41m, but as can be seen from FIG. The mounting position on both sides matches.

In FIG. 2, 61 is an electronic component E on the board P.

～E, is attached to the suction nozzle unit 4 in Figure 1.
This is an XY table device for positioning at position 11.

71 is the component supply section f111□~13, the pickup device 11, the holding claw units 21□~218, the first and second
Index table 31.51. A control device that drives the suction nozzle units 411' to 416 and the XY table device f1161v transmits the driving force of the motor T2 to the cam 73 and the first and second index tables 31.51 using a clutch (not shown), and 74. ~74. and 1st. The second index table 31.51 is operated and rotated.

In FIG. 2, suffixes are omitted from the symbols as necessary, and suffixes will be omitted in the following description unless necessary.

Next, the operation of the parts supply device of the present invention will be explained.

The motor 72 is rotated by the control device 1l171, and one of the component supply devices 11, for example, the component supply device 1. When the electronic component E is supplied from the component supply section 2m, the electronic component E is transported by compressed air or the like, and is positioned in the front-rear direction on the table 3. This positioned electronic component E operates the cam T3 by operating one of the clutches that transmits the driving force of the motor 72, and the operating rod 74. ．． 7
4. Pick up device [11 suction nozzle unit 12]
When all of the retaining claw units 21Y facing the holding claw units 21Y are pushed down and then raised by the biasing force of the spring, they are sucked by the suction nozzle 13 that has started suction and raised, and the left and right sides are positioned by the holding claw units 21, i.e. It is held with the front, rear, left and right positions in place. Then, when the holding claw unit 21 holds the electronic component E, the suction of the suction nozzle 13 is released.

To explain in detail how to suck and hold the electronic component E, the holding claw unit 21 is in the state shown in FIG. 3(a) before the suction nozzle 13 starts suction and the suction nozzle unit 12 descends. When the unit 12 begins to descend, the operating rod 74. As the operating rod 22 is pushed down, the holding pieces 23.23 rotate in the direction of the arrow about the point Al, and enter the state shown in FIG. 3(b) in which the electronic component E to be supplied can be held.

In this state, when the suction nozzle unit 12 suctions and rises to the position indicated by the dotted line, the electronic component E', the pressing force of the operating rod 22 is released and the holding pieces 23 and 23 are rotated in the direction of the arrow by the biasing force of the spring 25. 3(e), the electronic component E is held in the holding claw 24.
Hold at 24.

In this state, the first. Second index tagle 3
1. Operate the clutches for rotating the holding claw units 21. A suction nozzle unit 41 compatible with electronic component EK is rotated to a mounting position while detecting the position. At the same time, the XY table device 161 operates to determine the mounting position of the board P. In addition, electronic parts EK
When the corresponding suction nozzle unit 41 is in the mounting position, the second index table 51 rotates (5.

When the holding claw and the suction nozzle unit 21°41 are in the mounting position as described above, the aforementioned clutch operates again to operate the cam 73, and the operating rod T43°74 moves the holding claw,
The electronic component E can be mounted on the cream solder or adhesive of the board P by pressing down the suction nozzle 21.41 and then lifting it up with the biasing force of the spring. Incidentally, the mounting operation of the electronic component E can be performed by operating each part in the opposite manner to the explanation in FIG. 3.

Thereafter, electronic components E can be sequentially mounted on the board P in the same manner. Therefore, since the electronic component E is held and transported by the holding claw unit 21 from the pick-up position to the mounting position, the electronic component E is transferred to the board P without shifting the center position.
It can be installed with high precision. In addition, the suction nozzle unit 12
．． 411- Since it is provided to correspond to a plurality of electronic components EK, a plurality of electronic components E can be quickly mounted by selecting an arbitrary suction nozzle unit 41 to a mounting position.

In the above explanation, the electronic components E are mounted one by one, but the cam 73 operates all the operating rods 74 to hold the electronic component E on one side and mount the electronic component E on the other. Various controls such as driving by the control device 71 can be performed. Further, even if there is only one holding claw unit 21, the electronic component E can be mounted by operating in the same manner. Furthermore, the cam 73 operated the operating rod 74 to operate the suction nozzle and the holding claw units 12, 21 and 41, but if each of them could be operated as described above, the cam 73. A mechanism other than the operating rod 74 may be used. Also, 1st. Second index table 31
□ and 51 may be rotated by respective dedicated motors.

〔Effect of the invention〕

As explained above, the component mounting device of the present invention picks up electronic components with a pick amplifier suction nozzle unit compatible with electronic components, holds them with a holding claw unit, and in this state transports the electronic components to the mounting position and removes the electronic components. Since it is configured to be mounted using a suction nozzle unit for mounting that corresponds to the component, electronic components can be mounted with high accuracy without shifting or shifting the center position. Also, the wearing position! By selecting a suction nozzle unit for mounting that is compatible with electronic components, it is possible to mount multiple electronic components, which has the advantage of being able to quickly mount multiple electronic components.

[Brief explanation of the drawing]

FIG. 1 is a plan view schematically showing the main parts of the invention, FIG. 2 is a partially omitted side view showing an embodiment of the invention, and FIG.
Figures (a), (b), and (c) are explanatory views of the operation of the holding claw unit. In the figure, 11 to 111 are component supply devices, 11 is a pickup device, and 211 to 21. 31 is the holding claw unit, and 31 is the first
index table, 41. ~41° is the attachment suction nozzle unit, 51 is the second index table, 61
is an XY table device, 71 is a control device, 72 is a motor,
73 is a cam, 741 to 744 are operating rods, E, to E are electronic components, and P is a board. Procedural amendment (self-effected February 14, 1980, Director General of the Patent Office 1, Indication of the case, Patent Application No. 58-0'58655 2, Title of the invention: Component mounting device 3, Person making the amendment. Relationship with the case: Patent Applicant Address: 6-7-35, Kitashina-yo, Tokyo Parts-Yo-ku Name (2)
18) Sony Corporation Representative Norio Ohga 4, Agent Address: 6F, Okunomatsu Building, 31-16 Sakurago-cho, Shibuya-ku, Tokyo 150 Japan Kobayashi Patent Office Telephone: 03 (496) 1256-5, Amendment Claims column and Detailed Description of the Invention column 6 of the subject specification, Contents of amendment (1) The claims of the specification are amended as shown in the attached sheet. (2) On page 4, line 2 of the specification, the phrase ``As constituted,'' should be amended to ``As constituted.'' (3) Also on page 7, lines 7-8, “Suction nozzle unit 4
11 to 418" is replaced with "Suction nozzle unit 41
1 to 415". Above 2, Claims: A plurality of component supply devices that supply electronic components with different glossy shapes to predetermined positions, and the electronic component that sucks and picks up the electronic components from the plurality of component supply devices. a pickup device provided with a plurality of pick-up suction nozzle units compatible with 0-missing; a holding claw unit that holds the electronic component picked up by the pickup device at its pick-up position; a first index table that transports the electronic component from the position to the mounting position; and a plurality of mountings corresponding to the electronic component zero-missing state that sucks the electronic component from the holding claw unit at the mounting position and mounts it on the board. suction nozzle unit for
a second index table for arranging the mounting suction nozzle unit concentrically and transporting it to the mounting position; an xY table device for positioning the substrate; the component supply device, the pickup device, the holding claw unit;
the first index table, the attachment suction nozzle unit, the second index table, and the x
A component mounting device comprising a control device that controls a Y table device, and mounting the electronic component at a predetermined position on the board.

Claims (1)

[Scope of Claims] A plurality of component supply devices that supply different electronic components to their respective assigned positions, and a plurality of pick amplifiers corresponding to the electronic components that suck and pick up the electronic components from the plurality of component supply devices. a pickup device provided with a suction nozzle unit; a holding claw unit that holds the electronic component picked up by the pickup device at the picking position; and a holding claw unit that transports the holding claw unit from the picking position to the mounting position of the electronic component. 1 index table, a plurality of mounting suction nozzle units corresponding to the electronic components to be mounted on the board by suctioning the electronic components from the holding claw unit at the mounting position, and the mounting suction nozzle units v concentrically shaped. a second index table that is placed in the board and transported to the mounting position, an XY table device that positions the board, the component supply device, and the pink 7
a pick device, the holding claw unit, the first index table, and the attachment suction nozzle unit. A component mounting device comprising a control device for controlling the second index table and the XY table device, and mounting the electronic component at a predetermined position on the board.