JP2024100394A - Electronic component mounting equipment - Google Patents

Abstract

An electronic component mounting apparatus is provided that can accommodate the miniaturization of electronic components and improve productivity.
[Solution] An electronic component mounting device 1 that mounts electronic components 112 on a wiring board A, comprising a wiring board support table 10 that supports the wiring board A, a tray loading table 20 on which a tray 110 containing a plurality of electronic components 112 is placed, and a transfer head 30 that picks up the electronic components 112 from the tray 110 and mounts them on the wiring board A.
[Selected Figure] Figure 6

Description

The present invention relates to an electronic component mounting device that mounts electronic components on a wiring board.

Wafer surfaces are divided by planned division lines into multiple devices such as ICs and LSIs, and are then divided into individual device chips to form electronic components that are then mounted on wiring boards for mobile phones, personal computers, televisions, etc.

An electronic component mounting device that mounts electronic components on a wiring board is equipped with a reel set in which multiple tape feeders are arranged side by side, each tape feeder being configured by winding an electronic component storage tape on which multiple electronic components are stored, around a reel, and is configured to suck and hold the required electronic components from the electronic component storage tape that is intermittently fed out using a transfer head and mount them on the wiring board (see, for example, Patent Documents 1 and 2).

Japanese Patent Application Publication No. 10-229298 Japanese Patent Application Publication No. 05-175700

However, in an electronic component mounting device that uses the above-mentioned reel set, when the electronic components stored in the tape feeder run out or when the tape feeder is replaced with one storing a different type of electronic component, the operation of the electronic component mounting device must be stopped, resulting in poor productivity.

In addition, there is a limit to the number of tape feeders that can be installed side by side, and the existing tape feeders must be frequently replaced with tape feeders that store different types of electronic components, making the replacement process tedious and troublesome.

In addition, despite the advancement of miniaturization of electronic components, regulations on the feed pitch of the electronic component storage tape, etc., limit the miniaturization of reel sets, which places a limit on productivity improvements.

The present invention was developed in consideration of the above facts, and its main technical objective is to provide an electronic component mounting device that can flexibly respond to the miniaturization of electronic components and improve productivity.

To solve the above-mentioned main technical problem, the present invention provides an electronic component mounting device that mounts electronic components on a wiring board, the electronic component mounting device including a wiring board support table that supports the wiring board, a tray placement table that places a tray containing a plurality of electronic components, and a transfer head that picks up electronic components from the tray and mounts them on the wiring board.

The tray placement table is preferably loaded with a plurality of trays for each type of electronic component, and the transfer head picks up the necessary electronic components from the tray containing the electronic components and mounts them on the wiring board. The tray is preferably provided with a sheet having a tack force, and the plurality of electronic components are temporarily fixed by the tack force. The electronic component mounting device of the present invention may also be provided with a tray storage rack for storing a plurality of trays, and a tray transport means for transporting the necessary tray from the tray storage rack to the tray placement table. The tray is preferably provided with an identification mark corresponding to the type of electronic component to be stored, and the necessary tray is preferably transported from the tray storage rack to the tray placement table by the tray transport means by reading the identification mark. Furthermore, a reel set containing a plurality of electronic components may be provided adjacent to the transfer head, and the transfer head may pick up the necessary electronic components from the reel set and mount them on the wiring board.

The electronic component mounting device of the present invention includes a wiring board support table that supports a wiring board, a tray placement table that places a tray containing multiple electronic components, and a transfer head that picks up electronic components from the tray and mounts them on the wiring board. Since electronic components are picked up from the tray containing the electronic components and mounted on the wiring board, the electronic components to be mounted can be easily changed by replacing or adding trays, and there is no need to stop the operation of the device as in the past, or the frequency of stopping is reduced, improving productivity. In addition, even if electronic components become smaller, electronic components can be densely accommodated on the tray, and it can respond to the miniaturization of electronic components. In particular, according to a configuration in which electronic components are temporarily fixed to the tray by a sheet having a tack force, it is possible to accommodate a large number of small electronic components without the need to provide partitions, and flexibility in mounting electronic components on the wiring board is further improved.

1 is an overall perspective view of an electronic component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a perspective view of a tray containing electronic components. FIG. 13 is a perspective view showing a mode in which a tray is removed from a tray storage rack. FIG. 13 is a perspective view showing a state in which a tray is placed on a tray placement table. 11 is a perspective view showing a state in which a tray is placed on a tray placement table and electronic components can be mounted on a wiring board. FIG. FIG. 13 is a perspective view showing a manner in which an electronic component is picked up from a tray. FIG. 2 is a perspective view showing a manner in which an electronic component is mounted on a wiring board. FIG. 13 is a perspective view showing a manner in which an electronic component is picked up from a reel set.

The following describes in detail an embodiment of an electronic component mounting device constructed based on the present invention, with reference to the attached drawings.

1 shows an overall perspective view of the electronic component mounting device 1 of this embodiment. The illustrated electronic component mounting device 1 includes a wiring board support table 10 that supports a wiring board A on which electronic components are mounted, a tray placement table 20 on which a tray containing multiple electronic components is placed, and a transfer head 30 that picks up electronic components from the tray and mounts them on the wiring board A. In the illustrated embodiment, a tray storage rack 40 that stores multiple trays and a tray transport means 50 that transports the required tray from the tray storage rack 40 to the above-mentioned tray placement table 20 are provided, and a reel set 60 containing multiple electronic components is provided adjacent to the transfer head 30. The electronic component mounting device 1 is provided with a control means (not shown), and each operating unit is controlled by the control means, and the transfer head 30 picks up the required electronic components from the tray and reel set 60 and mounts them on the wiring board A. The arrangement of the tray storage rack 40, tray transport means 50, and reel set 60 described above is optional.

The wiring board support table 10 comprises a first X-axis moving rail 11, a first moving base 12, and a first Y-axis moving rail 13 arranged on the first moving base 12 and holding the wiring board support table 10. The first moving base 12 is movable in the X-axis direction along the guide groove 11a of the first X-axis moving rail 11, and is positioned at any position in the X-axis direction by a driving means (not shown). The wiring board support table 10 is movable in the Y-axis direction along the guide groove 13a of the first Y-axis moving rail 13, and is positioned at any position in the Y-axis direction by a driving means (not shown). A suction portion (not shown) is formed on the upper surface 10a of the wiring board support table 10, and suction-holds the wiring board A.

The transfer head 30 is disposed at a position adjacent to the wiring board support table 10 in the Y-axis direction. The transfer head 30 includes a second X-axis moving rail 31, a second moving base 32, and a transport arm 33 disposed on the second moving base 32. The second moving base 32 can move in the X-axis direction along the guide groove 31a of the second X-axis moving rail 31, and is positioned at any position in the X-axis direction by a driving means (not shown). The transport arm 33 includes a lifting rod 33a, a horizontal arm 33b extending horizontally from the upper end of the lifting rod 33a, and a suction portion 33c formed at the tip of the horizontal arm 33b, and is provided with suction nozzles 34, 34 on the lower surface side of the suction portion 33c. In the illustrated embodiment, two suction nozzles 34, 34 are provided, but the present invention is not limited to this, and the number of suction nozzles may be one or three or more. The suction nozzle 34 is connected to a suction means (not shown) and can suction an electronic component to the tip of the suction nozzle 34. The suction nozzle 34 is configured to extend downward when suctioning and mounting an electronic component. The transport arm 33 can be rotated by a driving means (not shown) housed inside the second moving base 32 and is controlled so that it can be raised and lowered freely in the Z-axis direction (up and down direction).

The tray loading table 20 is disposed in the Y-axis direction facing the wiring board support table 10, sandwiching the transfer head 30. The illustrated tray loading table 20 includes a table base 21 and multiple (four in the illustrated embodiment) table bodies T1 to T4 on the upper surface 22 of the table base 21. The table bodies T1 to T4 are configured to be movable to any position in the Y-axis direction by a driving means (not shown) along guide grooves 22a to 22d formed in the upper surface 22 of the table base 21. A number of pins P are arranged on the table bodies T1 to T4 for positioning and holding the trays containing electronic components.

As shown in FIG. 1, the electronic component mounting device 1 of this embodiment includes a tray storage rack 40 that stores multiple trays, and a tray transport means 50 that removes the required tray from the tray storage rack 40 and transports it to the tray placement table 20. The tray removed from the tray storage rack 40 by the tray transport means 50 is placed on one of the table bodies T1 to T4.

2 shows an example of a tray (tray 110) stored in the above-mentioned tray storage rack 40. The tray 110 has a front wall 110a, a rear wall 110b, a side wall 110c, and a side wall 110d on the outer periphery of a rectangular bottom wall 114. An adhesive sheet having a tack force is arranged on the bottom wall 114, and a plurality of electronic components 112 are temporarily fixed and stored by the tack force. An identification mark 116 corresponding to the type of electronic components to be stored is arranged on the front wall 110a of the tray 110. The identification mark 116 is formed, for example, by a bar code, a matrix type two-dimensional code, a number, a symbol, etc. The type of electronic components 112 stored in the tray 110 can be determined by reading the identification mark 116 by a detection means arranged, for example, in the tray transport means 50, and the required tray is selected from the tray storage rack 40 and transported to a predetermined table body of the tray loading table 20. The above-mentioned identification mark 116 can be provided not only on the front wall 110a, but also on the rear wall 110b, side wall 110c, and side wall 110d, and in this embodiment, the identification mark 116 is also provided on the rear wall 110b.

As shown in FIG. 1, the tray storage rack 40 is formed with multiple shelves 40a-40e, and multiple trays containing electronic components are stored on each shelf. In principle, the multiple trays have the same configuration as the tray 110 described above. Note that in FIG. 1, for convenience of explanation, the electronic components stored in the multiple trays are shown with the same shape as the electronic component 112 described above, but in reality, different types of electronic components are stored in each tray. For example, tray 120 stores electronic component 122, tray 130 stores electronic component 132, and tray 140 stores electronic component 142, and each tray is given an identification mark (e.g., a barcode) according to the type of electronic component. The shelves 40a-40e are also open on the back side, so that trays can be replaced or added from the back side even while the electronic component mounting device 1 is operating.

With reference to Fig. 1 and Figs. 3 and 4, the tray transport means 50 will be described, and a mode of operating the tray transport means 50 to transport a desired tray 110 from the tray storage rack 40 will be described. The tray transport means 50 includes a third moving base 52 that moves in the X-axis direction along the guide groove 51a of the third X-axis moving rail 51, a lifting rod 53 arranged on the third moving base 52 and arranged so as to be lifted and lowered by a driving means not shown, a rotating base 54 supported by the lifting rod 53 and configured so as to be rotatable around the lifting rod 53 as a rotation axis by a driving means not shown, an ejection base 55 configured so as to be movable along the guide groove 54a of the rotating base 54, and a pair of rods 56a, 56b arranged on the ejection base 55 and extending in a direction along the guide groove 54a. The pair of rods 56a, 56b are configured so that the distance between them can be widened or narrowed by a driving means not shown.

A more detailed description will be given of the embodiment when transporting the tray from the tray storage rack 40 to the tray loading table 20. When the above-mentioned control means issues a command to transport the tray 110 stored in the tray storage rack 40 to the table body T1 of the tray loading table 20, the tray transport means 50 is moved to the position where the tray 110 is stored in the tray storage rack 40, as shown in FIG. 3(a). In the illustrated embodiment, the tray 110 is stored in the shelf 40c of the tray storage rack 40, and the rotating base 54 of the tray transport means 50 is positioned in front of the tray 110. An imaging means 57 is arranged on the front surface 54b of the rotating base 54 (see also FIG. 4), and by reading the identification mark 116 arranged on the tray 110, it is possible to determine whether the electronic component stored in the tray 110 is the desired electronic component 112. When the tray 110 is stored in the tray storage rack 40, the storage position of the tray 110 is registered in the control means, and the identification mark 116 is read to identify the electronic components stored therein, preventing the tray from being removed in error even if it is stored incorrectly.

When the rotating base 54 of the tray transport means 50 is positioned in front of the tray 110, as shown in FIG. 3(a), the output base 55 is moved in the direction indicated by the arrow R1 to position the tray 110 between the pair of rods 56a, 56b, and is then moved in the direction indicated by the arrow R2 to narrow the gap between the pair of rods 56a, 56b and clamp the tray 110. Note that anti-slip rubber sheets are attached to the opposing surfaces of the pair of rods 56a, 56b to prevent the tray 110 from falling.

3B, the tray 110 is sandwiched between the pair of rods 56a and 56b, and the carry-out base 55 is moved in the direction indicated by the arrow R3 to carry the tray out of the shelf 40c of the tray storage rack 40. After the tray 110 has been carried out of the shelf 40c, the rotating base 54 is rotated around the lifting rod 53 in the direction indicated by the arrow R4 to move the tray 110 toward the tray mounting table 20, as shown in FIG. 3C. After the tray 110 has been moved toward the tray mounting table 20, the third moving base 52 is moved along the guide groove 51a of the third X-axis moving rail 51 to be positioned near the table main body T1, and the carry-out base 55 is moved along the guide groove 54a in the direction indicated by the arrow R5 to position the tray 110 above the table main body T1, as shown in FIG. When positioning the tray 110 above the table body T1, the table body T1 is moved in the direction indicated by the arrow R6 along the guide groove 22a of the tray loading table 20 to position it at the loading position on the tray transport means 50 side.

Once the tray 110 is positioned above the table body T1, the rotating base 54 is lowered and the tray 110 is placed on the table body T1. At this time, the multiple pins P on the table body T1 are inserted into recesses (not shown) formed on the underside of the tray 110 to position it. Once the tray 110 is placed on the table body T1, the spacing between the pair of rods 56a, 56b is widened to release the clamping of the tray 110 by the pair of rods 56a, 56b, and the placement is complete. Once the placement of the tray 110 is complete, the tray 120 is transported from the tray storage rack 40 to the table body T2, the tray 130 to the table body T3, and the tray 140 to the table body T4, and placed thereon, in the same manner as above. The present invention is not limited to having the above-mentioned tray storage rack 40 and tray transport means 50, and the tray storage rack 40 and tray transport means 50 may be omitted, and the trays 110-140 may be transported and placed on the table bodies T1-T4 by the worker.

Once the trays 110-140 are placed on the table bodies T1-T4, as shown in FIG. 5, the table bodies T1-T4 are moved to the mounting position on the transfer head 30 side, and the wiring board support table 10 holding the wiring board A is moved to the center along the first X-axis moving rail 11 and moved to the mounting position in the direction of the transfer head 30 indicated by the arrow R7 along the Y-axis moving rail 13, where the electronic components 112-142 housed in the trays 110-140 are picked up and the electronic components are mounted on the wiring board A. Note that for convenience of explanation, the tray storage rack 40, tray transport means 50, and reel set 60 are not shown in FIG. 5.

When mounting electronic components on the wiring board A, for example, the case where electronic components 122 accommodated in the tray 120 and electronic components 132 accommodated in the tray 130 are mounted on the wiring board A will be described. First, as shown in FIG. 6, the second moving base 32 of the transfer head 30 is moved along the guide groove 31a of the second X-axis moving rail 31 to be positioned in front of the table body T2 of the tray mounting table 20. Next, the transport arm 33 of the transfer head 30 is raised to a predetermined position and the lift rod 33a is rotated in the direction indicated by the arrow R8 to position one of the suction nozzles 34 of the suction part 33c of the transport arm 33 on the electronic component 122 of the tray 120. At this time, the table body T2 is moved in the Y-axis direction to match the position of the suction nozzle 34 and the electronic component 122 to be picked up in a plan view.

Once the one suction nozzle 34 is positioned on the electronic component 122, the suction nozzle 34 is lowered to abut against the electronic component 122, and the suction means (not shown) is activated to suction the electronic component 122. Once the electronic component 122 has been suctioned by the suction nozzle 34, the transport arm 33 is raised and the second moving base 32 is moved along the guide groove 31a of the second X-axis moving rail 31 to be positioned in front of the tray 130 placed on the table body T3 of the tray mounting table 20. Next, the other suction nozzle 34 of the suction part 33c of the transport arm 33 is positioned on the electronic component 132 to be picked up by the same procedure as above. At this time, the position of the tray 130 is moved in the Y-axis direction together with the table body T3 so that the other suction nozzle 34 and the electronic component 132 are aligned in a plan view. Once the other suction nozzle 34 is positioned above the electronic component 132, the other suction nozzle 34 is lowered to contact the electronic component 132, and a suction means (not shown) is activated to pick up the electronic component 132 by suction. Note that the electronic components 122, 132 are temporarily fixed by a sheet with tackiness arranged on the bottom wall of the trays 120, 130, but when they are picked up by the suction nozzles 34, 34, they are fixed with such a tackiness that they can be easily removed, and do not interfere with the pick-up.

After the electronic components 122, 132 are picked up by the suction nozzles 34, 34 of the transfer head 30, the transport arm 33 of the transfer head 30 is raised and rotated in the direction indicated by the arrow R9 as shown in FIG. 7, so that the electronic component 122 picked up by one of the suction nozzles 34 is positioned at a predetermined mounting position on the wiring board A, and one of the suction nozzles 34 is lowered to mount it at the predetermined mounting position. Next, the electronic component 132 picked up by the other suction nozzle 34 is positioned at a predetermined mounting position, and the other suction nozzle 34 is lowered to mount it at the predetermined mounting position.

The electronic components 112 housed in the tray 110, the electronic components 142 housed in the tray 140, etc. are also mounted in the predetermined mounting positions on the wiring board A by the same procedure as above. Also, when it is necessary to mount a different type of electronic component housed in another tray, the above-mentioned tray conveying means 50 is operated to convey the unnecessary tray from the table body of the tray mounting table 20 to a predetermined position on the tray storage rack 40, and the desired tray is conveyed to the predetermined table body of the tray mounting table 20, and the above-mentioned transfer head 30 is operated to mount the electronic components from the tray on the wiring board A.

According to the above-mentioned embodiment, electronic components are picked up from a tray containing electronic components and mounted on the wiring board A, so that changing the electronic components to be mounted can be easily achieved by replacing or adding trays, and the relatively troublesome replacement of reel sets as in the past is no longer necessary, eliminating the need to stop the operation of the device and improving productivity. Furthermore, even if electronic components become smaller, they can be densely stored on the tray, allowing for flexible response to the miniaturization of electronic components. In particular, as described above, the configuration in which electronic components are temporarily fixed by a sheet having tack force makes it possible to store a large number of small electronic components without the need to provide partitions, improving flexibility when mounting electronic components on a wiring board.

As shown in Figures 1 and 8, in addition to the above configuration, the present invention may also be configured such that a reel set 60 containing multiple electronic components is disposed adjacent to the transfer head 30, and the transfer head 30 picks up the required electronic components from the reel set 60 as necessary and mounts them on the wiring board A.

The reel set 60 shown in the figure has multiple tape feeders 71 to 74. Each tape feeder has an electronic component storage tape with multiple electronic components attached to its surface and covered with a cover tape, a guide member that guides the electronic component storage tape, a supply reel around which the electronic component storage tape is wound, and a take-up reel that winds up the cover tape after it has been peeled off (all of which are not shown in the figure).

When picking up electronic components from, for example, the tape feeder 72 of the reel set 60 and mounting them on the wiring board A, as shown in FIG. 8, the transfer head 30 is moved along the guide groove 31a of the second X-axis moving rail 31 to position it on the reel set 60 side, and the transport arm 33 is rotated to position the suction part 33c in the pickup area 62 of the reel set 60. At this time, the electronic component storage tape drawn out from the supply reel of the tape feeder 72 is pitch-fed, and the cover tape covering the electronic component storage tape is peeled off during the process, and the electronic components attached to the electronic component storage tape are positioned in the pickup area 62. Next, the electronic components on the electronic component storage tape are sucked and picked up by the suction nozzle 34 of the suction part 33c, and as explained based on FIG. 7, the transfer head 30 is moved near the wiring board A and mounted at a predetermined mounting position on the wiring board A.

According to the embodiment in which the reel set 60 is arranged as described above, the trays placed on the table body of the tray mounting table 20 can be replaced while picking up electronic components from the reel set 60 and mounting them on the wiring board A, and thus it is possible to avoid stopping the operation of the electronic component mounting device 1. Even if any of the tape feeders constituting the reel set 60 becomes empty and needs to be replaced, it is possible to pick up electronic components from the trays placed on the table bodies T1 to T4 of the tray mounting table 20 and continue mounting while the tape feeder is being replaced, and thus it is possible to avoid stopping the operation of the electronic component mounting device 1 or to shorten the time for which it is stopped.

In the above embodiment, the number of table bodies of the tray loading table 20 is four, but the present invention is not limited to this, and more table bodies may be arranged. Also, in the above embodiment, the tray loading table 20 has multiple table bodies T1 to T4 arranged in series in the X-axis direction, but the present invention is not limited to this. For example, the illustrated tray loading table 20 may be a rotatable circular turntable, and the above-mentioned multiple table bodies may be placed and held on the outer periphery of the turntable, and the rotation of the turntable may be controlled to position the trays containing the desired electronic components sequentially toward the transfer head 30.

In the above embodiment, an independent tray storage rack 40 is disposed opposite the tray loading table 20 to store multiple trays, but the present invention is not limited to this. For example, instead of the above-mentioned tray storage rack 40, a tray storage rack may be formed on the tray loading table 20 to store multiple trays, and the trays may be removed from the tray storage rack formed on the table base 21 and transported to the table bodies T1 to T4 on the table base 21. In this case, for example, the tray storage rack may be formed above the table bodies T1 to T4, or the tray storage rack may be formed inside the table base 21.

1: Electronic component mounting device 10: Wiring board support table 11: First X-axis moving rail 12: First moving base 13: First Y-axis moving rail 13a: Guide groove 20: Tray placement table 21: Table base 22: Top surface 22a to 22d: Guide groove 30: Transfer head 31: Second X-axis moving rail 32: Second moving base 33: Transport arm 33a: Lifting rod 33b: Horizontal arm 33c: Suction unit 34: Suction nozzle 40: Tray storage racks 40a to 40e: Shelf 50: Tray transport means 51: Third X-axis moving rail 52: Third moving base 53: Lifting rod 54: Rotating base 54a: Guide groove 54b: Front surface 55: Delivery bases 56a, 56b: Rod 57: Imaging means 60: Reel set 62: Pickup areas 71-74: Tape feeder 110: Tray 110a: Front wall 110b: Rear wall 110c, 110d: Side wall 112: Electronic component 114: Bottom wall 116: Identification marks 120, 130, 140: Trays 122, 132, 142: Electronic components T1-T4: Table body

Claims (6)

An electronic component mounting apparatus for mounting electronic components on a wiring board, comprising:
a wiring board support table for supporting a wiring board; a tray placement table for placing a tray containing a plurality of electronic components; and a transfer head for picking up the electronic components from the tray and mounting them on the wiring board;
An electronic component mounting device comprising: The electronic component mounting device according to claim 1, in which a plurality of trays for each type of electronic component are placed on the tray placement table, and the transfer head picks up the electronic components from the trays containing the required electronic components and mounts them on the wiring board. The electronic component mounting device according to claim 1, in which a sheet having a tack force is disposed on the tray, and multiple electronic components are temporarily fixed by the tack force. The electronic component mounting device according to claim 1, which is provided with a tray storage rack for storing a plurality of trays, and is provided with a tray transport means for transporting a required tray from the tray storage rack to the tray placement table. The electronic component mounting device according to claim 4, wherein the trays are provided with identification marks corresponding to the types of electronic components to be stored, and the required trays are transported from the tray storage rack to the tray placement table by the tray transport means by reading the identification marks. The electronic component mounting device according to claim 1, in which a reel set containing a plurality of electronic components is disposed adjacent to the transfer head, and the transfer head picks up the required electronic components from the reel set and mounts them on the wiring board.

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