JPS59152698A - Jig board of automatic chip mounting device and method of correcting absorbing position of chip in absorbing port - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Recently, various automatic chip mounting devices have been used to mount resistors, capacitors, and other cylindrical (cylindrical, cylindrical, etc., so-called Melf type) to plate-shaped (square plate, circular plate, etc.) It is possible to automatically place (mount) a small electronic component (hereinafter simply referred to as a chip) on a printed circuit board, and to properly bond the chip to the printed circuit board while maintaining this state. It is being done.

The automatic chip mounting device basically consists of a separate jig board with a large number of chip loading holes set according to the placement positions of the chips on the printed circuit board, and a chip mounting system for each chip loading hole on the jig board by an appropriate means. The jig board loaded with the chips is moved to a set position, and at this position, the chips loaded on the jig board are adjusted to the positions of each loading hole of the jig board. The chip is adsorbed to each suction port of the Sakujo-nod equipped with six suction ports, transferred to the printed circuit board in its arranged state, released from suction, and pre-applied adhesive to the chip mounting area. Each chip is mounted and glued onto the printed circuit board, which is the mounting board, in the same position as the jig board, and then the adhesive is dried and left in the mounted state. The chips are transferred to a printed circuit board, etc., and each chip is appropriately bonded onto a printed circuit board.

Conventionally, when mounting a chip on a printed circuit board using the above-mentioned device, it was difficult to mount the chip in a strictly accurate fixed position on the printed circuit board. A positional deviation of 0.3 ran (in the X-axis direction) occurred.

The cause of this positional shift is that there are considerable variations in the dimensional accuracy of individual chips due to the manufacturing process (processing dimensions of the element itself, dimensional changes due to processing such as painting on the element), etc. Basic dimensions 1, ? 5 X 2. O
Ottan's tip has a dimensional error of ±0.25 inside and outside the throat. ), in order to absorb this dimensional variation in the chips themselves, the dimensions of each chip loading hole on the jig board are set such that the dimensions of each chip loading hole on the jig board are such that even if chips with the maximum allowable error (e.g. ±0.25 mm) are loaded, (e.g., 1.7 to 1.8 x 2.4 for the upper chip). -2.5 wn and outside).

Therefore, a chip of basic dimensions (eg 1.2 s x 2.
.

When a chip is loaded into the chip loading hole provided as described above, a clearance of Q, 25 mm is generated in each direction around the chip, and if there is a dimensional error in the chip, the clearance will naturally change. ), there is no problem if the tip is located exactly at the center of the loading hole, but if it is deviated, the position will shift by up to 0.75 rran from the center.

On the other hand, each suction port and each chip loading hole facing it can be installed with high precision in one degree due to mechanical design, and the centers of each suction port and each chip loading hole are located on the same center line, and each -The port is lowered into the chip loading hole. 1.
C0 adsorption state. 1. Since the chip is not moved upward and then lowered onto the printed circuit board to mount the chip at that fixed position, the chip that is picked up with a deviation from the center of the suction port will be displaced by the amount of deviation. It happens when it gets mounted on a printed circuit board.

In the case of so-called single mount type automatic chip mounting equipment, which picks up chips one by one and mounts them in fixed positions on a printed circuit board, the equipment that big-amples, moves and mounts the chips is individually mounted. Therefore, it is relatively easy to correct the positional deviation for each chip individually. The suction head has many suction ports (e.g.
The jig (vacuum thin tube) picks up the chips (several tens to several zoon at a time) from a large number of chip loading holes provided on the panel, moves upward, and then descends into the fixed position on the printed circuit board. Because it is something that is mounted all at once in the same position, during that process.

It is considered that it is completely impossible to correct the position of the chip, so conventionally the solution has been transferred to the chip, and the root cause of the positional deviation is the dimensional variation of the chip.
Efforts have only been directed toward more accurate mounting by increasing the chip dimensions and thus reducing the clearance of the chip loading hole.
Since the dimensions of chips have become extremely small in recent years, it has not been possible to achieve any results.

The present invention has been made in view of the above circumstances.During the process of mounting a chip from a jig board onto a printed circuit board, there is no chance that the position of the chip can be corrected by some method. .

Paying attention to the fact that the chips are only present in the chip loading holes of the tooling board, and recording the chip loading holes, at the next point in time when each suction port of the suction head suctions the chips in each chip loading hole all at once, The positional deviation of the chips with respect to the suction ports is corrected to the correct position (the position where the centers of the suction ports and the chips match) for all the suction chips at the same time.

That is, in the method of the present invention, chips C appropriately supplied and loaded into each chip loading hole 1 of a jig board A in an automatic chip mount device are sucked into each suction port 3 of a suction head 5, and then moved upwardly. , Print, the dimension of each chip loading hole lOX in the axial direction is LxJ, the dimension in the y-axis direction '&Lyl, and the dimension of each chip C in the X-axis direction is L
XS when x2 and y-axis direction dimensions are l and y2
The clearance between the chip loading hole l and the chip C in the Y-axis direction is adjusted upward by IJ x .

After each suction port 3 descends into each chip loading hole l all at once and adsorbs the chip C, it rises by a certain dimension within the chip loading hole l, and while the suction port 3 adsorbs the chip C, the chip C is loaded into the chip. position in the hollow inside the hole 1, and then each suction port 3 at the same time (i.e., suction hole)/
If the suction port 3 is moved, all of the suction ports 3 attached thereto will naturally move together. ), (,), First, in the X-axis direction (
2) to the right (as shown in figure 2), move in parallel with jig board A, and the same applies hereafter. ), (b), (,) move 211j'X in one direction on the X axis (to the left), (c), move lJx in the X axis direction from the (b) position, (
d), then ly from position (c) in the y-axis direction (backwards)
(e), moves 21y in one direction (forward) on the y-axis from position (d), (f), and finally moves ly in the direction of the y-axis from position (e) and stops.

That is, the suction ports 3, whose centers are located on the center line of each chip loading hole I, are moved simultaneously upwards on the X axis to each lx, then returned to the center, and then moved on the y axis. upwards each l
After moving to y, a movement movement is performed to return to the center, and as a result of this movement movement of each setting clearance dimension, the peripheral part of the chip C and the inner wall surface of the chip loading hole l collide in the axial direction, and the collision occurs. Due to the sliding displacement of the suction position that occurs between the chip C, which has stopped moving, and the suction port 3, which is still moving,
By correcting and aligning the centers of the suction port 3, chip C, and chip loading hole l, and moving the corrected suction port 3 to the correct center suction position for the chip C onto the printed circuit board and releasing the suction, The chip C can be mounted extremely accurately in a fixed position on a printed circuit board.

The method of the present invention is fully effective when the following prerequisites are satisfied.

1) Each chip loading hole l for chips C of the same size
The dimensions of each hole are exactly the same.In this regard, even at present, high accuracy can be obtained through precision machining.

2) It is assumed that the center of the suction port 3 is relatively coincident with the center of the chip loading port 1 and the center of the fixed position of the chip mount on the printed circuit board.

3) Also, the dimensions of the chip C for determining the clearances lx and fly are based on the dimensions of the chip in the basic dimensions, and the dimensional errors currently allowed as described above are ignored.

Therefore, if there is a dimensional error in reality, even if the method of the present invention is carried out in step 1.7, the center of the suction port and the center of the chip will not exactly match, and the so-called "apparent center" will not have been determined. However, even so, the size of the positional deviation can be suppressed to less than one-tenth of that of the conventional method.

Next, the method of the present invention will be explained in more detail with reference to the second illustrated example. For example, the chip C size is 125X 2.00
In mm, one dimension of the chip loading hole is 1.75. x2.50 throat, clearance lx1ly is ±0.25++mz!
: In the setting case, if the chip C is located offset to the front left corner of the chip loading hole l, (a), first, move the suction port 3 in the direction of the X axis by 0°25III
Although the tip C moves by I+1 (' l!

(b), then 0.5m from the (a) position to the X axis/one direction
m ("21x"), the chip C immediately collides with the inner wall surface of the hole, the chip C stops there, and only the suction port 3 reaches zero.
．． Since it is forcibly moved to the 5th position, the suction position (center) of the suction port 3 is moved to the sliding position by that dimension, and due to the displacement, the suction port 3 and the center of the chip COX axis coincide.

(,c), Therefore, 0 from the (b) position to the X-axis direction,
'2. If it is returned by s m' (l), the X-axis centers of the suction port 3, the chip C, and the loading hole l are aligned. (
Figure 2, (a) to (d)) (d) Next, from position (c), the suction port 3 is moved in the y-axis direction by 0.25'mm <ly), but the clearance in this direction is Since there is more than that, no collision occurs between the chip C and the inner wall surface of the hole.

O from (e), (d) position to one direction of y-axis; 5 cabinets (21y
), the tip C collides with the inner wall of the hole, the tip C stops there, and only the suction port 3 is forcibly moved to the 0.5+m position. (center) is slidably displaced, and due to this displacement, the y-axis centers of the suction port 3 and the tip C coincide.

(f), 0.25 run from position (e) in the y-axis direction
(, ly) If it is returned, the centers of the suction port 3, chip C, and chip loading hole lOy axis will also match. Therefore, by moving the suction port 4 in (a) to (f), the suction port 3, chip C, and chip loading hole will be aligned. X% y of the three people in hole l
The axes are perfectly aligned, and the chip C, which was initially attracted with a deviation, is corrected to the correct suction position. (Second
Figures, (E) to (G) The above steps are performed simultaneously in relation to each suction port of the suction head and each chip loading hole of the jig board facing thereto. That is, the movement of the suction ports in the upward direction of the X-axis and the upward direction of the Y-axis is also carried out simultaneously on all suction rows, and all the suction tips are corrected to the correct position at once by the correcting operation of 1 cycle.
Therefore, it is possible to mount all the chips on the printed circuit board at once with extremely high precision and accurate positions, and it is possible to achieve a great effect of completely eliminating the above-mentioned conventional drawbacks.

Note that the method of the present invention is based on the premise that chips have already been supplied and loaded into each chip loading hole of the jig board by some means, and the chips in the chip loading hole are sucked by each suction port and printed. Since the invention relates to transferring and mounting chips onto a substrate, the means for supplying and loading chips in advance to each chip loading hole of the jig board is, for example, loading the chips from a chip hopper through a separate supply pipe for each chip. , one that removes and loads one chip at a time from a chip magazine, or
It is completely arbitrary, such as removing and loading chips one by one from a chip tape in which chips are taped onto a continuous tape.

[Brief explanation of drawings]

Figure 1 (a) is an explanatory cross-sectional view showing a state in which the chips loaded in each chip loading hole of the jig board are picked up by each suction port in the same hole and the chips are raised by a certain size. An explanatory plan view of the mutual dimensional relationship between the loading hole and the loaded chip, (A), (B), (C), and (D) in FIG. 2 are explanatory diagrams showing the movement correction order in the upward direction of the X axis, (E), (E), (G) are y
FIG. 6 is an explanatory diagram showing the order of movement correction in the axial direction. l number, A
...Jig board, C...chip, L x IXLyl=
Dimensions of chip loading hole, L x 2 x L y 2 =
: Chip dimensions, llx, ly... Clearance dimensions between the chip periphery and the inner wall surface of the chip loading hole. l...Chip loading hole, Yu...Suction head, 3
...Suction port.

Claims (1)

[Scope of Claims] In an automatic chip mounting device, a chip appropriately supplied into each chip i side hole of a jig board is sucked into each suction port of a succinhertor, and then moved upward and placed on a printed circuit board. In the step of descending, releasing the suction, and mounting each chip at a fixed position on the printed circuit board, the dimensions of each chip loading hole in the xs and V-axis directions are Lxl. t, y, and the xl y-axis dimension of the chip as L x 2.
, Ly2, X% Chip in V-axis direction. Increase the clearance between the loading hole and the tip by 11x% upwards.
As ly, each suction port descends into each chip loading hole all at once and adsorbs the chip, and then rises by a certain dimension within the chip loading hole, and then moves each suction port simultaneously into the X-axis. Move upward to each lx, return to the center, then move upward on the y axis to each l' Y
After moving to the destination, perform 4 movements to return to the center, and this movement 4
The chip periphery collides with the inner wall surface of the chip loading hole in the upward direction of the y-axis, and due to the sliding displacement of the suction position that occurs between the chip that has stopped moving due to the collision and the suction port that is still moving, The centers of the suction port, the chip, and the chip loading hole are adjusted to match each other, and the corrected suction port is moved to the correct center suction position onto the printed circuit board, and the chip is released by suction. A method for correcting the chip suction position on the jig board and suction port of an automatic chip mount device to ensure accurate mounting in the fixed position.