JPH06125198A - Surface mount machine - Google Patents

Abstract

PURPOSE:To provide a surface mount machine which can mount a circuit part on a board with a high accuracy at the time of mounting the part. CONSTITUTION:The image processor 14 of this machine 1 measures the position of the center of gravity of an attracted part above the part mounting position and the controller 15 of the machine 1 decides the attracting position of part to be attracted by a suction head 4 based on the measured position of the center of gravity and controls the head 4 to attract the part in the decided attracting position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter for measuring the position of a component to be mounted on a circuit board and mounting the component at a predetermined position.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for mounting small-sized circuit parts (chips) on an electronic circuit constituting various electronic devices with higher density. In response to this demand, the component mounting technology has come to adopt the surface mounting method shown in FIG. 10 from the pin insertion method shown in FIG. That is,
In the pin insertion method of FIG. 9, a large number of through holes are formed in the printed board, and the resistor 1 is a capacitive element, I
While the leads of circuit components such as C are inserted and the protruding ends are soldered together, in the surface mounting method of FIG. 10, resistors or other circuit elements or ICs are installed at predetermined positions on the printed circuit board to lead the leads. To solder. Therefore, it is not necessary to make holes, the leads of the circuit element are shortened, and it is suitable for high-density mounting of miniaturized parts. As a means for performing such surface mounting, a surface mounting machine (also called a chip mounter)
Is used.

In a surface mounter, necessary parts are sucked by a vacuum nozzle to detect the sucked state. Then, if there is a displacement or the like, it is corrected and the component is mounted on the circuit board. For this reason, the surface mounter includes a component suction device, a moving and positioning mechanism for the component suction device, a detection device for detecting the suction state of the component, and the like.

The correction of the positional deviation of the components in the above surface mounter is generally performed as follows.

As shown in FIG. 11A, the component 112 supplied to a predetermined take-out position by the component supply device (tape feeder) 111 is sucked by the suction nozzle 114 of the component suction device 113, and the component supply device 111. Taken from.

An image including the component at the above-mentioned take-out position is picked up, and as shown in FIG.
The center of gravity position 112 ′ of the component 112 and the center of gravity position 114 ′ of the suction nozzle 114 are obtained in the coordinate system of FIG. 5, and the difference between these positions is calculated.

From the calculated value of the predetermined number of times in the past, the position estimated as the center of the extraction position is obtained by the average value or the least square method.

The component suction device 113 rotates the sucked component above the take-out position as shown in FIG. 11 (c) to a mounting posture, and moves to above the mounting position.

Above the mounting position, as shown in FIG. 11 (d), the mounting position is corrected based on the difference calculated in.

According to the corrected mounting position, FIG.
Components are mounted on a printed circuit board as shown in (e).

For the next part, the take-out position of is corrected based on the value (estimated position) obtained by
The parts are taken out at the corrected taking-out position.

[0012]

However, in the surface mounter, the center of the rotation operation of the suction nozzle as shown in FIG. 11C, which is performed when the component suction device moves the component from the pick-up position to the mounting position. The position does not always coincide with the position of the center of gravity of the suction nozzle, and the position of the center of gravity 114 ′ of the nozzle with respect to the center position of rotation before and after the rotation operation is not always the same.
May be different. In this case, as shown in FIG. 11D, the gravity center position 112 ′ of the component also differs from the rotation center position, and as a result, a deviation g ″ of the gravity center position of the component occurs. Therefore, if the component mounting position is corrected as described above, there is a problem that an error corresponding to the above-mentioned deviation g ″ occurs with respect to the target mounting position as shown in FIG. there were.

Therefore, an object of the present invention is to provide a surface mounter which enables highly accurate mounting of circuit components on a substrate.

[0014]

According to the present invention, there is provided a component supply device for feeding a component mounted on a circuit board to a predetermined take-out position, a component suction device for sucking a component at the take-out position, and the component suction device. A component positioning device that moves a component sucked by the device above the mounting position on the circuit board and mounts the component at the mounting position, and a measuring device that measures the position of the center of gravity of the component sucked by the component suction device. In the surface mounter equipped with, the measuring device measures the position of the center of gravity of the sucked component above the mounting position, and based on the measured position of the center of gravity, the component positioning device determines the component It is characterized in that the suction position of the component sucked by the suction device is determined, and the component suction device is controlled so as to suck the component at the determined suction position.

According to a specific aspect of the present invention, the component positioning device includes: (a) the gravity center position of the component measured by the measuring device in the coordinate system of the measuring device; and the component suction device above the component removing position. The center of rotation for ensuring the mounting posture at the mounting position, the center of gravity position is converted from the coordinate system of the measuring device to a coordinate system having the center position as an origin, and (b) the above Based on the center of gravity position converted by (a) and the angle of rotation, the center of gravity when the component is sucked by the component suction device at the pick-up position is the origin of the center of rotation. And (c) the barycentric position obtained in (b) is converted from the coordinate system having the center of rotation as the origin into the coordinate system of the measuring device, and (d) the (c) is displayed. Center of gravity position converted by Calculating a difference between the center position of, (e)
The component suction position is corrected based on the difference calculated in (d).

[0016]

According to the surface mounter of the present invention, the component mounted on the circuit board is supplied to the take-out position by the component supply device. The component suction device sucks the component at this take-out position and moves it above the mounting position of the circuit board.
The measuring device measures the position of the center of gravity of the component above the mounting position to obtain a measurement result that is not affected by the displacement of the component suction device that may occur due to the movement. The component positioning device determines the position where the component suction device picks up the component based on the measurement result, and controls the component suction device. As a result, the component suction device achieves the removal of the component without deviation from the predetermined removal position.

More specifically, the component positioning device determines the position of the center of gravity of the component measured by the measuring device in its coordinate system, and the mounting position of the component at the mounting position of the component above the component pickup position. The position of the center of gravity is converted from the coordinate system of the measuring device into a coordinate system having the center position as the origin, and is represented based on the center position of the rotation performed for securing.

Based on the converted center of gravity position and the rotation angle, the center of gravity position at the component take-out position is obtained in a coordinate system having the center of rotation as the origin. The center-of-gravity position thus obtained is converted from the coordinate system having the center of rotation as the origin to the coordinate system of the measuring device, and the difference between the center-of-gravity position and the center is calculated. Based on this difference, the component positioning device corrects the component suction position, so that the position at which the component suction device picks up the component is properly determined.

[0019]

1 is an external perspective view of an embodiment of a surface mounter according to the present invention. The surface mounter indicated as a whole by 1 is housed inside the cabinet 2 and components on a base plate (table) 3 placed on a cabinet 2 having double doors 2a and 2b on the front side. It consists of components.

On the upper surface of the table 3, a robot 5 having a component mounting head 4 which constitutes a component suction device, which will be described in detail later, is installed. Further, a belt conveyor 7 for moving the printed circuit board 6 serving as a circuit board, a large number of tape cartridges 8 in which various components (chips) to be mounted on each circuit board are grouped into the same type and taped for each cartridge 8. Feeder base 9
(FIG. 6) A component supply device composed of a tape feeder 10 and a CRT for monitoring, which are respectively fed to the pick-up positions.
11 a, a CRT 11 b for personal computer, a keyboard 12 operated by an operator, a robot operation panel 13 and the like are installed, while an image processing device 14 and a controller 15 described later are installed in the cabinet 2.

The robot 5 supports the mounting head 4 and moves it in the vertical direction (Z-axis direction) perpendicular to the table 3, and a Z-axis slide block 16 (FIG. 2) and this Z-axis slide block 16.
An X-axis arm 17 for moving the axis slide block 16 in a direction parallel to the belt conveyor 7 (X-axis direction), and this X-axis arm 17.
The entire axis arm 17 is in a direction (Y
A pair of parallel Y-axis arms 18a for moving in the axial direction),
18b.

The robot 5 and the controller 15 that controls the operation of the robot 5 constitute the component positioning device of the present invention.

Next, the mounting head 4 of the embodiment will be described.

As shown in FIG. 2, the head portion is an L-shaped head base 30 fixed to the lower end portion of the Z-axis slide block 16, a nozzle index mechanism 31 installed on one side thereof, and its drive. Head base 30 as a source
And a pulse motor 32 attached to the opposite side of the.

The nozzle index mechanism 31 is mainly composed of a cylindrical rotary housing 33, and three kinds of suction nozzles 34, 35 and 36 are arranged radially on the outer peripheral surface thereof at equal angular intervals (120 ° in this case). Have. These nozzles have different diameters. In the embodiment, the nozzle 34 has the largest diameter, the nozzle 35 has the middle diameter, and the nozzle 36 has the smallest diameter.

The optical system block 65 is composed of an L-shaped rectangular tube-shaped housing, and plane mirrors 66 and 67 having reflecting surfaces facing inward are disposed at the lower tip end side and the corner portion thereof, respectively. The plane mirror 6 on the lower end side of the optical system block 65
A circular transparent plate 68 is attached to a portion located above 6 to form a light transmission window. On the other hand, the optical system block 6
A CCD camera 71 is installed in a portion extending above 5 to form a visual device for visually detecting the component suction state.

Here, the light emitted from the light source 64 of the illuminating device uniformly illuminates the component 52 attracted to the tip of the nozzle from above. Looking at this from the CCD camera 71, the component 52
Can be captured as a stable image through the two plane mirrors 66 and 67.

FIG. 3 shows one cycle operation of the head 4. It will be described in order as follows.

The mounting head 4 is the X of the robot 5 in FIG.
By the operation in the axis and Y-axis directions, the tape moves to a position above a predetermined component take-out position on the tape feeder 10, and by the operation in the Z-axis direction, it descends to a predetermined height. Then, the nozzle selected for the component 52 sent to the take-out position by the tape feeder 10 (for example, the nozzle 34 in FIG. 2).
But adsorbs the component 52. The above-mentioned component take-out position is a position based on the correction operation determined by the controller 15 during the execution of the immediately preceding cycle operation which has been completed.

The mounting head 4 is lifted by the operation in the Z-axis direction, and the nozzle 34 sucking the component 52 is rotated to set the component at a mounting angle on the substrate 6.

By the operation in the X-axis and Y-axis directions, it moves toward a predetermined component mounting position, that is, a position on the printed circuit board 6 carried by the belt conveyor 7. When this movement is completed, the optical system block 65 is moved (advanced) to the left in the figure, its tip is positioned directly below the component 52 sucked by the nozzle, and the position and inclination of the center of gravity of the component are measured.

This measurement is achieved by sending the image of the component captured by the CCD camera 71 to the image processing device 14 for processing, and the controller 15 performing a predetermined arithmetic processing based on the processing information.

If correction is required as a result of measurement, after moving (retracting) the optical system block 65 to the right, the mounting head 4 itself is moved on the XY plane or the nozzle that picked up the component is rotated. Thus, the mounting position or inclination of the component is corrected.

The mounting head 4 descends and the printed circuit board 6
The component is mounted on the substrate by positioning the component on the top, stopping suction of the nozzle, and opening to atmospheric pressure.

When the mounting head 4 moves up and the next component is to be mounted, it moves to the component pick-up position.

The above-mentioned operation is characterized in that the mounting head 4 picks up the component at the component pick-up position, conveys the component above the mounting position, and then performs the image measurement and correction operation (the above-mentioned operation) of the component. It is in.

FIG. 4 shows a hardware configuration provided in the surface mounter 1 for controlling the above cycle operation.

Here, the image processing device 14 includes the CCD camera 71 connected to the camera controller 72 and the component 5
2 is connected to a CCD camera 75 for picking up the position and orientation of the printed circuit board 6, a camera switching board 74 that captures images of these two cameras by appropriately switching them, and stores and captures the captured images. CRT
A frame memory board 76 for outputting to 11a, an image processing high-speed processor 73 for performing image processing on the captured image and transmitting information obtained by the processing to a personal computer 80 described later. The image processing device 14 and the CCD camera 7
1 and 1 constitute the measuring device in the present invention.

The controller 15 is the image processing apparatus 1 described above.
4 mainly comprises a personal computer 80 connected via a communication path, and a bus expansion box 85 and interface boards 92a and 92b attached thereto.

The personal computer 80 takes in the information of the image processing apparatus 14 via the communication path, the link adapter board 81, the memory board 82, and the bus expansion box 85.
A bus expansion board 83 for communicating with a flexible disk drive 84 'for mounting a flexible disk 84, a keyboard 12 and a CRT 11b are connected, arithmetic processing based on information from the image processing device 14, motor control, Responsible for controlling the entire surface mounter such as sequence control and program change.

The CRT 11b is used to display various calculation processing information on the screen of the personal computer 80.

The bus expansion box 85 is used for the input / output board 8
6, the motor control boards 87, 88 which generate control outputs of the respective motors for driving the X-axis, Y1-axis, Y2-axis, Z-axis, Θ-axis and cutter axis based on commands from the personal computer 80 and output them to the interface board 92a. , 89, an output board 90 for controlling a solenoid valve of a drive device such as the air cylinder 37, and an input board 91 for taking in outputs of various kinds of sensors appropriately provided. Here, the Θ axis is the central axis when the nozzle 34 rotates due to the above operation.

The interface board 92a has an X-axis servo motor 22, Y1-axis servo motor 25a, Y2-axis servo motor 25b, and X-axis servo amplifier A1, Y1-axis servo amplifier A2, Y for driving the Z-axis servo motor 20.
A two-axis servo amplifier A3 and a Z-axis servo amplifier A4 are connected to take in the control output of the motor control boards 87, 88, 89, convert it into a signal for controlling the amplifier, and output it.

Further, the interface board 92a has detection means S1, S2, S3, S4 such as limit sensors for detecting the limit values set for the rotation amounts of the respective motors.
Are connected.

The Θ-axis pulse motor 32 for rotating the suction nozzle, the Θ-axis pulse motor driver D1 for driving the cutter-axis pulse motor 93, and the cutter-axis pulse motor driver D2 are connected to the interface board 92b. Board 87, 88, 89
The control output of (1) is taken in through the interface board 92a, converted into a signal for controlling the driver, and output.

The interface board 92b is also connected with detection means S5 and S6 such as limit sensors for detecting the limit values set for the rotation amounts of the motors 32 and 93.

Next, the operation of correcting the take-out position of the component 52 determined during the cycle operation of the component mounting head 4 by the hardware configured as described above will be described.

First, four coordinate systems are defined as follows.

1. Visual coordinate system The origin is a predetermined point in the image area obtained by the CCD camera 71, and the X-axis direction of the robot 5 and Y
It is a coordinate system of a measuring device having coordinate axes x and y parallel to the axial direction. Hereinafter, this coordinate system is referred to as a visual coordinate system, and the origin is referred to as a visual origin.

2. Virtual Coordinate System A coordinate axis is set in parallel with the x-axis and the y-axis of the visual coordinate system, with the center of the nozzle rotation operation (hereinafter referred to as the virtual center) performed in the cycle operation of FIG. 3 as the origin. Hereinafter, this coordinate system is referred to as a virtual coordinate system.

Here, the position of the virtual center is measured in advance,
It shall be represented in the visual coordinate system.

3. Mounting position coordinate system The origin is the position of the center of gravity represented by the visual coordinate system of the component located above the mounting position, and the coordinate axes are parallel to the x and y axes. Hereinafter, this coordinate system is referred to as a mounting position coordinate system.

4. Take-out position coordinate system This is a coordinate system in which the position coordinates of the center of gravity of the component located above the take-out position are assumed on the visual coordinate plane and the position is the origin, and the coordinate axes are parallel to the x-axis and the y-axis. Hereinafter, this coordinate system is referred to as a take-out position coordinate system.

FIG. 5 shows the positional relationship between the center of gravity M of the component 52 and the virtual center G measured in the above cycle operation on the visual coordinate plane, and also shows the center of gravity O of the component 52 when the component 52 is sucked at the take-out position. It is shown assuming the position.
The position of the center of gravity M in the figure is (x _m , y _m ), the position of the center of gravity O is (x ₀ , y ₀ ), and the position of the virtual center G is shown in the coordinates (x _G , y _G ).

Since the above four coordinate systems do not include height information, they can be considered to be on the same plane,
Moreover, since the respective coordinate axes are set to be parallel to each other, the homogeneous transformation matrix T _VG from the visual coordinate system to the virtual coordinate system
Is

[0056]

[Equation 1]

It is expressed as

Similarly, the homogeneous transformation matrix T _Vm from the visual coordinate system to the mounting position coordinate system is

[0059]

[Equation 2]

It is expressed as

Since the above-mentioned T _VG and T _Vm and the homogeneous transformation matrix T _Gm from the virtual coordinate system to the mounting position coordinate system, the relationship of T _Vm = T _VG T _Gm (3) holds, T _Gm = (T _VG ) ^-1 T _Vm (4) is obtained. Using the above equations (1) and (2),

[0062]

[Equation 3]

It can be expressed as

On the other hand, the homogeneous transformation matrix T _VO from the visual coordinate system to the extraction position coordinate system is

[0065]

[Equation 4]

It can be expressed as The relationship of T _VO = T _VG T _GO (7) holds between this and the above-mentioned T _VG and the homogeneous transformation matrix T _GO from the virtual coordinate system to the extraction position coordinate system, so T _GO = (T _VG ) ^-1 T _VO (8) is obtained, and using the above equations (5) and (6),

[0067]

[Equation 5]

It can be expressed as

Here, the coordinate conversion is performed by the above T _GO , and when the result is further rotated by θ ° around the axis perpendicular to the visual coordinate plane about the virtual center G, the conversion is the rotational conversion R (θ ) Can be used to express as R (θ) T _GO . This is T as shown in FIG.
_In agreement with _Gm , R (θ) T _GO = T _Gm (10) holds. The rotation transformation R (θ) is given by the homogeneous transformation matrix

[0070]

[Equation 6]

Since the expression (5), (9) and (11) is expressed as (1
Substituting it into expression (0)

[0072]

[Equation 7]

To obtain. From this equation _{(12), (x O -x G) cos} θ- (y O -y G) sin θ = x m -x G ... (13) (x O -x G) sin θ + (y O -y since _{G) cos θ = y m -y} G ... (14) is calculated, x _O and y _O now _{is, x O = (y m -y} G) sin θ + (x m -x G) cos θ + x G ... (15) y _O = is obtained with _{(y m -y G) cos θ-} (x m -x G) sin θ + y G ... (16).

Therefore, in the cycle operation of the suction head described above, when the rotation angle of the nozzle 34 about the Θ axis in the operation is θ °, the rotation coincides with the rotation from the center of gravity O to the center of gravity M in FIG. The coordinates (x ₀ , y ₀ ) obtained by the above equations (15) and (16) can be used as the position coordinates of the center of gravity O in the visual coordinate system.

FIG. 6 shows a plurality of tape cartridges 8 (FIG. 1) in which the components supplied to the take-out position are mounted on the tape.
The component supply device provided with. Here, the respective parts held in the tape cartridges arranged in n rows are the tape feeders F ₁ of the n rows corresponding to the respective tape cartridges.
, F _n are supplied to the respective take-out positions P ₁ , ..., P _n , where they are adsorbed by the adsorption nozzles and taken out.

The correction of the take-out postures of the components at the take-out positions P ₁ , ..., P _n is performed as follows at the take-out position P _i , for example.

The position coordinates (x ₀ , y ₀ ) of the center of gravity O of the component taken out last time at the take-out position P _i are the above equations (15) and (16).
When this is determined, the difference (x _fi , y _fi ) between this and the barycentric position (x _no , y _no ) of the nozzle due to the deviation (offset) from the virtual center G occurring in the suction nozzle, that is, x _fi = X _o −x _no (17) y _fi = y _o −y _no (18), a flexible disk 84 used as a data storage means of the personal computer 80 is provided corresponding to the feeder F _i. Stored in the memory area M _i . Here, the offset of the suction nozzle is a value measured in advance.

The next time the parts are taken out, it is decided beforehand.
Pulled out position P_i (X_pi, Y_pi) From above
(X_fi, Y_fi) And (x_no, Y_no) Minus coordinate value (x
_pi-X _no-X_fi, Y_pi-Y_no-Y_fi) Is the visual origin
The X axis and the Y axis are moved as described above. This allows the nozzle
The center of gravity of the
It can be matched within the margin of error due to play.

As described above, the parts take-out position P
Correction of _i is achieved.

Further, even when the tape feeder 10 is replaced together with the base 9, if the error generated at the take-out position P _i due to the individual difference of the base is within the range in which the parts can be taken out, the parts are removed after the base is replaced. By performing the extraction, the above-described correction of the extraction position is applied.
In this way, (x _o , y _o ) is newly calculated and (x _fi , y
_fi ) is updated, so that the correction of the extraction position is also achieved accordingly. Therefore, it is not necessary to newly set (x _pi , y _pi ) when the base 9 is replaced.

7 and 8 are flow charts showing the procedure for correcting the above-mentioned component take-out position.

First, in step ST1, the visual origin is set to the position (x _pi −x _no −x _fi , y _pi −y _no −y _fi ) where the component take-out position P _i is corrected by the operation in the X-axis and Y-axis directions. The mounting head 4 is moved so that This corrected position is a position determined by the component positioning device based on the data obtained by measuring the component above the mounting position during the previous component mounting operation.

In step ST2, it is determined whether or not the operations in the X-axis and Y-axis directions are completed. If completed, in step ST3, the head 4 is lowered to the component take-out position by the operation in the Z-axis direction. Let If not completed, wait for completion.

In step ST4, it is determined whether or not the operation in the Z-axis direction is completed. If completed, step S
At T5, the component is sucked by the suction device. If not completed, wait for completion.

In step ST6, the head 4 is raised by the operation in the Z-axis direction, and in step ST7, the component is placed in the mounting posture by rotating it by θ ° around the θ axis until the component is placed in the mounting posture.

In step ST8, the component is moved above the mounting position by the operation in the X-axis and Y-axis directions.

In step ST9, it is determined whether or not the operation in the Z-axis direction in step ST6 and the operation around the Θ-axis are completed, and if completed, step ST10.
In center of gravity of the component (x _m, y _m) performs measurements and theta _m, if not completed, waits for completion.

Here, since the component can be regarded as an equivalent inertial ellipsoid, the angle θ _m formed by the long axis passing through the center of gravity of the component and one of the coordinate axes of the visual coordinate system (for example, the x axis) of the posture of the component. Measure as an inclination.

At step ST11, the position coordinates (x _O , y _O ) of the center of gravity O of the component are calculated by the equations (15) and (16).

In step ST12, the equations (17) and (18) are calculated, the result is stored in the memory area M _{i of the} memory, and the data is used as the correction data of the next component take-out position from the feeder F _i .

In step ST13, it is determined whether or not the operation in the X-axis and Y-axis directions in step ST8 is completed. If completed, the process proceeds to step ST14, and if not completed, the completion is waited for.

In step ST14, step ST10
If an error occurs between the measurement result of and the target component mounting position determined in advance in the visual coordinate system, the error is caused by the operation in the X-axis and Y-axis directions and the rotation around the Θ-axis. Make the appropriate correction.

In step ST15, it is determined whether or not the above correction is completed, and if it is completed, step S15 is executed.
Proceed to T16, and if not done, wait for completion.

In step ST16, the suction component is lowered to the mounting position by the operation in the Z-axis direction.

In step ST17, it is determined whether or not the lowering is completed. If the lowering is completed, the process proceeds to step ST18, the suction operation of the suction nozzle is stopped, and the component is mounted at the mounting position.

Finally, in step ST19, the head 4 is raised by the operation in the Z-axis direction to complete the component position correction procedure.

In the above correction procedure, step ST
In 8 to ST13, the correction value for the next component take-out position is determined. The procedure for determining the correction value is started in step ST8 and is executed in parallel during the waiting time for the operation in the X-axis and Y-axis directions completed in step ST13. Therefore, the correction operation performed in steps ST14 and ST15 is performed. The overall processing efficiency is improved as compared with the case of processing in parallel with.

[0098]

As described above, the surface mounter of the present invention is
When mounting the component on the printed circuit board, the mounting posture of the component is measured above the mounting position, so it is affected by the displacement of the mounting position due to the eccentricity of the suction nozzle that tends to occur when rotating the component from the take-out posture to the mounting posture. Instead, measurement can be performed in the actual mounting posture. As a result, since the correction accuracy of the take-out position is improved, the mounting error at the mounting position of the component is also reduced.

Further, by measuring the mounting attitude of the component above the mounting position, the correction data calculation procedure for the above correction can be executed in parallel with the component mounting operation, so that the total time required for the processing procedure is shortened. can do.

[Brief description of drawings]

FIG. 1 is a perspective view showing a surface mounter according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a component mounting head portion and its peripheral portion.

FIG. 3 is an operation explanatory view of a component mounting head section.

FIG. 4 is a hardware configuration diagram for executing the operation of the component mounting head unit of FIG.

FIG. 5 is a diagram showing a positional relationship between a virtual center and parts in a visual coordinate system.

FIG. 6 is a view showing the tape feeder showing a component take-out position.

FIG. 7 is a flowchart showing a procedure for correcting a component take-out position.

FIG. 8 shows a continuation of the flowchart of FIG.

FIG. 9 is a diagram showing a pin insertion method of component mounting methods on a printed circuit board.

FIG. 10 is a diagram showing a surface mounting method of component mounting methods on a printed circuit board.

FIG. 11 is a diagram showing a procedure for correcting a component mounting position according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Surface mounter, 2 ... Cabinet, 3 ... Base plate, 4 ... Mounting head, 5 ... Robot, 6 ... Printed circuit board, 7 ... Belt conveyor, 8 ... Tape cartridge, 9 ... Feeder base, 10 ... Tape feeder, 11a , 11b ... CR
T, 12 ... Keyboard, 13 ... Operation panel, 14 ... Image processing device, 15 ... Controller, 16 ... Z-axis slide block, 17 ... X-axis arm, 18a ... Y1-axis arm, 1
8b ... Y2-axis arm, 9 ... Z-axis base, 20 ... Z-axis motor, 22 ... X-axis motor, 25a ... Y1-axis motor, 25b
... Y2-axis motor, 30 ... Head base, 31 ... Nozzle index mechanism, 32, 93 ... Pulse motor, 33 ... Housing, 34, 35, 36 ... Suction nozzle, 37 ... Positioning cylinder, 38 ... Camera air cylinder, 41 …
Rotating plate, 52, 112 ... Parts, 64 ... Light source, 65 ... Optical system block, 66, 67 ... Plane mirror, 68 ... Window, 71, 7
5 ... CCD camera, 72 ... camera controller, 73 ...
High-speed processor for image processing, 74 ... Camera switching board, 76 ... Frame memory board, 80 ... Personal computer, 8
3 ... Bus expansion board, 84 ... Flexible disk, 8
5 ... Bus expansion box, 86 ... Input / output board, 87, 8
8, 89 ... Motor control board, 90 ... Output board, 91 ... Input board, 92a, 92b ... Interface board, 96, 97 ... Position sensor, 113 ... Component suction device, 114 ... Suction nozzle, 115 ... Measuring area.

Claims (2)

[Claims] 1. A component supply device for feeding a component mounted on a circuit board to a predetermined take-out position, a component suction device for sucking a component at the take-out position, and a component sucked by the component suction device. A component positioning device that moves the mounting position on the circuit board to a position above the mounting position;
In a surface mounter equipped with a measuring device for measuring the position of the center of gravity of the sucked component, the measuring device measures the position of the center of gravity of the sucked component above the mounting position, and this measurement is performed. Based on the position of the center of gravity, the component positioning device determines the suction position of the component to be sucked by the component suction device, and controls the component suction device to suck the component at the determined suction position. Characteristic surface mounter. 2. The component positioning device comprises: (a) the position of the center of gravity of the component measured by the measuring device in the coordinate system of the measuring device; and the mounting position of the component above the pick-up position of the component suction device. The center of rotation for ensuring the mounting posture in Fig. 4 is converted from the coordinate system of the measuring device to a coordinate system whose origin is the center position, and (b) the (a) The position of the center of gravity when the component is adsorbed by the component adsorbing device at the pick-up position, based on the position of the center of gravity and the angle of rotation represented by the coordinate system with the center position of the rotation as the origin. And (c) the center of gravity position obtained in (b) above is converted from the coordinate system whose origin is the center position of the rotation into the coordinate system of the measuring device, and (d) in (c) above. Converted center of gravity position and the rotation The surface mounter according to claim 1, wherein a difference from the center position of the component is calculated, and (e) the component suction position is corrected based on the difference calculated in (d).