JPS59182987U - module case - Google Patents
module caseInfo
- Publication number
- JPS59182987U JPS59182987U JP7705483U JP7705483U JPS59182987U JP S59182987 U JPS59182987 U JP S59182987U JP 7705483 U JP7705483 U JP 7705483U JP 7705483 U JP7705483 U JP 7705483U JP S59182987 U JPS59182987 U JP S59182987U
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- substrate
- module case
- active elements
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のモジュールケースの斜視図（但し、上面
カバーを分離した状態）、第２図は第１図の矢印Ａ方向
からみた平面図（但し、上面カバーを除いた状態）、第
３図は第１図のＢ−Ｂ’線断面図（但し、上面カバー取
着状態）、第４図は本考案のモジュールケースの斜視図
（但し、箱形状キャップを上方に分離した状態）、第５
図は第４図の矢印Ａ方向からみた平面図（但し、箱形状
キャップを除いた状態）、第６図は第４図のＤ−Ｄ′線
断面図（但し、箱形状キャップ取着状態）第７図は第６
図の放熱体３３の単体斜視図である。
１４・・・・・・ＭＩＣ基板、１５・・・・・・能動素
子（例えばＧａＡｓＦＥＴ）、１６ 、 １７−−−−
−−人・出力用ハーメチックＲＦ同軸端子（気密端子）
、１８．１９・・・・・・ハーメチックバイアス端子（
例えば、ガラス気密端子）、２２・・・金リボン、２３
・・・・・・細いワイヤ、３０・・・・・・本考案のモ
ジュールケース、３１・・・・・・底板、３２・・・・
・・箱形状キャップ、３３・・・・・・放熱体。
第１図
第４図Figure 1 is a perspective view of a conventional module case (with the top cover separated), Figure 2 is a plan view seen from the direction of arrow A in Figure 1 (with the top cover removed), and Figure 3 is a perspective view of a conventional module case (with the top cover removed). The figures are a sectional view taken along the line B-B' in Figure 1 (with the top cover attached), Figure 4 is a perspective view of the module case of the present invention (with the box-shaped cap separated upwards), and Figure 4 is a perspective view of the module case of the present invention (with the box-shaped cap separated upwards). 5
The figure is a plan view seen from the direction of arrow A in Figure 4 (with the box-shaped cap removed), and Figure 6 is a sectional view taken along line D-D' in Figure 4 (with the box-shaped cap attached). Figure 7 is the 6th
FIG. 3 is a perspective view of the heat sink 33 shown in FIG. 14... MIC board, 15... Active element (e.g. GaAsFET), 16, 17---
--Hermetic RF coaxial terminal for human/output (airtight terminal)
, 18.19... Hermetic bias terminal (
For example, glass airtight terminal), 22...gold ribbon, 23
... Thin wire, 30 ... Module case of the present invention, 31 ... Bottom plate, 32 ...
...Box-shaped cap, 33... Heat sink. Figure 1 Figure 4
Claims (1)
れ該底板上に密閉空間を形成する箱形状の金属製キャッ
プとから成り、前記底板上に複数個のマイクロ波集積回
路基板を配列固定しかつ該基板近傍に能動素子を配置固
定してモジュールを形成し、前記基板に電気的接続され
る入・出力端子とバイアス端子とを前記底板に上下方向
に貫通して設け、前記能動素子配置部分の底板に高熱伝
゛ 導率を有する放熱体を貫通して設けたことを
特徴とするモジュールケース。It consists of a horizontally arranged metal bottom plate, and a box-shaped metal cap that is placed and fixed on the bottom plate to form a sealed space on the bottom plate, and a plurality of microwave integrated circuit boards are mounted on the bottom plate. A module is formed by arranging and fixing active elements near the substrate, and input/output terminals and bias terminals electrically connected to the substrate are provided vertically through the bottom plate, and active elements are arranged and fixed near the substrate. A module case characterized in that a heat sink having high thermal conductivity is provided through the bottom plate of the element arrangement portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7705483U JPS59182987U (en) | 1983-05-24 | 1983-05-24 | module case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7705483U JPS59182987U (en) | 1983-05-24 | 1983-05-24 | module case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59182987U true JPS59182987U (en) | 1984-12-06 |
Family
ID=30207100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7705483U Pending JPS59182987U (en) | 1983-05-24 | 1983-05-24 | module case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59182987U (en) |
-
1983
- 1983-05-24 JP JP7705483U patent/JPS59182987U/en active Pending
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