JPS59182532A - ボンデイング装置用加熱装置 - Google Patents

ボンデイング装置用加熱装置

Info

Publication number
JPS59182532A
JPS59182532A JP58055235A JP5523583A JPS59182532A JP S59182532 A JPS59182532 A JP S59182532A JP 58055235 A JP58055235 A JP 58055235A JP 5523583 A JP5523583 A JP 5523583A JP S59182532 A JPS59182532 A JP S59182532A
Authority
JP
Japan
Prior art keywords
gas
bonding
heater
lead frame
bonding work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58055235A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0254664B2 (en:Method
Inventor
Hiroshi Ushiki
博 丑木
Koichi Orita
折田　浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58055235A priority Critical patent/JPS59182532A/ja
Publication of JPS59182532A publication Critical patent/JPS59182532A/ja
Publication of JPH0254664B2 publication Critical patent/JPH0254664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
    • H10W72/07337—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP58055235A 1983-04-01 1983-04-01 ボンデイング装置用加熱装置 Granted JPS59182532A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58055235A JPS59182532A (ja) 1983-04-01 1983-04-01 ボンデイング装置用加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58055235A JPS59182532A (ja) 1983-04-01 1983-04-01 ボンデイング装置用加熱装置

Publications (2)

Publication Number Publication Date
JPS59182532A true JPS59182532A (ja) 1984-10-17
JPH0254664B2 JPH0254664B2 (en:Method) 1990-11-22

Family

ID=12992937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58055235A Granted JPS59182532A (ja) 1983-04-01 1983-04-01 ボンデイング装置用加熱装置

Country Status (1)

Country Link
JP (1) JPS59182532A (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234429U (en:Method) * 1985-08-17 1987-02-28
JPS63142642A (ja) * 1986-12-05 1988-06-15 Kuwano Denki Kk フレ−ムの酸化防止装置
WO2003012833A3 (en) * 2001-08-01 2004-03-04 Li Logix Inc D B A Rd Automati Process and apparatus for mounting semiconductor components to substrates and parts therefor
JP2013111646A (ja) * 2011-12-01 2013-06-10 Fuji Electric Co Ltd ガス発生装置、はんだ接合装置およびはんだ接合方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (en:Method) * 1973-04-04 1974-12-03
JPS53162659U (en:Method) * 1977-05-25 1978-12-20
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor
JPS5687331A (en) * 1979-12-18 1981-07-15 Toshiba Corp Reducing furnace for solder-treatment
JPS56163423A (en) * 1980-04-15 1981-12-16 Commissariat Energie Atomique Seismic gauge
JPS5742175U (en:Method) * 1980-08-14 1982-03-08

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (en:Method) * 1973-04-04 1974-12-03
JPS53162659U (en:Method) * 1977-05-25 1978-12-20
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor
JPS5687331A (en) * 1979-12-18 1981-07-15 Toshiba Corp Reducing furnace for solder-treatment
JPS56163423A (en) * 1980-04-15 1981-12-16 Commissariat Energie Atomique Seismic gauge
JPS5742175U (en:Method) * 1980-08-14 1982-03-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234429U (en:Method) * 1985-08-17 1987-02-28
JPS63142642A (ja) * 1986-12-05 1988-06-15 Kuwano Denki Kk フレ−ムの酸化防止装置
WO2003012833A3 (en) * 2001-08-01 2004-03-04 Li Logix Inc D B A Rd Automati Process and apparatus for mounting semiconductor components to substrates and parts therefor
US6818543B2 (en) 2001-08-01 2004-11-16 Lilogix, Inc. Process and apparatus for mounting semiconductor components to substrates and parts therefor
JP2013111646A (ja) * 2011-12-01 2013-06-10 Fuji Electric Co Ltd ガス発生装置、はんだ接合装置およびはんだ接合方法

Also Published As

Publication number Publication date
JPH0254664B2 (en:Method) 1990-11-22

Similar Documents

Publication Publication Date Title
US7975899B2 (en) Work clamp and wire bonding apparatus
JPS59182532A (ja) ボンデイング装置用加熱装置
JP5823081B1 (ja) 放電加工装置
JPH0319223Y2 (en:Method)
JPH0669050B2 (ja) ボンデイング装置用加熱装置
JPH051980B2 (en:Method)
US5162068A (en) Method for preventing oxidation of lead frame in bonding system
US5120391A (en) Tape bonding apparatus
JPH0648694B2 (ja) ボンデイング装置用加熱装置
JPS5925232A (ja) ワイヤボンディング装置
JPH0236063B2 (en:Method)
JPH09148369A (ja) ボンディング装置用クランプ機構
CN223926564U (zh) 老化测试设备
JPS5898510A (ja) ２段スライド式ゲ−トの扉間水密装置
JPH0139213B2 (en:Method)
SU1252094A1 (ru) Полуавтомат дл сборки и пайки проводов с печатной платой
JPH0432539B2 (en:Method)
JPH0216742A (ja) 半導体装置の製造装置
JP4088217B2 (ja) インナーリードボンディング装置
US5285943A (en) Tape feeding apparatus
JPH0680692B2 (ja) ボンデイング装置
JPH0793337B2 (ja) ワーク加熱送り装置
SU1017445A1 (ru) Устройство дл пайки кристаллов
JPH023625Y2 (en:Method)
JPH01241889A (ja) リードボンダ