JPS59178192A - レ−ザ加工方法 - Google Patents
レ−ザ加工方法Info
- Publication number
- JPS59178192A JPS59178192A JP58050359A JP5035983A JPS59178192A JP S59178192 A JPS59178192 A JP S59178192A JP 58050359 A JP58050359 A JP 58050359A JP 5035983 A JP5035983 A JP 5035983A JP S59178192 A JPS59178192 A JP S59178192A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- processing
- workpiece
- machining
- worked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 3
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000001704 evaporation Methods 0.000 claims abstract 2
- 235000011149 sulphuric acid Nutrition 0.000 claims abstract 2
- 238000003754 machining Methods 0.000 claims description 31
- 239000012530 fluid Substances 0.000 claims description 23
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 10
- 239000007789 gas Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000010355 oscillation Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical compound OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
- B23K26/128—Laser beam path enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58050359A JPS59178192A (ja) | 1983-03-28 | 1983-03-28 | レ−ザ加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58050359A JPS59178192A (ja) | 1983-03-28 | 1983-03-28 | レ−ザ加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59178192A true JPS59178192A (ja) | 1984-10-09 |
| JPS637875B2 JPS637875B2 (enrdf_load_stackoverflow) | 1988-02-18 |
Family
ID=12856695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58050359A Granted JPS59178192A (ja) | 1983-03-28 | 1983-03-28 | レ−ザ加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59178192A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3801068A1 (de) * | 1988-01-15 | 1989-07-27 | Maho Ag | Verfahren und vorrichtung zum abtragen mittels gebuendelter energiestrahlen |
| DE102006056881B4 (de) * | 2006-01-10 | 2010-11-04 | Contrel Technology Co., Ltd., Sinshin | Laser-Bearbeitungsvorrichtung |
| CN109514081A (zh) * | 2018-12-11 | 2019-03-26 | 中国科学院宁波材料技术与工程研究所 | 一种水导激光加工装置及加工系统 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582780A (en) * | 1978-12-16 | 1980-06-21 | Toshiba Corp | Surface processing method for metal or the like article |
-
1983
- 1983-03-28 JP JP58050359A patent/JPS59178192A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582780A (en) * | 1978-12-16 | 1980-06-21 | Toshiba Corp | Surface processing method for metal or the like article |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3801068A1 (de) * | 1988-01-15 | 1989-07-27 | Maho Ag | Verfahren und vorrichtung zum abtragen mittels gebuendelter energiestrahlen |
| DE102006056881B4 (de) * | 2006-01-10 | 2010-11-04 | Contrel Technology Co., Ltd., Sinshin | Laser-Bearbeitungsvorrichtung |
| CN109514081A (zh) * | 2018-12-11 | 2019-03-26 | 中国科学院宁波材料技术与工程研究所 | 一种水导激光加工装置及加工系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS637875B2 (enrdf_load_stackoverflow) | 1988-02-18 |
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