JPS59178189A - レ−ザ加工装置 - Google Patents
レ−ザ加工装置Info
- Publication number
- JPS59178189A JPS59178189A JP58051580A JP5158083A JPS59178189A JP S59178189 A JPS59178189 A JP S59178189A JP 58051580 A JP58051580 A JP 58051580A JP 5158083 A JP5158083 A JP 5158083A JP S59178189 A JPS59178189 A JP S59178189A
- Authority
- JP
- Japan
- Prior art keywords
- working
- machining
- laser
- processing
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 238000003754 machining Methods 0.000 claims description 85
- 239000012530 fluid Substances 0.000 claims description 45
- 238000005187 foaming Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 8
- 238000001704 evaporation Methods 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58051580A JPS59178189A (ja) | 1983-03-29 | 1983-03-29 | レ−ザ加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58051580A JPS59178189A (ja) | 1983-03-29 | 1983-03-29 | レ−ザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59178189A true JPS59178189A (ja) | 1984-10-09 |
JPH0325273B2 JPH0325273B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-04-05 |
Family
ID=12890875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58051580A Granted JPS59178189A (ja) | 1983-03-29 | 1983-03-29 | レ−ザ加工装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59178189A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01104493A (ja) * | 1987-10-16 | 1989-04-21 | Mitsubishi Electric Corp | レーザ加工機 |
US6835319B2 (en) * | 2001-10-25 | 2004-12-28 | Data Storage Institute | Method of patterning a substrate |
CN103212845A (zh) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | 用于薄壁管材激光微加工的同轴水射流装置 |
CN103286446A (zh) * | 2013-05-23 | 2013-09-11 | 昆山丞麟激光科技有限公司 | 一种激光加工同步碎屑清除装置及方法 |
CN109746572A (zh) * | 2017-11-07 | 2019-05-14 | 株式会社迪思科 | 激光加工装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58221690A (ja) * | 1982-06-18 | 1983-12-23 | Nippon Telegr & Teleph Corp <Ntt> | 固体の加工方法 |
-
1983
- 1983-03-29 JP JP58051580A patent/JPS59178189A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58221690A (ja) * | 1982-06-18 | 1983-12-23 | Nippon Telegr & Teleph Corp <Ntt> | 固体の加工方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01104493A (ja) * | 1987-10-16 | 1989-04-21 | Mitsubishi Electric Corp | レーザ加工機 |
US6835319B2 (en) * | 2001-10-25 | 2004-12-28 | Data Storage Institute | Method of patterning a substrate |
CN103212845A (zh) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | 用于薄壁管材激光微加工的同轴水射流装置 |
CN103286446A (zh) * | 2013-05-23 | 2013-09-11 | 昆山丞麟激光科技有限公司 | 一种激光加工同步碎屑清除装置及方法 |
CN109746572A (zh) * | 2017-11-07 | 2019-05-14 | 株式会社迪思科 | 激光加工装置 |
CN109746572B (zh) * | 2017-11-07 | 2022-04-01 | 株式会社迪思科 | 激光加工装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0325273B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-04-05 |