JPS59175194A - Heat sink unit of electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a heat dissipation structure for an electronic device that is installed inside a case.

[Prior art]

In general, small and portable electronic devices such as teaching boxes that are connected to robot control boards are compact and highly functional in terms of operability and functionality, and the control circuit inside the teaching box is highly functional. has high density and high integration. As a result, power consumption increases and the amount of heat generated inside the device increases, making it necessary to take measures to dissipate heat and cool the device. The heat dissipation method, which uses an open structure to release heat to the outside, makes the case heavier and makes it harder to operate.Furthermore, the case is conductive, making it vulnerable to electrostatic noise when held in the hand. There are ≠2. In addition, there were problems with the heat dissipation method of Volkpur Electronics, such as making the case thicker, which would cause problems with operability, and making the case an open structure, making it impossible to use in adverse environments.

[Purpose of the invention]

The present invention has been developed in view of these problems, and its object is to provide a heat dissipation structure for electronic equipment that can be sufficiently cooled even in electrically insulating cases.

[Summary of the invention]

In order to achieve the above-mentioned object, the present invention guides the heat generated from the electronic elements disposed inside the case through a cable to a separate external heat dissipation fin attached to the outside.
This is how heat is radiated.

[Embodiments of the invention]

Next, one embodiment of the present invention will be explained with reference to FIGS.

FIG. 1 is an external side view of an electronic device according to the present invention, and FIG. 2 is a front view thereof. No. 3121 is a side sectional view shown in FIG. 1, and FIG. 4 is an enlarged sectional view of the cable.

In FIGS. 1 to 3, reference numeral 1 denotes an electronic/equipment storage case made of insulating resin and sealed, and a cable connecting the electronic equipment in the 2-case case J with an external device 20 (for example, a main control panel). , 3 is a control board constituting the electronic device, 4
1] (This is a display substrate.

The cable 2 has a structure as shown in FIG. As shown in FIG. The display board 4 is connected to the display board 4, and the control board 3 is connected to the lower part of the display board 3 to hold them in parallel.The end of the display board 4 is connected to the signal line 12 of the cable 2 via the connector 8. The other end of the signal line 12 is connected to the electronic element 22 in the external device 20. Also, the element 6 that generates the largest amount of heat is connected to the end of the control board 3, and the element 6 is housed. The cape/L/
It is connected to the shielded wire 11 of No. 2.

The other end of this shielded wire 11 is connected to a radiation fin 21 attached to an external device 20.

In this way, the element 6 with the largest calorific value in the housing case 1
≠; Connected to the heat dissipation block 7 and further connected to the shield wire 11
Since the element 6 is connected to the heat dissipation fin 21 via
The heat generated is transferred to the storage case 1 via the heat dissipation block 7.
At the same time, the heat is conducted to the shield wire 11 and radiated by the radiation fins 21. Therefore, it is possible to prevent the electronic equipment inside the case 1 from becoming over-temperature. In the above-mentioned embodiment, the heat generated inside the case is conducted to the shield wire via the heat radiation block and is radiated to the cable outside the case. Alternatively, a special dedicated line for heat transfer may be provided within the cable 2, and the heat within the case may be conducted to this line and radiated outside the case. In addition, an aluminum plate is arranged on the lower side of the control board 3 including the element 6 shown in FIG. Heat can also be radiated outside the case by conduction through a dedicated line wired inside the cable.

〔Effect of the invention〕

As described above, the heat dissipation method of the portable electronic device of the present invention has a structure in which the heat generated by the electronic device is conducted to the cable and radiated outside the case, so the entire case including the electronic device is lightweight and small. This has the effect of effectively dissipating the heat generated within the case.

[Brief explanation of the drawing]

Fig. 1 is an external side view of an electronic device according to the present invention, Fig. 2 is a front view thereof, Fig. 3 is a side sectional view showing the relationship between the electronic device and an external device, and Fig. 4 is an enlarged view of a cable. FIG. 1...Case 2...Cable 3...
Control board 4... Display board 5... Connector 6... Element 7... Heat dissipation block 8
... Connector 10 ... Sheath 11 ...
・Shield wire 12...Signal @ 20...External device 21...Radiating fin 22...Electronic element sinking (2nd m of the day)

Claims (1)

[Claims] In an electronic device connected to an external device by a cable, heat generated from an element arranged in a case of the electronic device is guided to a heat radiation fin attached to the external device via the cable. A heat dissipation device for electronic equipment characterized by the following.