JPS59172260A - ボンディングワイヤボ−ル形成の制御 - Google Patents

ボンディングワイヤボ−ル形成の制御

Info

Publication number
JPS59172260A
JPS59172260A JP59014544A JP1454484A JPS59172260A JP S59172260 A JPS59172260 A JP S59172260A JP 59014544 A JP59014544 A JP 59014544A JP 1454484 A JP1454484 A JP 1454484A JP S59172260 A JPS59172260 A JP S59172260A
Authority
JP
Japan
Prior art keywords
capacitor
ball
pulse
bonding wire
shroud
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59014544A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347580B2 (enExample
Inventor
ジョン　エイ・カーツ
ドナルド　イー・コーセンズ
マーク　デイ・デュフォー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Camera and Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera and Instrument Corp filed Critical Fairchild Camera and Instrument Corp
Publication of JPS59172260A publication Critical patent/JPS59172260A/ja
Publication of JPH0347580B2 publication Critical patent/JPH0347580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP59014544A 1983-02-01 1984-01-31 ボンディングワイヤボ−ル形成の制御 Granted JPS59172260A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/463,033 US4476366A (en) 1983-02-01 1983-02-01 Controlled bonding wire ball formation
US463033 1983-02-01

Publications (2)

Publication Number Publication Date
JPS59172260A true JPS59172260A (ja) 1984-09-28
JPH0347580B2 JPH0347580B2 (enExample) 1991-07-19

Family

ID=23838641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59014544A Granted JPS59172260A (ja) 1983-02-01 1984-01-31 ボンディングワイヤボ−ル形成の制御

Country Status (4)

Country Link
US (1) US4476366A (enExample)
EP (1) EP0115998A3 (enExample)
JP (1) JPS59172260A (enExample)
CA (1) CA1203287A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08102608A (ja) * 1994-09-30 1996-04-16 Nec Corp アンテナ装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4482794A (en) * 1983-11-28 1984-11-13 Fairchild Camera & Instrument Corporation Pulse-width control of bonding ball formation
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
US4909427A (en) * 1989-05-17 1990-03-20 Plaisted Alan H Bonding wire ball formation
US6001724A (en) * 1996-01-29 1999-12-14 Micron Technology, Inc. Method for forming bumps on a semiconductor die using applied voltage pulses to an aluminum wire
US6234376B1 (en) * 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding
US6898849B2 (en) * 2000-09-27 2005-05-31 Texas Instruments Incorporated Method for controlling wire balls in electronic bonding
US6555777B1 (en) * 2002-01-11 2003-04-29 Sauer-Danfoss Inc. Method of manufacturing bimetal slippers
US20080293235A1 (en) * 2007-05-22 2008-11-27 Harris Corporation Compound wirebonding and method for minimizing integrated circuit damage
US7915721B2 (en) 2008-03-12 2011-03-29 Fairchild Semiconductor Corporation Semiconductor die package including IC driver and bridge

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3241218A (en) * 1962-01-05 1966-03-22 New Twist Connector Corp Method of fabricating pin connectors
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
US4459452A (en) * 1980-06-30 1984-07-10 The Welding Institute Ball bonding of wire
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08102608A (ja) * 1994-09-30 1996-04-16 Nec Corp アンテナ装置

Also Published As

Publication number Publication date
US4476366A (en) 1984-10-09
EP0115998A3 (en) 1986-12-30
EP0115998A2 (en) 1984-08-15
JPH0347580B2 (enExample) 1991-07-19
CA1203287A (en) 1986-04-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term