JPS59171135A - Wafer conveying device - Google Patents

Wafer conveying device

Info

Publication number
JPS59171135A
JPS59171135A JP4413983A JP4413983A JPS59171135A JP S59171135 A JPS59171135 A JP S59171135A JP 4413983 A JP4413983 A JP 4413983A JP 4413983 A JP4413983 A JP 4413983A JP S59171135 A JPS59171135 A JP S59171135A
Authority
JP
Japan
Prior art keywords
wafer
pulse motor
belt
processing chamber
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4413983A
Other languages
Japanese (ja)
Inventor
Masaji Nagano
長野　正司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4413983A priority Critical patent/JPS59171135A/en
Publication of JPS59171135A publication Critical patent/JPS59171135A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To eliminate the positional deviation of the wafer located in a processing chamber by a method wherein, in the case of load-lock system semiconductor manufacturing device in which a preparatory chamber and a processing chamber are interlinked, a photosensor is provided corresponding to the belt located in the preparatory chamber, with which wafers will be conveyed, the pulse motor with which the belt will be driven is controlled by the output signal sent from said photosensor, and the belt is once stopped at the delivery position. CONSTITUTION:The preparatory chamber 21 and the processing chamber 20 are interlinked, and the belt 30 whereon a pulse motor 41, a rail 43 and a wafer 10 are placed and a wafer conveying means 40 consisting of a photosensor 44 are arranged in the preparatory chamber 21. Then, as a foreprocessing, first the belt whereon the wafer 10 is placed is sent in the preparatory chamber 21, it is received by a receiving means 42, the motor 41 controlled by the pulse sent from the driving device 45 provided outside, and the belt 30 is slided on the lower face of the rail 43. Then, when the belt 30 reaches a conveying position 52, it is detected by a photosensor 44, the device 45 is once stopped by the output of the photosensor 44 and after the wafer 10 has been sent to the processing chamber 20, the belt 30 is returned to a stand-by position 50.

Description

【発明の詳細な説明】 （発明の利用分野〕 本発明は、ウェハ搬送装置Ｈに係り、特にロードロック
方式の半導体製造装置に好適なウニノー搬送装置１こ関
するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a wafer transfer device H, and particularly to a Uninow transfer device 1 suitable for a load-lock type semiconductor manufacturing device.

〔従来技術〕[Prior art]

従来、処理室に予備室が置設された、いわゆるロードロ
ツタ方式の半導体製造装置で慎Ｊ］ｊされているウェハ
搬送装置を第１図より説明する。A wafer transfer device that has conventionally been used in a so-called load rotor type semiconductor manufacturing apparatus in which a preliminary chamber is installed in a processing chamber will be described with reference to FIG.

第１図で、ウェハ１０を所定加］−処理する処理室２０
には、例えば、ケートバルブ（図示省略）を介して予備
室２１が置設されている。ｆ備室２目こは、前工程より
ウェハ１０を予備室２１に、また、予備室２１よりウェ
ハ１０を後丁程裔こ搬送する手段、例えば、ヘルド関と
、予備室２１と処理室加との間でウェハ１０を搬送する
ウェハ搬送装置４０を構成するパルスモータ４１．パル
スモータ４１に設けられたウェハ受取手段４２．レール
４３．検出器必が内設されている。In FIG. 1, a processing chamber 20 in which the wafer 10 is subjected to a predetermined process
For example, a preliminary chamber 21 is installed through a gate valve (not shown). f Preparation chamber 2 This is a means for transporting wafers 10 from the previous process to the preparatory chamber 21, and from the preparatory chamber 21 to the subsequent process, such as a heald rail, and a connection between the preparatory chamber 21 and the processing chamber. A pulse motor 41 , which constitutes a wafer transport device 40 that transports the wafer 10 between the two pulse motors 41 . Wafer receiving means 42 provided on the pulse motor 41. Rail 43. A detector is installed internally.

レール４３は、ベルト（資）に載置されたウェハ１０の
搬送を阻害しない位置で、かつ、ベルト（９）に載置さ
れ前工程より搬送されてきたウェハ】０をウェハ受取手
段４２で受取り可能、ウェハ受取手段４２で受取られた
ウェハ】０を処仰室加の所定イ装置に搬送可能並ひにそ
れらとは逆操作可能な位置に設けられている。パルスモ
ータ４１は、レール４３１こ移ｆｆｔｔ＋ｉＵ能に載Ｉ
Ｎされるとともに、ウェハ搬送装置４０を構ｊ戊し、か
つ、工・備室２１の外側に設けられたパルス駆動装［Ｎ
　（以ド、駆動装置と略）４５に接続されている。The rail 43 is located at a position that does not obstruct the conveyance of the wafer 10 placed on the belt (material), and allows the wafer receiving means 42 to receive the wafer 10 placed on the belt (9) and conveyed from the previous process. The wafer receiving means 42 is provided at a position where the wafer received by the wafer receiving means 42 can be transported to a predetermined device in the treatment chamber, and where it can be operated in the opposite direction. The pulse motor 41 is mounted on the rail 431.
At the same time, the wafer transfer device 40 is configured and a pulse drive device [N
(hereinafter abbreviated as a drive device) 45.

駆動装置４５は、パルス発振器（図示省略）等で構成さ
れ所定数のパルスを発生させてパルスで一タ４１を待機
位置５０とウェハ受渡位置　（以ド、受渡位置と略）５
１との間、受渡位置５１とウェハ１０の処理室側への搬
入時並ひ）こ予備室２１への搬出時に要求されるパルス
モータ４１の停止位置　（以下、搬入出位眉と略）５２
どの間および待機位置５０と搬入出値ｉｉ！？、　５２
との間で走行駆動させる機能を有している。The drive device 45 is composed of a pulse oscillator (not shown), etc., and generates a predetermined number of pulses to move the wafer 41 between a standby position 50 and a wafer delivery position (hereinafter referred to as the delivery position) 5.
1, the transfer position 51 and the stop position of the pulse motor 41 required when the wafer 10 is carried into the processing chamber (hereinafter referred to as the carry-in/out position) 52
Which interval and standby position 50 and loading/unloading value ii! ? , 52
It has the function of running and driving between.

検出器４４は、待機位置５０に対応して設けられるとと
もＥこ、駆動装置４５（こ接続されている。検出器躬は
、例えハ、フォトセノ→Ｊ−であり、パルスモータ４１
が待機位置５０）こ到達したことを検出し駆動装置４５
が発生するパルスを、リセットしてパルスモータ４１を
停止１−させる。なお、処理室側はウェハ１０の所定処
理加二ｌ一時１こ所定圧力に減圧排気され、また予備室
２１は、ウェハ１０の予備室渓との間での搬送時（こ処
理室側と同圧力迄減圧す１気される。、前工程よりベル
ト３０に載置されウェハｌＯが楢（’ｌｆｉ室２１１こ
搬送され、この搬送されてきたつ。ハ１０は、ウェハ受
取手段４２と対応するＧ７．　Ｋで停止する。その後、
待機位置５０（こ待機しているパルスモータ４１を受渡
位置５１まで移動させる二とで、ウェハ１０はウェハ受
取手段４２に受取られる３、ウェハ受取手段４２でのウ
ェハ１０の受取り完了後、ゲートバルブが開放され、パ
ルスモータ４１を搬入用位置５２まで移動させることで
、ウェハ１０は処理室１０に搬入されて、例えば、テー
ブル（図示省略）トに載置される。その後、パルスモー
ク４１を搬入用位置５２から待機位置５０まで移動させ
パルスモータ４１が待機イ）７（召５０１こ到達した時
点で駆動装置４５が発生ずるパルスｔ　検出器４４でリ
セットすることで、パルスモータ４１は停止させられる
。The detector 44 is provided corresponding to the standby position 50, and is also connected to a drive device 45.
The drive device 45 detects that it has reached the standby position 50).
The pulse motor 41 is stopped by resetting the pulse generated by the pulse motor 41. The processing chamber side is depressurized and evacuated to a predetermined pressure once the wafer 10 is subjected to a predetermined process, and the preliminary chamber 21 is evacuated to a predetermined pressure when the wafer 10 is being processed (same as the processing chamber side). The wafer 10 placed on the belt 30 from the previous process is transported to the lfi chamber 211, and the wafer 10 is transported to the wafer receiving means 42 and the wafer 10 corresponding to the wafer receiving means 42. .Stop with K. Then,
By moving the waiting pulse motor 41 to the transfer position 51, the wafer 10 is received by the wafer receiving means 42. After receiving the wafer 10 by the wafer receiving means 42, the gate valve is released and the pulse motor 41 is moved to the loading position 52, and the wafer 10 is loaded into the processing chamber 10 and placed on, for example, a table (not shown).Then, the pulse motor 41 is loaded. The pulse motor 41 is moved from the working position 52 to the standby position 50 and the pulse motor 41 is on standby. .

なお、処理ン斉みのウェハ１０は、パルスモータ４１を
待機位置５０から搬入用位置５２まで移動させるこトチ
、ウェハ受取手段４２１こ受取られ、このウェハ１０は
、更に、パルスモータ４１を搬入用位置５２から受渡位
置５１まで移動させることで、ベルト３ｏに載置され後
工程へ搬送される。また、パルスモータ４１は、受渡（
１７置５１から待機位置５ｏまで移動し、検出器朝でパ
ルスなりセットすることで停止させられる。The wafers 10 to be processed are received by the wafer receiving means 421 by moving the pulse motor 41 from the standby position 50 to the loading position 52. By moving it from the position 52 to the delivery position 51, it is placed on the belt 3o and conveyed to the subsequent process. In addition, the pulse motor 41 is used for delivery (
It moves from the 17 position 51 to the standby position 5o, and is stopped by setting a pulse at the detector morning.

このようなウェハ搬送装置では、駆動装置が発生するパ
ルスがノイズ等の外乱を受は変化した場合は、パルスモ
ータを搬入用位置で精度良々停止させることができなく
なるため、処理室内でのウェハの位置にばらつきが生じ
加工処理が不安定になるといった欠点があった。In such a wafer transport device, if the pulses generated by the drive device change due to disturbances such as noise, the pulse motor cannot be accurately stopped at the loading position, so the wafers cannot be moved inside the processing chamber. This method has the disadvantage that positional variations occur and machining becomes unstable.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、処理室内でのウェハの位置にばらつき
が生じるのを防１１−することで、加工処理を安定化で
きるウェハ搬送装置を提供すること）こある。SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer transport device that can stabilize processing by preventing variations in the position of wafers within a processing chamber.

〔発明の概要〕[Summary of the invention]

本発明は、搬入用位置に対応して検出器を設けたことを
特徴とするもので、搬入出値ＩＩｑに対応して設けられ
た検出器）こより駆動装置が発生するパルスをリセット
することで、駆動装［１イがさと生するパルスがノイズ
等の外乱を受けた場合でもパルスモークを搬入用位置に
精度良く停止させるよう（こしたものである。The present invention is characterized in that a detector is provided corresponding to the carry-in position, and the pulse generated by the drive device is reset by the detector provided corresponding to the carry-in/out value IIq. The drive unit [1] is designed to accurately stop the pulse smoke at the loading position even if the generated pulses are subjected to disturbances such as noise.

〔発明の実施例〕 本発明の一実施例を第２図により説明する１、なお、第
２図で第１図と同−装面等は同一・符号で示し説明を省
略する。[Embodiment of the Invention] An embodiment of the present invention will be described with reference to FIG. 2. In FIG. 2, the same parts as those in FIG.

第２図で、検出器４４、例えば、フストセンサーは、搬
入用位置５２に対応して設けられている。In FIG. 2, a detector 44, for example a foot sensor, is provided corresponding to the loading position 52.

前工程よりウェハ１０がヘルド３０て予備室２１に搬送
され、この搬送されてきたウェハ１０はウェハ受取手段
４２と対応する位置で停止する。一方、パルスモータ４
１は駆動装置４５の発生するパルスによりレール４３上
を移動して受渡位置５１で停止［−する。ウェハ受取手
段４２が受渡位置５１でウェノ司０を受取った後にパル
スモータ４１は駆動装置４５の発）］；するパルスＩｎ
よりレール、ｉ３　、、Ｉ−ｆ！：搬入用位置５２１こ
向っで移動する。搬入用位置５２に移動してきたパルス
モータ４１を検出器４４が検知して駆動装置４５の発生
するパルスをリセットする。このため、パルスモータ４
１は検出器４４が検知した位置、つまり、搬入出値Ｆ＋
’５２　＋こ精度良く停止する。ウェハ１０は搬入用位
置５２で処理室側内に搬入される。ウェハ１０を搬入し
タハルスモータ４１は駆動装置４５の発生するパルスに
よりレール４３上を移動して待機位置５０で停止Ｈする
。処理室２０（こ搬入されたウェハ１０はエツチング等
の所定測子処理される。処理の終ったつ、ハ１０は、パ
ルスモータ４１により搬出されるが、二の場合、パルス
モータ４１は駆動装置４５の発生するパルスによりレー
ル４３　、、、Ｉ：、を搬入用位置５２に向って移動す
る。搬入出値Ｒ５２１こ移動してきたパルスモータ４１
を検出器４４が検知して駆動装置４５の発生するパルス
なりセットする。このため、パルスモータ４１は検出器
伺が検知した位置、つまり、搬入用位置５２で精度良く
停止する。その後、処理室（イ）からｆ備室２１に搬出
されたウェハ１０は、駆動装置４５の発生スるパルスｔ
こよりパルスモータ４１がレール４３、−）を移動した
後に、受渡位置５１で停止すること′で、ヘルｈ３０１
こ載置される。ベルト３０に載置されたウェハ１０は、
ベルトＩにより後工程に搬送され、−力、パルスモータ
４１は駆動装置４５の発生するパルス（こよりレール４
３土を移動して待機位置５０で停止ｌ−する。The wafer 10 is transported from the previous process to the preliminary chamber 21 by the heddle 30, and the transported wafer 10 is stopped at a position corresponding to the wafer receiving means 42. On the other hand, pulse motor 4
1 moves on the rail 43 by a pulse generated by the drive device 45 and stops at the delivery position 51 [-]. After the wafer receiving means 42 receives the wafer 0 at the transfer position 51, the pulse motor 41 generates a pulse In from the drive device 45).
More rail, i3,, If! :Move towards the carry-in position 521. The detector 44 detects the pulse motor 41 that has moved to the carry-in position 52 and resets the pulses generated by the drive device 45. For this reason, the pulse motor 4
1 is the position detected by the detector 44, that is, the loading/unloading value F+
'52 Stops with good precision. The wafer 10 is loaded into the processing chamber at the loading position 52 . The wafer 10 is carried in, and the Tahalus motor 41 moves on the rail 43 by pulses generated by the drive device 45 and stops at a standby position 50. The wafer 10 carried into the processing chamber 20 is subjected to predetermined processing such as etching. After the processing, the wafer 10 is carried out by a pulse motor 41. In the second case, the pulse motor 41 is The rails 43,..., I: are moved toward the carry-in position 52 by the pulses generated by the pulse motor 41, which has moved by the carry-in/out value R521.
The detector 44 detects and sets the pulse generated by the drive device 45. Therefore, the pulse motor 41 stops accurately at the position detected by the detector, that is, at the carry-in position 52. Thereafter, the wafer 10 carried out from the processing chamber (a) to the f preparation chamber 21 is driven by a pulse t generated by the drive device 45.
This allows the pulse motor 41 to move along the rails 43, -) and then stop at the delivery position 51.
This will be placed here. The wafer 10 placed on the belt 30 is
The pulse motor 41 transfers the pulses generated by the drive device 45 (from this, the rail 4
3. Move and stop at the standby position 50.

本実施例のようなウェハ搬送装置では、駆動装置の発生
するパルスをリセットするための検出器を搬入用位置（
こ設はたことで、駆動装置の発生ずるパルスがノイズ等
の外乱により変化してもパルスモータを精度良く搬入出
位置裔こ停止させる二とができるので、処理室内でのウ
ェハの位置が一定となり、エツチング等の加Ｔ処理が安
定化する。In a wafer transport device like this embodiment, a detector for resetting the pulses generated by the drive device is placed at the loading position (
This arrangement allows the pulse motor to be accurately stopped at the loading/unloading position even if the pulses generated by the drive device change due to disturbances such as noise, so the position of the wafer in the processing chamber remains constant. As a result, T-processing such as etching is stabilized.

〔発明の効果〕〔Effect of the invention〕

本発明は、以上説明したように、搬入出値ｊ１りに対応
して検出器を設けた二とで、駆動装置の発件するパルス
がノイズ等の外乱により変化してもパルスモータを精度
良く搬入用位置に停止Ｉ−させることができるので、処
理室内でのウェハの位置にばらつきが生じるのを防止で
き、加］−処理を安定化できるという効果がある。As explained above, the present invention provides a detector corresponding to the loading/unloading value j1, so that the pulse motor can be operated accurately even if the pulses generated by the drive device change due to disturbances such as noise. Since the wafer can be stopped at the carry-in position, variations in the position of the wafer within the processing chamber can be prevented and the processing can be stabilized.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来のウェハ搬送装置の構成図、第２図は、
本発明）こよるウェハ搬送装置の一実施例を示す構成図
である、 加・・・・・処理室、２１・・・・・予備室、（ト）・
・・・・・ベルト、４０・・・−ウェハ搬送装置、４１
・・・・・パルスモータ、４２・・・・・ウェハ受取手
段、４３・・・・・レール、祠・・・・・検出器、拓・
・・・・駆動装置、５２・・・・・搬入出位置矛２図FIG. 1 is a configuration diagram of a conventional wafer transfer device, and FIG.
21 is a configuration diagram showing an embodiment of the wafer transfer apparatus according to the present invention; processing chamber 21; preliminary chamber;
...Belt, 40...-Wafer transport device, 41
....Pulse motor, 42..Wafer receiving means, 43..Rail, shrine...Detector, Taku.
... Drive device, 52 ... Loading/unloading position spear 2

Claims (1)

【特許請求の範囲】[Claims] １　パルスモータと、該パルスモータの移動を案内する
レールと、［１［ｆ記パルスモータに設けられたウェハ
受取手段と、所定数のパルスを発生させて前記パルス什
−タを所定区間移動させるパルスモータ駆動装置と、該
パルスモータ駆動装置斤が発生するパルスをリセノトシ
て前記パルスモータを停止さ！する検出器とで構成され
るとともに、処理室に置設された予備室に前工程より搬
送されてきたウェハな前記処理室に搬入し、処理済みの
前記つ丁ハを前記処理室から前記予備室に後丁−稈へ搬
送するために搬出する装置において、前記ウェハの前記
予備室からの前記処理室への搬入時並び（こ処理室から
の予備室への搬出時に要求される前記パルスモータの停
止位置に対応して前記検出器を設けたことを特徴とする
ウェハ搬送装置。1. A pulse motor, a rail for guiding the movement of the pulse motor, [1[f] wafer receiving means provided on the pulse motor, and generating a predetermined number of pulses to move the pulse stator over a predetermined distance. Stop the pulse motor by resetting the pulse motor drive device and the pulses generated by the pulse motor drive device! The wafers transported from the previous process to the preliminary chamber installed in the processing chamber are transported into the processing chamber, and the processed wafers are transferred from the processing chamber to the preliminary chamber. In a device for transporting the wafers from the preliminary chamber to the processing chamber, the pulse motor is A wafer transfer device characterized in that the detector is provided corresponding to a stop position of the wafer.
JP4413983A 1983-03-18 1983-03-18 Wafer conveying device Pending JPS59171135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4413983A JPS59171135A (en) 1983-03-18 1983-03-18 Wafer conveying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4413983A JPS59171135A (en) 1983-03-18 1983-03-18 Wafer conveying device

Publications (1)

Publication Number Publication Date
JPS59171135A true JPS59171135A (en) 1984-09-27

Family

ID=12683299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4413983A Pending JPS59171135A (en) 1983-03-18 1983-03-18 Wafer conveying device

Country Status (1)

Country Link
JP (1) JPS59171135A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254627A (en) * 1984-05-30 1985-12-16 Hitachi Ltd Carrying mechanism for semiconductor substrate
WO2014036747A1 (en) * 2012-09-06 2014-03-13 深圳市华星光电技术有限公司 Oven and adjustable baking system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254627A (en) * 1984-05-30 1985-12-16 Hitachi Ltd Carrying mechanism for semiconductor substrate
JPH0580825B2 (en) * 1984-05-30 1993-11-10 Hitachi Ltd
WO2014036747A1 (en) * 2012-09-06 2014-03-13 深圳市华星光电技术有限公司 Oven and adjustable baking system

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