JPH01248634A - Conveying device for semiconductor wafer - Google Patents
Conveying device for semiconductor waferInfo
- Publication number
- JPH01248634A JPH01248634A JP63079424A JP7942488A JPH01248634A JP H01248634 A JPH01248634 A JP H01248634A JP 63079424 A JP63079424 A JP 63079424A JP 7942488 A JP7942488 A JP 7942488A JP H01248634 A JPH01248634 A JP H01248634A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- carrier
- semiconductor wafer
- inclination
- elevator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims abstract description 57
- 238000001514 detection method Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000032258 transport Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体ウェハの搬出装置に係り、特にキャリア
から自動的に一枚づつ半導体ウエノ・を取シ出して次の
ユニットに搬送するウエノ・の搬出装出装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a semiconductor wafer unloading device, and in particular to a wafer unloading device that automatically takes out semiconductor wafers one by one from a carrier and transports them to the next unit. The present invention relates to a loading/unloading device.
従来、この種の半導体ウェハの搬出装置は、第３図に示
すように、エレベータステージ４上にキャリア２を半導
体ウェハｌが水平になる方向にセットし、モータ１０．
送りネジ９からなるエレベータを、リニアスライド１３
に沿って順次下降させて、キャリア２内のウェハ１を下
から順番に、搬送ベルト３により搬出するという機構と
なっていた。ここで、半導体ウェハｌの水平度は、光学
的方法により、ウエハセンプ１８で検出される。Conventionally, in this type of semiconductor wafer unloading device, as shown in FIG. 3, a carrier 2 is set on an elevator stage 4 in a direction in which the semiconductor wafer l is horizontal, and a motor 10.
An elevator consisting of a feed screw 9 is connected to a linear slide 13.
The mechanism was such that the wafers 1 in the carrier 2 are sequentially lowered along the carrier 2 and transported out from the bottom by the conveyor belt 3. Here, the levelness of the semiconductor wafer l is detected by the wafer sensor 18 using an optical method.
〔発明が解決しようとする課題Ｊ 半導体ウェハｌを収納するキャリア２は、材質。[Problem to be solved by the invention J The carrier 2 that stores the semiconductor wafer l is made of a material.
製作方法による寸法精度のばらつきや、半４体製造工程
での熱処理や薬品による変形等、多少の歪は否めない。It is undeniable that there will be some distortion due to variations in dimensional accuracy due to the manufacturing method and deformation due to heat treatment and chemicals during the manufacturing process of the halves.
従って、キャリア２の歪のために、半畳体ウェハｌの面
が傾いて、搬送面との平行がとれなくなってしまうこと
がある。Therefore, due to the distortion of the carrier 2, the surface of the semi-folded wafer l may be tilted and not parallel to the transport surface.
この為、前述した従来のウェハの搬出装置では、搬送面
とウェハｌの裏面が傾いてしまうと、スム−ズなウェハ
ｌの搬出ができなくなシ、場合によっては搬出不能にな
ってしまうという欠点がある。For this reason, in the conventional wafer unloading device described above, if the transport surface and the back side of the wafer l are tilted, the wafer l cannot be unloaded smoothly, and in some cases, unloading becomes impossible. There are drawbacks.
本発明の目的は、前記欠点が解決され、まちがいなく搬
出ができるようにした半導体ウェハの搬出装置を提供す
ることにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer unloading device which solves the above-mentioned drawbacks and allows unmistakable unloading.
本発明の構成は、キャリアに収納された半導体ウェハを
前記キャリアから一枚づつ取り出して次のユニットに送
る半導体ウェハの搬出装置において、これから搬出しよ
うとする前記キャリア内の半纏体ウェハの主面の傾きを
検知する検出部と、＠記主面の傾きが搬送面と平行にな
る様に前記キャリアを前後方向、左右方向にそれぞれ傾
ける機構とを備えたことを特徴とする。The configuration of the present invention is such that in a semiconductor wafer unloading device that takes out semiconductor wafers housed in a carrier one by one from the carrier and sends them to the next unit, the main surface of the semi-integrated wafer in the carrier to be unloaded is The present invention is characterized in that it includes a detection unit that detects an inclination, and a mechanism that inclines the carrier in the front-rear direction and the left-right direction, respectively, so that the inclination of the main surface becomes parallel to the conveying surface.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第ｌの実施例の半導体ウェハの搬出装
置の断面図である。同図において、半導体ウェハｌはキ
ャリア２内の各スロットに収納され、キャリア２はステ
ージ４にセットされる。このステージ４は、半導体ウェ
ハｌの搬出方向に対し、前後に傾きが変えられる機構Ｖ
Ｃなっており、この機構は、前後傾き調整用モータ７、
送りネジ６、リンク機構５とから構成されている。半導
体ウェハ１の搬出用ベルト３の下部に、ウェハ１（２）
傾き検出用の一対の位置センｆ’ｌ １．及び１２が取
り付けられており、このセン丈１１・１２からの信号に
より、半畳体ウェハ１の主面と搬送面とが平行になる様
に、モータ７を駆動させる。前後傾き調整機構部は、エ
レベータステージ８上部に設置サレ、エレベータ用モー
タ１０．エレベータ用送りネジ９により、上下に位置を
変えることができ、これによりキャリア２内のウェハｌ
を１枚づつ搬出することができる。FIG. 1 is a sectional view of a semiconductor wafer unloading apparatus according to a first embodiment of the present invention. In the figure, semiconductor wafers l are housed in each slot in a carrier 2, and the carrier 2 is set on a stage 4. This stage 4 has a mechanism V that can change its inclination back and forth with respect to the unloading direction of the semiconductor wafer l.
C, and this mechanism includes a motor 7 for adjusting the longitudinal inclination,
It is composed of a feed screw 6 and a link mechanism 5. The wafer 1 (2) is placed at the bottom of the belt 3 for carrying out the semiconductor wafer 1.
A pair of position sensors f'l for tilt detection 1. and 12 are attached, and signals from the center heights 11 and 12 drive the motor 7 so that the main surface of the semi-folded wafer 1 and the transport surface are parallel to each other. The longitudinal tilt adjustment mechanism is installed on the top of the elevator stage 8, and the elevator motor 10. The position of the wafer inside the carrier 2 can be changed up and down using the elevator feed screw 9.
can be carried out one by one.
また、ウェハｌの搬出方向に対し、左右に傾きが変えら
れる機構をステージ４の下部に設け、これによυどの方
向にウェハｌが傾いていても完全にウェハ１面と搬送面
とを平行にすることができる。左右方向の傾き調整の機
構については、前述したＡｉｌ後方向の傾き調整の機構
と同一であるので、説明は省略する。In addition, a mechanism is provided at the bottom of the stage 4 that can change the inclination to the left and right with respect to the direction in which the wafer 1 is carried out. It can be done. The mechanism for adjusting the tilt in the left-right direction is the same as the mechanism for adjusting the tilt in the Ail rear direction described above, so a description thereof will be omitted.
第２図は本発明の第２の実施例の半導体ウェハの搬出装
置の断面図である。同図において、本実施例では、半導
体ウェハｌの搬出は真空吸着式のチャック１５により、
半導体ウェハｌの畳面を吸着し、上下及び回転運動が可
能な搬送アーム１４により、メカニカル搬送する方式と
なっており、キャリアステージ側での上下移動のａ構は
不必要となる。また本実施例においては、ステージの傾
きはくさびカム１６によって調整する機構となっている
。これ以外の点においては、前記第１の実施例と同様で
ある。FIG. 2 is a sectional view of a semiconductor wafer unloading device according to a second embodiment of the present invention. In the figure, in this embodiment, the semiconductor wafer l is unloaded by a vacuum chuck 15.
The tatami surface of the semiconductor wafer l is sucked and mechanically transported by a transport arm 14 capable of vertical and rotational movement, so that an a mechanism for vertical movement on the carrier stage side is unnecessary. Further, in this embodiment, the inclination of the stage is adjusted by a wedge cam 16. In other respects, this embodiment is the same as the first embodiment.
本実施例の様にメカニカル搬送方式では、チャック１５
の面とウェハ１の主面が傾いていると、ベルトｗ送方式
に比べ、特に搬送不良を起こしやすい為、本実施例は搬
送不良の低減に対して非常に鳴動である。In the mechanical conveyance method as in this embodiment, the chuck 15
If the plane and the main surface of the wafer 1 are tilted, transport defects are more likely to occur than in the belt W transport method, so this embodiment is very difficult to reduce transport defects.
キャリアの２内のウェハ１の傾き調整は、モータ７と送
りネジ６とにより、くざびカム１６を左右に移動させる
ことにより行われる。一対の位置センサ１１，１２は、
光学的に、半導体ウェハ１の傾きを検出する。アーム１
４は、アーム駆動部１７により駆動される。The inclination of the wafer 1 in the carrier 2 is adjusted by moving the wedge cam 16 left and right using the motor 7 and the feed screw 6. The pair of position sensors 11 and 12 are
The inclination of the semiconductor wafer 1 is optically detected. Arm 1
4 is driven by an arm drive section 17.
以上第１．第２の実施例は、キャリア２内のウェハｌの
傾きを検知し、キャリア２を前後方向、左右方向にそれ
ぞれ適正量傾けることで、ウェハｌの傾きを補正して、
搬送面とウェハの裏面とを正確に平行に合わせることが
可能となり、これによりキャリア２からのウェハｌの搬
出時に発生する搬出ミス′ｌｃなくすことができる。Above is the first part. In the second embodiment, the inclination of the wafer l in the carrier 2 is detected, and the inclination of the wafer l is corrected by tilting the carrier 2 by an appropriate amount in the front-back direction and in the left-right direction.
It becomes possible to align the transport surface and the back surface of the wafer accurately in parallel, and thereby it is possible to eliminate unloading errors 'lc that occur when unloading the wafer l from the carrier 2.
以上説明したように、本発明は、キャリア内の半導体ウ
ェハの傾きを検知し、キャリアを前後方向、左右方向に
それぞれ適正量傾けることで、キャリアの寸法誤差や歪
に起因する半導体ウェハ主面と搬送面との傾きを補正し
て、正確に平行に合わせることが可能となり、キャリア
からのウェハの搬出時に発生する搬出ばスをなくすこと
ができる効果がある。As explained above, the present invention detects the inclination of the semiconductor wafer in the carrier and tilts the carrier by an appropriate amount in the front-rear direction and the left-right direction. It is possible to correct the inclination with respect to the transport surface and to make the wafer accurately parallel to the transport surface, which has the effect of eliminating the unloading loss that occurs when the wafer is unloaded from the carrier.
第１図は本発明の第１の実施例の半導体ウエノ・の搬出
装置の側面図、第２図は本発明の４２の実施例の半導体
ウェハの搬出製置の側面図、第３図は従来の半４体ウェ
ハの搬出装置の側面図である。
ｌ・・・・・・半導体ウェハ、２・・・・・・キャリア
、３・・・・・・ウェハの搬出用ベルト、４・・・・・
・ステージ、５・・・・・・リンク機構、６・・・・・
・送９ネジ、７・・・・・・モータ、８・・・・・・エ
レベータステージ、９・・・・・・エレベータ用送すネ
ジ、ｌＯ・・・・−・エレベータ用モータ、ｌｌ・・・
・・・位置センサ（前）、１２・・・・・・位置セン＋
ｊ（後）、１３・・・・・・リニアスライド、１４・・
・・・・搬送アーム、１５・・・・・・チャック、１６
・・・・・・くさびカム、１７・・・・・・搬送アーム
駆動部、１８・・・・・・ウエハセンサ。
代理人 弁理士 内 原 訝
菊１図
第Ｚ図FIG. 1 is a side view of a semiconductor wafer unloading device according to the first embodiment of the present invention, FIG. 2 is a side view of a semiconductor wafer unloading device according to the 42nd embodiment of the present invention, and FIG. 3 is a conventional FIG. 3 is a side view of a semi-quad wafer unloading device of FIG. l...Semiconductor wafer, 2...Carrier, 3...Wafer transport belt, 4...
・Stage, 5... Link mechanism, 6...
・Feed 9 screw, 7...Motor, 8...Elevator stage, 9...Elevator feed screw, lO...---Elevator motor, ll...・・・
...Position sensor (front), 12...Position sensor +
j (rear), 13... linear slide, 14...
...Transportation arm, 15...Chuck, 16
... Wedge cam, 17 ... Transfer arm drive section, 18 ... Wafer sensor. Agent Patent Attorney Uchihara Kugiku Figure 1 Figure Z
Claims (1)
ら一枚づつ取り出して次のユニットに送る半導体ウェハ
の搬出装置において、これから搬出しようとする前記キ
ャリア内の半導体ウェハの主面の傾きを検知する検出部
と、前記主面の傾きが搬送面と平行になる様に前記キャ
リアを前後方向、左右方向にそれぞれ傾ける機構とを備
えたことを特徴とする半導体ウェハの搬出装置。In a semiconductor wafer unloading device that takes out semiconductor wafers stored in a carrier one by one from the carrier and sends them to the next unit, a detection unit that detects an inclination of a main surface of a semiconductor wafer in the carrier that is about to be unloaded; A semiconductor wafer unloading device comprising: a mechanism for tilting the carrier in the front-rear direction and in the left-right direction so that the main surface is tilted parallel to the transport surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63079424A JPH01248634A (en) | 1988-03-30 | 1988-03-30 | Conveying device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63079424A JPH01248634A (en) | 1988-03-30 | 1988-03-30 | Conveying device for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01248634A true JPH01248634A (en) | 1989-10-04 |
Family
ID=13689483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63079424A Pending JPH01248634A (en) | 1988-03-30 | 1988-03-30 | Conveying device for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01248634A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0997826A (en) * | 1995-09-27 | 1997-04-08 | Jenoptik Ag | Index device that is used for magazine shelf in magazine andwafer-form material body stored in same magazine shelf |
| KR100306302B1 (en) * | 1999-04-23 | 2001-10-29 | 정문술 | device for position of LCD panel algine |
| JP2014165434A (en) * | 2013-02-27 | 2014-09-08 | Disco Abrasive Syst Ltd | Processing device |
-
1988
- 1988-03-30 JP JP63079424A patent/JPH01248634A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0997826A (en) * | 1995-09-27 | 1997-04-08 | Jenoptik Ag | Index device that is used for magazine shelf in magazine andwafer-form material body stored in same magazine shelf |
| US6419439B2 (en) | 1995-09-27 | 2002-07-16 | Jenoptik Aktiengesellschaft | Indexer for magazine shelves of a magazine and wafer-shaped objects contained therein |
| KR100306302B1 (en) * | 1999-04-23 | 2001-10-29 | 정문술 | device for position of LCD panel algine |
| JP2014165434A (en) * | 2013-02-27 | 2014-09-08 | Disco Abrasive Syst Ltd | Processing device |
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