JPS59170116A - 液状エポキシ樹脂組成物 - Google Patents

液状エポキシ樹脂組成物

Info

Publication number
JPS59170116A
JPS59170116A JP4477883A JP4477883A JPS59170116A JP S59170116 A JPS59170116 A JP S59170116A JP 4477883 A JP4477883 A JP 4477883A JP 4477883 A JP4477883 A JP 4477883A JP S59170116 A JPS59170116 A JP S59170116A
Authority
JP
Japan
Prior art keywords
epoxy resin
liquid epoxy
parts
weight
100pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4477883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6253009B2 (enrdf_load_stackoverflow
Inventor
Atsushi Okuno
敦史 奥野
Tsuneichi Hashimoto
橋本 常一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SANYUREJIN KK
Original Assignee
SANYUREJIN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SANYUREJIN KK filed Critical SANYUREJIN KK
Priority to JP4477883A priority Critical patent/JPS59170116A/ja
Publication of JPS59170116A publication Critical patent/JPS59170116A/ja
Publication of JPS6253009B2 publication Critical patent/JPS6253009B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP4477883A 1983-03-16 1983-03-16 液状エポキシ樹脂組成物 Granted JPS59170116A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4477883A JPS59170116A (ja) 1983-03-16 1983-03-16 液状エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4477883A JPS59170116A (ja) 1983-03-16 1983-03-16 液状エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59170116A true JPS59170116A (ja) 1984-09-26
JPS6253009B2 JPS6253009B2 (enrdf_load_stackoverflow) 1987-11-09

Family

ID=12700868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4477883A Granted JPS59170116A (ja) 1983-03-16 1983-03-16 液状エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59170116A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010084939A1 (ja) * 2009-01-23 2010-07-29 味の素株式会社 樹脂組成物
WO2010084938A1 (ja) * 2009-01-23 2010-07-29 味の素株式会社 樹脂組成物
CN101864149A (zh) * 2010-06-04 2010-10-20 王玮 一种阻燃透明高韧环氧灌封树脂及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010084939A1 (ja) * 2009-01-23 2010-07-29 味の素株式会社 樹脂組成物
WO2010084938A1 (ja) * 2009-01-23 2010-07-29 味の素株式会社 樹脂組成物
JPWO2010084939A1 (ja) * 2009-01-23 2012-07-19 味の素株式会社 樹脂組成物
CN101864149A (zh) * 2010-06-04 2010-10-20 王玮 一种阻燃透明高韧环氧灌封树脂及其制备方法

Also Published As

Publication number Publication date
JPS6253009B2 (enrdf_load_stackoverflow) 1987-11-09

Similar Documents

Publication Publication Date Title
JP6366590B2 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP6366504B2 (ja) エポキシ樹脂、エポキシ樹脂組成物および硬化物
WO2008020594A1 (fr) Résine époxy liquide modifiée, composition de résine époxy contenant celle-ci et produit cuit dérivé
JPS6230215B2 (enrdf_load_stackoverflow)
JP3404795B2 (ja) 半導体封止用エポキシ樹脂組成物
JP2002212268A (ja) 半導体封止用エポキシ樹脂組成物
JPS59170116A (ja) 液状エポキシ樹脂組成物
JPH06184131A (ja) エポキシ樹脂、その製法、エポキシ樹脂組成物及び半導体封止材料
JPH09241483A (ja) エポキシ樹脂組成物
JP2008239891A (ja) 新規エポキシ樹脂、それを含有するエポキシ樹脂組成物及びその硬化物
JPH0977958A (ja) エポキシ樹脂組成物および半導体装置
JP2697510B2 (ja) 半導体封止用エポキシ樹脂組成物
JP2955013B2 (ja) エポキシ樹脂系組成物
JPH09235452A (ja) 半導体封止用エポキシ樹脂組成物
JPH0782343A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3995244B2 (ja) エポキシ樹脂、エポキシ樹脂の製法、エポキシ樹脂組成物及びその硬化物
JPH0733429B2 (ja) エポキシ樹脂組成物
JP3632936B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH04325517A (ja) 半導体封止用エポキシ樹脂組成物
JP2001031842A (ja) エポキシ樹脂組成物及び半導体装置
JP2002128868A (ja) 半導体封止用エポキシ樹脂組成物
JPH10182941A (ja) エポキシ樹脂組成物
JP3413923B2 (ja) 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2577239B2 (ja) 臭素化エポキシ化合物及び同化合物を含有する難熱化樹脂組成物
JP2010275479A (ja) 半導体封止用エポキシ樹脂組成物および半導体装置