JPS59169165A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59169165A
JPS59169165A JP58042211A JP4221183A JPS59169165A JP S59169165 A JPS59169165 A JP S59169165A JP 58042211 A JP58042211 A JP 58042211A JP 4221183 A JP4221183 A JP 4221183A JP S59169165 A JPS59169165 A JP S59169165A
Authority
JP
Japan
Prior art keywords
wire
bonding
semiconductor device
directly above
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58042211A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447972B2 (cg-RX-API-DMAC10.html
Inventor
Susumu Okikawa
進 沖川
Hiromichi Suzuki
博通 鈴木
Wahei Kitamura
北村　和平
Hiroshi Mikino
三木野　博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58042211A priority Critical patent/JPS59169165A/ja
Publication of JPS59169165A publication Critical patent/JPS59169165A/ja
Publication of JPH0447972B2 publication Critical patent/JPH0447972B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W70/682—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP58042211A 1983-03-16 1983-03-16 半導体装置 Granted JPS59169165A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58042211A JPS59169165A (ja) 1983-03-16 1983-03-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58042211A JPS59169165A (ja) 1983-03-16 1983-03-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS59169165A true JPS59169165A (ja) 1984-09-25
JPH0447972B2 JPH0447972B2 (cg-RX-API-DMAC10.html) 1992-08-05

Family

ID=12629686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58042211A Granted JPS59169165A (ja) 1983-03-16 1983-03-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS59169165A (cg-RX-API-DMAC10.html)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100566A (cg-RX-API-DMAC10.html) * 1973-01-30 1974-09-24
JPS5730206A (en) * 1980-06-24 1982-02-18 Heraeus Gmbh W C Contact extra fine conductor for semiconductor constituent element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100566A (cg-RX-API-DMAC10.html) * 1973-01-30 1974-09-24
US3908184A (en) * 1973-01-30 1975-09-23 Nippon Electric Co Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents
JPS5730206A (en) * 1980-06-24 1982-02-18 Heraeus Gmbh W C Contact extra fine conductor for semiconductor constituent element

Also Published As

Publication number Publication date
JPH0447972B2 (cg-RX-API-DMAC10.html) 1992-08-05

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