JPS59168697A - Method of producing metal base printed circuit board - Google Patents
Method of producing metal base printed circuit boardInfo
- Publication number
- JPS59168697A JPS59168697A JP4335783A JP4335783A JPS59168697A JP S59168697 A JPS59168697 A JP S59168697A JP 4335783 A JP4335783 A JP 4335783A JP 4335783 A JP4335783 A JP 4335783A JP S59168697 A JPS59168697 A JP S59168697A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- insulator
- printed circuit
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は金属板をベースにした金属ベース印刷配線板の
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a metal-based printed wiring board based on a metal plate.
従来にあっては金属板をベースにした印刷配線板は、絶
縁信頼性が損なわれるため穴あけ加工ができなく・その
ため片面単層配線しかできなくて、近年増加している高
密度配線、高密度実装に対応できないという問題があっ
た。Previously, printed wiring boards based on metal plates could not be drilled due to the loss of insulation reliability, and therefore could only be used for single-layer wiring on one side. There was a problem that it could not be implemented.
本発明は絶縁信頼性が高く高密度配線、高密度実装が可
能な金属ベース印刷配線板の製造方法に関する。The present invention relates to a method for manufacturing a metal-based printed wiring board that has high insulation reliability and enables high-density wiring and high-density packaging.
本発明の金属ベース印刷配線板の製造方法は金属板上に
絶縁層を介して銅箔パターン層を形成し、銅張絶縁物に
スルホールを穿設し、ついでこの銅張絶縁物を位置合せ
して銅箔パターン層を形成した金属板上に積層し、この
後銅張絶縁物のスルホールを導通させることを特徴とす
る・以下本発明を添付の図面に従って詳細に説明する。The method for manufacturing a metal-based printed wiring board of the present invention involves forming a copper foil pattern layer on a metal plate via an insulating layer, drilling through holes in a copper-clad insulator, and then aligning the copper-clad insulator. The present invention will be described in detail below with reference to the accompanying drawings.
第１図および第２図に示すように金属板（１）上に絶縁
層（２）を介して銅箔（６）を張設し、エツチングを施
して銅箔パターン層（３）を形成する。この金属板（１
）としては銅板、鉄板、アルミニウム板、ＪＸちゆう板
、その他の金属板のいずれをも用いることができる。絶
縁層（２）としては・ガラス布エボ＋シ樹脂積層板２紙
エボ士シ樹脂積層板２紙フェノール樹脂積層板などを用
いる。一方、第３図（ａ）に示すように絶縁層（２）と
同様な材料からなる絶縁物（４ａ）に銅箔（４ｂ）を張
設した銅張絶縁物（４）に所定数のスルーホール（５）
を穿設する。ついでこの銅張絶縁物（４）を第４図に示
すように、そのスルーホール（５）が金属板ｆｌｌ上の
銅箔パターン層（３）に連通ずるように位置合せして金
掴板１１）上に積層させる。なお第３図（ｂ）に示すよ
うに絶縁物（４ａ）と銅箔（４ｂ）ＶＣそれぞれスルー
ホール（５）を設けて絶縁物（４ａ）と銅箔（４ｂ＞と
を金属板Ｄ）上に順次積層することにより銅張絶縁物（
４）を金属板ｆ１）上に積層してもよい。この後第５図
図（Ｃ））スルーホール（５）を導通させると共に銅張
絶縁物（４）の表面層にエツチングを施して別の銅箔パ
ターン層（７）を形成させて二層の金属ベース印刷配線
板囚を製造する。なお本発明にあってはこの二層の金属
ベース印刷配線板回出にさらに上記と同様の銅張絶縁物
（４）を積層し１．上記と同様にしてスルーホール（５
）を導通させ表面層にまた別の銅箔パターン層を形成さ
せることにより三層の金属ベース印刷配線板を製造して
もよく、またこの工程を繰返して多層の金属ベース印刷
配線板を製造してもよ−。As shown in Figures 1 and 2, a copper foil (6) is stretched over a metal plate (1) via an insulating layer (2) and etched to form a copper foil pattern layer (3). . This metal plate (1
) may be a copper plate, iron plate, aluminum plate, JX plate, or any other metal plate. As the insulating layer (2), a glass cloth evo + two resin laminates, two paper evo resin laminates, two paper phenolic resin laminates, etc. are used. On the other hand, as shown in FIG. 3(a), a predetermined number of through holes are formed on a copper-clad insulator (4), which is an insulator (4a) made of the same material as the insulator layer (2), and a copper foil (4b) stretched over the insulator (4a). Hall (5)
to be drilled. Next, as shown in FIG. 4, this copper-clad insulator (4) is aligned so that its through hole (5) communicates with the copper foil pattern layer (3) on the metal plate flll, and then attached to the metal grip plate 11. ). As shown in Fig. 3(b), a through hole (5) is provided in each of the insulator (4a) and the copper foil (4b) to connect the insulator (4a) and the copper foil (4b) onto the metal plate D. Copper-clad insulation (
4) may be laminated on the metal plate f1). After this, the through hole (5) in Figure 5 (C)) is made conductive, and the surface layer of the copper clad insulator (4) is etched to form another copper foil pattern layer (7) to form a two-layer structure. Manufactures metal-based printed circuit boards. In the present invention, a copper-clad insulator (4) similar to the above is further laminated on this two-layer metal-based printed wiring board. Through hole (5) in the same way as above.
) may be made conductive to form another copper foil pattern layer on the surface layer to produce a three-layer metal-based printed wiring board, and this process may be repeated to produce a multi-layer metal-based printed wiring board. It's okay.
本発明にあっては、銅張絶縁物にスルーホールを穿設し
、つ込でこの銅張絶縁物を位置合せして銅箔パターン層
を形成した金属板上に積層し、スルーホールを導通させ
るので、金属板をベースにした絶縁信頼性の高い多層の
印刷配線板を製造することができ、金属の放熱性のよさ
七相俟って高密度配線、高密度実装に好適な金属ベース
印刷配線板を提供できるものである。またこの金属ベー
ス印刷配線板は両面板でないため金属板の機械的強度を
利用して機構部品、シャーシの一部としても採用できる
ものである。In the present invention, a through hole is formed in a copper-clad insulator, and the copper-clad insulator is aligned with a pot and laminated on a metal plate on which a copper foil pattern layer is formed, and the through hole is made conductive. This makes it possible to manufacture multilayer printed wiring boards based on metal plates with high insulation reliability, and metal-based printing is suitable for high-density wiring and high-density packaging due to the good heat dissipation properties of metal. It is possible to provide wiring boards. Furthermore, since this metal-based printed wiring board is not a double-sided board, it can be used as a mechanical component or part of a chassis by utilizing the mechanical strength of the metal plate.
第１図、第２図、第３図（ａ）（ｂ） 、第４図、第５
図（ａ） （ｂ） （ｃ）は本発明の一実施例の各工程
を示す断面図である。
（５）・・・金属ベース印刷配線板、（１）・・・金属
板、（２）・・・絶縁層、（３）・・・銅箔パターン層
、（４）・・・銅張絶縁物、（６）・°・スルーホール
。
代理人 弁理士 石 １）長 七Figure 1, Figure 2, Figure 3 (a) (b), Figure 4, Figure 5
Figures (a), (b), and (c) are cross-sectional views showing each step of an embodiment of the present invention. (5)...Metal-based printed wiring board, (1)...Metal plate, (2)...Insulating layer, (3)...Copper foil pattern layer, (4)...Copper-clad insulation Object, (6)・°・Through hole. Agent Patent Attorney Ishi 1) Choshichi
Claims (1)
形成し１．〜銅張絶縁物にスルーホールを穿投し、つい
でとの銅張絶縁物を位置合せして銅箔パターン層を形成
した金属板上に積層し、この後銅張絶縁物のスルーホー
ルを導通させることを特徴とする金属ベース印刷配線板
の製造方法。+1) Forming a copper foil pattern layer on a metal plate via an insulating layer; 1. - Drill through holes in the copper-clad insulator, then align the copper-clad insulator and laminate it on the metal plate on which the copper foil pattern layer has been formed, and then conduct through the through-hole in the copper-clad insulator. A method for manufacturing a metal-based printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335783A JPS59168697A (en) | 1983-03-15 | 1983-03-15 | Method of producing metal base printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335783A JPS59168697A (en) | 1983-03-15 | 1983-03-15 | Method of producing metal base printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59168697A true JPS59168697A (en) | 1984-09-22 |
Family
ID=12661596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4335783A Pending JPS59168697A (en) | 1983-03-15 | 1983-03-15 | Method of producing metal base printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59168697A (en) |
-
1983
- 1983-03-15 JP JP4335783A patent/JPS59168697A/en active Pending
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