JPS591677A - Ion plating device - Google Patents

Ion plating device

Info

Publication number
JPS591677A
JPS591677A JP11083382A JP11083382A JPS591677A JP S591677 A JPS591677 A JP S591677A JP 11083382 A JP11083382 A JP 11083382A JP 11083382 A JP11083382 A JP 11083382A JP S591677 A JPS591677 A JP S591677A
Authority
JP
Japan
Prior art keywords
substrates
nozzles
gas shower
rotated
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11083382A
Other languages
Japanese (ja)
Inventor
Hideo Shinomiya
篠宮 秀夫
Isao Komine
小峰 勲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP11083382A priority Critical patent/JPS591677A/en
Publication of JPS591677A publication Critical patent/JPS591677A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Abstract

PURPOSE:To provide a titled device which permits removal of the fine dust, etc. stuck on the substrates, etc. in a vacuum chamber prior to ion plating, by providing gas shower nozzles which open toward an electrode for supporting the substrates provided in an ion plating device. CONSTITUTION:In the stage of mounting substrates 2 to a cathode 3, gas shower nozzles 15 are held in the down position. Watch cases made of stainless steel are adapted for the substrates 2, and Ti is provided in an evaporating source 10. In the stage of evacuating roughly the inside of a vacuum chamber 1 through an evacuation port 8, a driving part 21 for a movable cover is operated upon starting of the rough evacuation to raise a movable cover 16 to a solid line position. The nozzles 15 are moved upward to the solid line position in succession. The nozzles 15 are rotated in this stage by means of two driving screws 18 which are rotated with pulleys and belts as transmission mechanisms. The degree of vacuum detected with a vacuum gauge 11 is further converted with a conversion part 12 and a control part 13 to the open or close signal of a valve 14. The valve 14 is opened in accordance with said signal to blow out gaseous N2. At the same instant, right and left motors 22 are rotated to oscillate the nozzles 15 at a specified cycle, thereby removing the fine dust, and various powders stuck on the substrates 2.

Description

【発明の詳細な説明】 本発明はイオンブレーティング装置の構造に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of an ion blating device.

近年イオンブレーティング方法による薄膜形成技術は従
来の湿式メッキと比較して無公害であり、且つ湿式メッ
キではメッキできない物質を被覆させる方法として注目
を集めており、あらゆる角度から期待をかけられている
技術である。
In recent years, thin film formation technology using the ion blating method is less polluting than conventional wet plating, and has attracted attention as a method for covering substances that cannot be plated with wet plating, and is expected to be used from all angles. It's technology.

したがって現在のイオンブレーティング装置にもいくつ
かの方式かあり、その代表的なものを列挙すわは、一つ
はM A i’ TOX方式と(・われるもので、真空
槽内にイオン化で、きるガスを充填し、基板を支持して
いる陰極と蒸発材料を保持している発熱体を持つ陽極間
に数1000Vの直流電圧を印加し、グロー改電を発生
させ放電中に発熱体より蒸発金属を蒸発させて、蒸発し
た金属材料の一部をイオン化し、イオン化しない蒸発金
属とともに加速させて基板上に薄膜を形成させるもので
ある。
Therefore, there are several types of ion blating equipment available today. A DC voltage of several thousand volts is applied between the cathode, which is filled with gas and supports the substrate, and the anode, which has a heating element that holds the evaporation material, to generate a glow current and evaporate the metal from the heating element during discharge. A part of the evaporated metal material is ionized and accelerated together with the evaporated metal that is not ionized to form a thin film on the substrate.

また陰極方法は前記M A ’I’ T OX方式を改
良したものであり、蒸発金属のイオン化系と膜形成系を
分離したものである。
The cathode method is an improved version of the M A 'I' T OX method, in which the ionization system of the evaporated metal and the film formation system are separated.

すなわち被膜を構成すべき基板を保持する主陰極のまわ
りに複数個の熱陰極を配し、熱陰極から放射される電子
でイオン化可能なガスのイオン化を促進させるとともに
、熱陰極と陽極間の電圧でイオン化を制御できるように
した方式である。
In other words, a plurality of hot cathodes are arranged around the main cathode that holds the substrate on which the coating is to be formed, and the electrons emitted from the hot cathode promote the ionization of ionizable gas, and the voltage between the hot cathode and the anode is This method allows ionization to be controlled by

他の方式としては蒸発源と基板間に高周波電源を配設し
、イオン化を励起する高周波イオンブレーティング方式
等かある。
Other methods include a high frequency ion blating method in which a high frequency power source is provided between the evaporation source and the substrate to excite ionization.

上記に列挙した幾つかの方式は、(・ずれの方式におい
−Cも、基板を陰極に取付ける際に、大気中に浮遊して
いる微細な塵埃や種々の微粉末、さらに手作業にて前記
基板を取付ける場合、綿手袋の糸ごみ等が、真空槽内の
基板や陰極等に付着してしIt・、そのためにイオンブ
レーティングが行なわれろ時に不必要なカスの発生や伺
着物の炭化等が起ってしまい、イオンブレーティングに
よる好ましく・表面処理層が得られないという欠点を有
していた。
Some of the methods listed above (-C) also involve removing fine dust and various fine powders floating in the atmosphere, as well as manual work when attaching the substrate to the cathode. When attaching a board, thread waste from cotton gloves may adhere to the board or cathode in the vacuum chamber, causing unnecessary scum to be generated or carbonization of the material when ion blating is not performed. This has the disadvantage that a desirable surface treatment layer cannot be obtained by ion blating.

本発明は上記欠点を解決すべく、真空室内の基板および
諸付属機器に付着した微細な塵埃や種々の微粉末等をイ
オンブレーティングする前に除去する11を目的として
おり、その要旨は真空槽内に、蒸発係と基板支持電極と
イオン化電極とイオン化用ガス力入口を備えたイオンブ
レーティング装置にお(・て、前記基板支持電極に向け
てガスシャワーノズルを設けたことにある。
In order to solve the above-mentioned drawbacks, the present invention aims to remove fine dust and various fine powders adhering to substrates and various attached devices in a vacuum chamber before ion blasting. The ion blating device is equipped with an evaporator, a substrate supporting electrode, an ionizing electrode, and an ionizing gas inlet, and a gas shower nozzle is provided facing the substrate supporting electrode.

以下本発明の実施例を図にもとすき説明する。Embodiments of the present invention will be described below with reference to the drawings.

第1図は本発明による多陰極式イオンブレーティング装
部の概略断面図である。
FIG. 1 is a schematic cross-sectional view of a multi-cathode ion brating apparatus according to the present invention.

1は真空槽、2は被覆される基板、6は基板を保持する
陰極、4はイオン化電極である陰極、5は陽極、6は陽
極用電源、7はイオン化用ガス導入口、8は排気口、9
はイオン化電源、1oけ蒸発源である。
1 is a vacuum chamber, 2 is a substrate to be coated, 6 is a cathode that holds the substrate, 4 is a cathode that is an ionization electrode, 5 is an anode, 6 is a power source for the anode, 7 is an ionization gas inlet, and 8 is an exhaust port , 9
is an ionization power source and a 1° evaporation source.

さらに、11は真空計、12は変換部でホ)す、16は
制御部、14は真空計が検出する真空度を前記変換部1
6と前記制御部14とを介して開閉されるバルブである
Furthermore, 11 is a vacuum gauge, 12 is a converting section, 16 is a control section, and 14 is a vacuum degree detected by the vacuum gauge.
6 and the control section 14.

15はガスシャワーノズル、16は該ガスシャワーノズ
ルと連動して駆動する可動カバー、17は前記ガスシャ
ワーノズルを上下駆動させる可動体でホ)る。18は該
可動体17を駆動するための駆動ネジであり、19は該
駆動ネジ17の駆動源であるノズル駆動用モーターであ
る。
15 is a gas shower nozzle, 16 is a movable cover that is driven in conjunction with the gas shower nozzle, and 17 is a movable body that drives the gas shower nozzle up and down. 18 is a drive screw for driving the movable body 17, and 19 is a nozzle drive motor that is a drive source for the drive screw 17.

20は前記ガスシャワーノズル15の上下駆動を位置検
出するリミットスイッチである。
20 is a limit switch that detects the position of the vertical movement of the gas shower nozzle 15.

21は前記可動カバー16を駆動させる駆動部であり、
22は前記ガスシャワーノズルを首振り運動させるため
のノズル首振用モーターであり、26はノズル首振用レ
バーである。24は前記ガスシャワーノズル、15およ
び前記可動カバー16を連動して駆動制御させるシーケ
ンス制御部である。
21 is a drive unit that drives the movable cover 16;
22 is a nozzle oscillation motor for oscillating the gas shower nozzle, and 26 is a nozzle oscillation lever. Reference numeral 24 denotes a sequence control unit that controls the driving of the gas shower nozzle 15 and the movable cover 16 in conjunction with each other.

さらに、本発明は構成と動作を詳述すると、基板2を陰
極乙に取付ける際は、ガスシャワーノズル15け降下し
た位置(第1図の2点鎖線の缶#)にあり、基板2には
ステンレス製の時計ケースを適用し蒸発源10にはチタ
ンを設け、真空槽1内を排気口8から真空荒引きする際
、真空荒引き開始と同時に、可動カバー駆動部21が働
き、可動カバー16が第1図で実線で示す位置に起き上
る。
Furthermore, to explain the structure and operation of the present invention in detail, when the substrate 2 is attached to the cathode A, the gas shower nozzle is located at a position 15 degrees lower (can # indicated by a two-dot chain line in Fig. 1), and the substrate 2 is attached to the cathode A. A stainless steel watch case is used, the evaporation source 10 is made of titanium, and when the inside of the vacuum chamber 1 is roughly vacuumed from the exhaust port 8, the movable cover drive unit 21 operates and the movable cover 16 is activated at the same time as the start of rough vacuuming. rises to the position shown by the solid line in Figure 1.

続いて、ノズル駆動用モーターが始動しノズルが」二昇
して、第1図の実線で示す位置迄上る。この時、ガスシ
ャワーノズル15はノズル駆動用モータ19を駆動源と
して、プーリー及びベルトを伝達機構とし、2本の駆動
ネジ18を回転させる。
Subsequently, the nozzle drive motor starts and the nozzle rises to the position shown by the solid line in FIG. At this time, the gas shower nozzle 15 uses the nozzle drive motor 19 as a drive source, a pulley and a belt as a transmission mechanism, and rotates the two drive screws 18.

なお該駆ψ11ネジ18は、一方は右イジで他方は左ネ
ジに加工されており、両側のガスシャワーノズル15は
同時に」二下運動を行なう機構となっている。
Note that the drive ψ11 screw 18 is machined so that one side is a right-hand thread and the other is a left-hand thread, and the gas shower nozzles 15 on both sides are configured to perform two-down movements at the same time.

さらに、真空計11で検出・する真空度は、変換部12
、および制御部16を介して真空バt″をバルブ14の
開閉信号に変換し、バルブ14を開いて窒素ガスを吹出
す。同時に左右のノズル首振り用モーター22が回転を
始め、ノズル首振り゛用レバー26を介して、ガスシャ
ワーノズル15は一定サイクルで首振り運動を行なう。
Furthermore, the degree of vacuum detected by the vacuum gauge 11 is determined by the converter 12.
, and converts the vacuum bat'' into an opening/closing signal for the valve 14 through the control unit 16, and opens the valve 14 to blow out nitrogen gas.At the same time, the left and right nozzle swinging motors 22 start rotating, and the nozzle swinging motors 22 start rotating. Via the lever 26, the gas shower nozzle 15 is oscillated in a constant cycle.

次に真空槽1が1〜5 T OIt Rになると、バル
ブ14は、閉じて窒素ガスの吹伺けは停止する。
Next, when the vacuum chamber 1 reaches 1 to 5 T OIt R, the valve 14 is closed and the blowing of nitrogen gas is stopped.

該ガスの吹付けと排気口からの真空荒引きにより、基板
である時計ケースに付着していた微細な塵埃や極微な種
々の粉末等は除去される。
By blowing the gas and rough vacuuming from the exhaust port, fine dust and various minute powders adhering to the watch case, which is the substrate, are removed.

さらにノズル首振用モーター22は止まり、ガスシャワ
ーノズル15の首振運動は停止する。
Furthermore, the nozzle swinging motor 22 stops, and the swinging motion of the gas shower nozzle 15 stops.

続いてノズル駆動用モーター19始動し、前記ガスシャ
ワーノズル15は降下し、第1図の2点鎖線の位置迄降
りて停止する。この停止位置は下方に設けたりミツトス
イッチで検出される。
Subsequently, the nozzle drive motor 19 is started, and the gas shower nozzle 15 descends to the position indicated by the two-dot chain line in FIG. 1, and then stops. This stop position is provided below or detected by a Mitsutwitch.

さらに可動カバー駆動部21が駆動し、可動力バー16
が第1図の2点鎖線の位置迄回転して、降下しているガ
スシャワーノズル15をカバーし、保護する。
Furthermore, the movable cover drive unit 21 is driven, and the movable force bar 16
rotates to the position indicated by the two-dot chain line in FIG. 1 to cover and protect the descending gas shower nozzle 15.

次に真空槽1内は3 X 10−2’l’ORRに維持
されイオン化電源9には、1500Vの直流電圧印加1
.、その他適正な諸条件のもとでイオンブレーティング
が施される。
Next, the inside of the vacuum chamber 1 is maintained at 3 x 10-2'l'ORR, and a DC voltage of 1500V is applied to the ionization power source 9.
.. , ion blating is applied under other appropriate conditions.

上記動作は1チヤージ毎に繰返される。The above operation is repeated for each charge.

この結果、基板1である時計ケースへのイオンブレーテ
ィングは、部分的な変色や微少部分の色むら等の不具合
を生ずることなく、求める色調が得られ、この効果は時
計ケースのみならず、ネクタイピン等の装飾用品へも適
用し得、さらに本発明による装置の構造は、M A T
 1’ OX方式や高周波イオンブレーティング方式の
装置にも適用出来、その効果は顕著である。
As a result, the desired color tone can be obtained by applying ion blating to the watch case, which is the substrate 1, without causing problems such as partial discoloration or slight color unevenness.This effect is applied not only to the watch case but also to the tie. It can also be applied to decorative articles such as pins, and the structure of the device according to the present invention can also be applied to decorative items such as pins.
It can also be applied to devices using the 1' OX method or high frequency ion brating method, and its effects are remarkable.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示すイオンブレーティング
装置の断面図である。 2・・・・・・被膜される基板、 4・・・・・・熱陰極、 11・・・・・・真空計、 15・・・・・・ガスシャワーノズル、16・・・・・
・可動カバー。
FIG. 1 is a sectional view of an ion blating device showing an embodiment of the present invention. 2... Substrate to be coated, 4... Hot cathode, 11... Vacuum gauge, 15... Gas shower nozzle, 16...
- Movable cover.

Claims (1)

【特許請求の範囲】[Claims] 真空室内に、蒸発源と基板支持電極とイオン化電極とイ
オン化用ガス導入口を備えたイオンブレーティング装置
において、前記基板支持電極に向けて開口するガスシャ
ワーノズルを設けたことを特徴とするイオンブレーティ
ング装置。
An ion blating device comprising an evaporation source, a substrate supporting electrode, an ionizing electrode, and an ionizing gas inlet in a vacuum chamber, characterized in that a gas shower nozzle opening toward the substrate supporting electrode is provided. Rating device.
JP11083382A 1982-06-29 1982-06-29 Ion plating device Pending JPS591677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11083382A JPS591677A (en) 1982-06-29 1982-06-29 Ion plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11083382A JPS591677A (en) 1982-06-29 1982-06-29 Ion plating device

Publications (1)

Publication Number Publication Date
JPS591677A true JPS591677A (en) 1984-01-07

Family

ID=14545816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11083382A Pending JPS591677A (en) 1982-06-29 1982-06-29 Ion plating device

Country Status (1)

Country Link
JP (1) JPS591677A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6067664A (en) * 1983-09-24 1985-04-18 Shimadzu Corp Dust removal of vapor deposition apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6067664A (en) * 1983-09-24 1985-04-18 Shimadzu Corp Dust removal of vapor deposition apparatus
JPH0573826B2 (en) * 1983-09-24 1993-10-15 Shimadzu Corp

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