JPS59163846A - 半田付け方法 - Google Patents

半田付け方法

Info

Publication number
JPS59163846A
JPS59163846A JP58038485A JP3848583A JPS59163846A JP S59163846 A JPS59163846 A JP S59163846A JP 58038485 A JP58038485 A JP 58038485A JP 3848583 A JP3848583 A JP 3848583A JP S59163846 A JPS59163846 A JP S59163846A
Authority
JP
Japan
Prior art keywords
frame
lead frame
solder
immersed
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58038485A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348435B2 (enExample
Inventor
Kuniaki Tsurushima
邦明 鶴島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58038485A priority Critical patent/JPS59163846A/ja
Publication of JPS59163846A publication Critical patent/JPS59163846A/ja
Publication of JPS6348435B2 publication Critical patent/JPS6348435B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58038485A 1983-03-09 1983-03-09 半田付け方法 Granted JPS59163846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58038485A JPS59163846A (ja) 1983-03-09 1983-03-09 半田付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58038485A JPS59163846A (ja) 1983-03-09 1983-03-09 半田付け方法

Publications (2)

Publication Number Publication Date
JPS59163846A true JPS59163846A (ja) 1984-09-14
JPS6348435B2 JPS6348435B2 (enExample) 1988-09-29

Family

ID=12526557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58038485A Granted JPS59163846A (ja) 1983-03-09 1983-03-09 半田付け方法

Country Status (1)

Country Link
JP (1) JPS59163846A (enExample)

Also Published As

Publication number Publication date
JPS6348435B2 (enExample) 1988-09-29

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