JPS59161769A - Automatic correction system of wiring pattern of printed board - Google Patents

Abstract

PURPOSE:To reduce the number of stages of correction and to shorten a correction period by correcting a wiring path in a wiring pattern at a necessary position and correcting the line width and wiring interval of this wiring pattern into necessary values. CONSTITUTION:A pattern P1 which runs on a trace parallel to a main lattice 1 under the main lattice finds the 1st intersection (a) with a main lattice B after passing through a land L1, and a pattern P2 which runs under the pattern P1 in parallel finds the 1st intersection (b) with a longitudinal subordinate lattice after passing through the land L1. Thus, both lines are changed in angle downward by 45 deg. from the positions (a) and (b) in their moving directions; the pattern P1 finds the 1st intersection (c) with a lateral subordinate lattice and the pattern P2 finds the 1st intersection (d) with a main lattice 2. Then, the pattern P1 runs on a lateral subordinate lattice from the intersection (c) and finds intersections (e) and (g) by the means opposite to that of finding the intersections (a) and (b) right before approaching the next land L2. Similarly, the pattern P2 finds intersections (f) and (h) by using the means opposite to that of finding the intersections (b) and (d).

Description

Detailed Description of the Invention (a) Technical Field of @Ming The present invention relates to changing the design of a printed circuit board wiring pattern using an automatic wiring device, and in particular, changing the wiring route at required locations to improve the line width and wiring spacing of the wiring pattern. The present invention relates to an automatic wiring pattern correction method suitable for use in a method for changing a wiring pattern.

(+)) Conventional technology and problems The prior art will be explained with reference to the drawings.

FIG. 1 is a system configuration diagram of a conventional automatic wiring device, and FIG. 2 shows an example of a printed board wiring pattern formed by the conventional method. In the figure, 2 is the CPU, 2 is the input section, 3 is the memory, small is the output section, 5 is the common BUS, and the main grids A-F and main grids 1 and 2 are vertical and horizontal grids for printed board design, respectively. In the coordinate lines, L1 to L4° indicate lands, Pl and P2 indicate self-line patterns, rn indicates the line width dimension of the zero-self line pattern, and dl indicates the interval dimension of the wiring pattern.

The input unit 2 shown in FIG. 1 uses a manual key or card input device for inputting data necessary for graphic creation, and the output unit 4 includes a graphic display device such as a display device. . The memory 3 stores wiring patterns, lands, wiring prohibited area information, etc., and the results of the automatic design are outputted to the output section 4 through a predetermined check.

The wiring pattern shown in Fig. 2 is an example of a pattern automatically wired using the device shown in Fig. 1, and is a wiring pattern that passes between lands L1 to L4 (in this example, each land is for a work C bin). Patterns P1 and P2 have a predetermined pattern line width m
A wiring path passing between lands L1 and L3 and between lands L2 and L4 is automatically routed with a predetermined wiring interval d1. In this case, each center point of lands L] to L4 is located at the intersection of the main lattice for printed board design, and the wiring patterns P1 to P2 do not necessarily pass over the main lattice or the sub-lattice that passes through the middle of the main lattice. Instead, the path is called a toss.

However, in conventional automatic wiring, the width dimension m of the pattern for the same signal line is fixed, and a normal pattern has narrow parts such as between one land and another land, so in order to avoid the risk of short circuit, We have adopted a method that does not make it thicker. Therefore, the width dimension n of the pattern of the already designed printed board
If you want to reduce the line resistance due to the pattern by making 1 thicker (I-), project the wiring pattern on the screen of the display device, add the pattern by manual processing using a light ben, etc., and adjust the pattern line width dimension of the required part. A method of making the wiring pattern thicker is generally used, which has the drawback of requiring a large number of man-hours to correct the wiring pattern.

(C) Purpose of the Invention In view of the above-mentioned drawbacks of the conventional art, the present invention aims to increase the electric capacity by modifying the wiring path at required points in the wiring pattern and increasing the line width in areas where there is room for it. The purpose of the present invention is to provide an efficient automatic wiring pattern correction method for widening line spacing to prevent crosstalk, etc.

((i) Structure and object of the invention The present invention provides an automatic wiring pattern correction method in an automatic wiring device for setting the position of printed wiring on a printed circuit board, the method comprising: This is achieved by providing an automatic wiring pattern correction method which is characterized in that the wiring path at a particular location is corrected, and the line width and wiring spacing of the wiring pattern are corrected to required values.

(e) Embodiments of the Invention Embodiments of the invention will now be described in detail with reference to FIGS. 3 and 4. Note that parts corresponding to those in FIG. 2 are given the same reference numerals, and redundant explanation thereof will be omitted.

FIG. 3 (Showing the automatic correction procedure for correcting the wiring pattern in FIG. 2 using the method of the believer's invention, (A) is an explanatory diagram of the correction position determining means, and (, B) is the line width increasing means. Explanatory drawing, CG) shows the pattern diagram of completed correction.
The figure shows an example of application of FIG.

In the figure, 1 to 1 are the wiring pattern direction change points, 1'I
J correction line width T ITI (n, (i2 is correction interval f d
1<d 2, the Zabu lattice is a coordinate line passing through the middle of each main lattice, the main lattices 3 to 4+ are horizontal coordinate lines, and the L5I'i land.

In the patterns P1 and P2 passing between lands L] and L3 shown in FIG. The line width of the pattern passing between them is necessarily subject to INj reduction in order to avoid short circuits or leaks. A place other than such a specific place with sufficient space (hereinafter also abbreviated as "required place").

Thus, coordinates are used as a means to modify the route. Pattern P1 runs on a trace parallel to main grating 1 on the lower side of main grating 1. After passing through land L1, find the intersection A with main grating B that first intersects, and run parallel to the lower side of pattern P1. Turn P2 searches for the first intersection with the vertical sag grid after passing through land L1. In this way, both lines are lined up in the direction of travel from the position of A and the mouth, and the angle is changed to 45 degrees downward, and pattern P11d is found to intersect with the first horizontal sub-grid, and pattern P2 is the main line that intersects first. Find intersection point 2 with grid 2. Next, the pattern P1 runs on the horizontal sub-lattice from the intersection C, and before approaching the next land L2, the intersections Ho and G are searched for using the reverse of the method used to search for the intersections A and the mouth. Similarly, pattern P2 also has lands L2 and L.
4. Before approaching the intersection, search for the intersection using the reverse method of searching for the intersection. In this way, the route of the wiring pattern is changed.

(B) is a method in which thickness is added only to the wiring pattern that passes over the horizontal main grid or horizontal sub-grid among the changed paths created by the explanation method in (A), and the initial line width is m
is changed to be thicker to the required line width n, and the initial interval (l1) of the wiring pattern is also changed to be wider to the required interval d2.

(C) shows a pattern diagram of the completed correction formed by the line width and spacing retouching process in (B).

Fig. 4 is an application example of Fig. 3, and in the case of Fig. 3, the direction is changed downward with respect to the pattern, but when there is a land L5 as shown in Fig. 4, the surrounding situation is changed as needed by the pre-designed design. The upward or downward direction is determined while checking using the stored data. If there is no wiring prohibited area in either area, it is determined that the downward direction is normal, for example.

FIG. 5 is a diagram for explaining the procedure of print motion correction according to the present invention. FIG. 3(a) is a flowchart for automatically correcting the wiring pattern of a printed board according to the present invention, and FIG.
It is a figure for explaining the flowchart shown in a).

In the figure, DF indicates an automatic wiring pattern file stored in a page access storage device such as a disk, and an automatic wiring pattern file stored in PI or magnetic data. The distance between the bins refers to the entire space between the narrower lands shown in Figure (b), and the pin width refers to the interval between the wider bins, and the distance between adjacent main grids is referred to as one grid. Count the bin spacing by number.

By performing the process shown in flowchart l- shown in FIG. 5(a), the already designed automatic wiring pattern can be changed to It is possible to search for expandable locations using the stored data and automatically correct the wiring pattern on the main or sub vertical and horizontal coordinate lines.

(f) Effects of the Invention As explained in detail above, according to the automatic wiring pattern correction method of the printed board of the present invention, the line width and spacing of the wiring pattern can be set as wide as possible, so that large currents or crosstalk can be avoided. It has the effect of being resistant to obstacles such as these, and can be changed without the use of human resources, reducing the number of man-hours required for corrections and shortening the period of correction.

[Brief explanation of the drawing]

Figure 1 is a system configuration diagram of a conventional automatic wiring device, Figure 2 is an example of a temporary wiring pattern formed using the conventional method, and Figure 3 is a modification of the wiring pattern in Figure 2 using the method of the present invention. (A)
(B) is an explanatory diagram of the correction position determining means, (B) is an explanatory diagram of the line width increasing means, and (C) is a diagram of the pattern after the modification is completed. Fourth
The figure shows an example of application of FIG. FIG. 5 is a diagram for explaining the procedure for automatically correcting the wiring pattern of a printed board according to the present invention. In the figure, P and P2 are wiring patterns, L1 to L5 are lands, m is the line width dimension of the wiring pattern, 11 is the line width dimension of the corrected part of the wiring pattern, d] is the line spacing dimension of the wiring pattern, and d2 is the wiring The line spacing dimension of the 11 negative positive part of the pattern,
1 to 1 are the wiring pattern direction change points, DF is the automatic wiring pattern file stored on the disk, and PF is stored on the magnetic tape. 7j Shows automatic wiring pattern file. =4λ Figure 1 Figure 2 Figure 3'

Claims (1)

[Claims] An automatic wiring pattern correction method in an automatic wiring device that sets the position of flint wiring on a printed circuit board,
Correct the wiring route at the required locations of the wiring pattern, and adjust the line width and wiring spacing of the wiring pattern.