JPH0154747B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring pattern shaping processing apparatus for forming a wiring pattern in which a predetermined distance is maintained between a through hole and a wiring pattern on a printed circuit board.

[Conventional technology]

As is well known, the function of through holes in printed circuit boards is to provide continuity between wiring patterns formed on both sides of the board and to securely fix circuit components mounted on the board. No. 57-078310.

Two examples of through holes in printed circuit boards disclosed in the above-mentioned document will be described below as first and second conventional examples shown in drawings.

FIG. 4 shows a through hole according to the first conventional example, where is a plan view thereof, and is a side sectional view thereof,
1 is a substrate, 2 and 3 are wiring patterns formed on both sides of the substrate 1, 4 is a hole formed through the substrate 1 by drilling etc., and 5 is a conductor formed on the inner peripheral surface of the hole 4 by plating. Layer 6 is a land formed at both openings of hole 4, and 7 is a through hole consisting of conductor layer 5 and land 6.

In this first conventional example, wiring patterns 2 and 3 formed on both sides of a substrate 1 are connected by a through hole 7 having a land 6.

Although one through hole 7 is shown in FIG. 4, normally the substrate 1 is densely provided with a plurality of through holes (not shown) and wiring patterns (not shown).

Therefore, in a through hole 7 having such a land 6, in order to ensure mutual insulation between the wiring patterns, it is necessary to maintain a gap between the land 6 and the wiring pattern in addition to a gap between the wiring patterns. First, there is a problem in that the number of wiring patterns that can be provided on the board 1 is limited by the lands 6, making it difficult to increase the mounting rate of circuits and components.

Therefore, a new landless through hole was devised to solve the above problem. Next, this landless through hole will be explained as a second conventional example.

FIG. 5 shows a landless through hole according to the second conventional example, where is a plan view and a side sectional view, 1 is a substrate, 2 and 3 are wiring patterns, 4 is a hole, and 5 is a conductor layer. These are the same as the first conventional example. 8 is a landless through hole.

In this manner, the second conventional example has a structure in which the land portion is removed from the through hole shown in FIG. 4. Therefore, since there is no land restriction, wiring patterns can be formed with high density, and the component mounting rate can also be improved.

The state of formation of the wiring pattern by the landless through hole 8 will be explained with reference to the drawings.

FIG. 6 is a diagram showing the state of formation of a wiring pattern in the case of a landless through-hole 8, and the portion indicated by the two-dot chain line is assumed to be the land 6 of the first conventional example. As shown in FIG. 6, if the land 6 is hit, the adjacent wiring patterns 2a and 2b will come into contact with the land 6 or come abnormally close to it. However, in the case of the landless through hole 8, since there is no land 6 shown in FIG. 4, there is no such restriction and the wiring patterns 2a, 2
By bringing b closer to the landless through-hole 8, a high-density wiring pattern can be formed.

[Problem that the invention seeks to solve]

However, in the above-mentioned second conventional example, due to problems in manufacturing the printed circuit board, as shown in the example of forming the hole 4 for the through hole in FIG. , 4b, resulting in problems such as getting too close to the wiring pattern 2b (FIG. 7) or damaging it (FIG. 7).

This problem is caused by problems in the manufacturing of printed circuit boards as described above, and there are various reasons for this, but the main cause is that when manufacturing printed circuit boards, the dry film that forms the plating resist is not applied to the board. However, it is possible that the dry film may be misaligned due to expansion and contraction.

However, it is very difficult to completely eliminate the displacement caused by the expansion and contraction of the dry film, and therefore the problem of the displacement of the through-hole hole 4 remains.

Therefore, the present invention provides a landless through hole 8.
The purpose of this is to shape the part of the wiring pattern adjacent to the landless through hole 8 to form a necessary distance from the landless through hole 8 to prevent the wiring pattern from coming too close to the landless through hole and damage to the wiring pattern. do.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention provides an input/output device that inputs basic wiring pattern data and landless through hole data for each type of printed circuit board, and outputs wiring pattern data after shaping processing, and An input wiring pattern data storage device that stores wiring pattern data, a through-hole data storage device that stores input landless through-hole data, and an input wiring pattern data storage device that stores input wiring pattern data, and a through-hole data storage device that stores input landless through-hole data. a search area calculating means for calculating a search area for landless through holes for each wiring pattern of the wiring pattern data; and searching for landless through holes within the calculated search area based on the landless through hole data. and a shaping processing means for shaping a landless through hole existing in the search area so that a part of the wiring pattern is detoured outside the range of the expected deviation amount. It is something that

[Effect]

The present invention having the above-described configuration inputs and outputs basic wiring pattern data and landless through-hole data for each type of printed circuit board using an input/output device, and converts the input basic wiring pattern data and landless through-hole data into input wiring pattern data. The information is stored in a storage device and a through-hole data storage device, respectively.

Then, the basic wiring pattern data is retrieved from the input wiring pattern data storage device, and the landless through hole for each wiring pattern is calculated based on the amount of deviation of the hole expected when drilling the landless through hole for each wiring pattern using the search area calculation means. Calculate the search area of , and the landless through hole within this calculated search area,
The adjacent through hole search means searches from the landless through hole data stored in the through hole data storage device.

Furthermore, based on this search result, a shaping processing means is used to shape a part of the wiring pattern to a landless through hole existing in the search area so as to detour outside the range of the expected deviation amount, and after this shaping, By creating the wiring pattern on the board using the wiring pattern data, it is possible to secure the necessary distance between the through hole adjacent to the wiring pattern and the wiring pattern.

〔Example〕

An embodiment of the present invention will be described below based on the drawings.

FIG. 1 is a circuit block diagram of a wiring pattern shaping processing device according to an embodiment of the present invention, FIG. 2 is a flowchart of the wiring pattern shaping processing, and FIG. 3 is a diagram showing an example of wiring pattern shaping. Before plastic surgery indicates after plastic surgery.

In FIG. 1, 9 is an input/output device, 10 is a control device, 11 is a storage device, and 12 is a wiring pattern processing device.The input/output device 9 reads and writes printed circuit board data. The control device 10 controls execution of each process of the input/output device 9, the storage device 11, and the wiring pattern processing device 12.

The storage device 11 includes an input wiring pattern data storage means 13 for storing basic wiring pattern data (hereinafter simply referred to as wiring pattern data) of printed circuit board data read from the input/output device 9, and landless through-hole data (hereinafter simply referred to as through-hole data). The through-hole data storage means 14 stores data (referred to as "data"), and the wiring pattern data storage means 15 stores and outputs shaped wiring patterns.

The wiring pattern processing device 12 uses a wiring pattern extraction means 16 for extracting the wiring pattern from the input wiring pattern data storage means 13, and extracts the wiring pattern from the input wiring pattern data storage means 13 based on the XY coordinate values of the vertical and horizontal line segments of the extracted wiring pattern. , search area calculation means 17 for calculating an area for searching for through holes adjacent to the wiring pattern, and through hole storage means 14 for storing through holes existing within the calculated area.
Adjacent through hole searching means 1 for taking out from
8. A determination circuit 19 that determines whether the number of adjacent through holes extracted by the adjacent through hole search means 18 is 0, and when the determination circuit 19 determines that the number of adjacent through holes is greater than 0, It consists of a shaping processing means 20 that performs shaping processing, and a wiring pattern storage means 21 that stores the shaped wiring pattern, and when the determination circuit 19 determines that the number of adjacent through holes is 0, the shaping processing means 20, the data of the wiring pattern extraction means 16 is transferred to the wiring pattern storage means 2.
It is stored in 1. The wiring pattern storage means 21 stores the stored data in the output wiring pattern data storage means 15.

In FIG. 2, 22 to 27 indicate each block of the flowchart.

In Fig. 3, 28 to 30 are wiring patterns;
31 to 34 are through holes, 35 to 46 are points shown to explain the data, and 47 is a surface area where shaping of the wiring pattern 28 is set. As shown in the figure, wiring patterns 28 to 30, through holes 3
Positions 1 to 34 are detected as printed circuit board data using vertical and horizontal XY coordinates.

Next, the wiring pattern shaping process will be explained based on FIGS. 1 to 3 above.

First, the input/output device 9 shown in FIG.
4 respectively.

Next, the wiring pattern data shown in block 22 of FIG. 2 is extracted. This data is retrieved by storing the data in the input wiring pattern data storage means 13 of the storage device 11 shown in FIG. 1 in the wiring pattern retrieval means 16.

Next, the adjacent land search area shown in block 23 of FIG. 2 is calculated. This calculation is performed by the search area calculation means 17 shown in FIG.
This is performed by assuming a surface area 47 according to 6 and calculating the XY coordinates of points 37 and 38 on the diagonal of the surface area 47 at that time.

Next, a search for adjacent lands as shown in block 24 of FIG. 2 is performed. This search is performed in the surface area 47.
Based on the XY coordinates, the data in the through hole data storage means 14 is stored in the adjacent through hole searching means 18 shown in FIG. This is done by searching for through-hole data adjacent to the wiring pattern 28 shown in the figure. In searching for this through hole, adjacent through holes can be found by comparing the XY coordinates of the land data in the printed circuit board data and the coordinates of points 37 and 38 in the surface area 47.

Therefore, the through holes 31, 3 shown in FIG.
2, 33, and 34 are obtained as the search results, but since the through holes 31 and 32 are located at both ends of the wiring pattern 28, they are excluded.

Next, as shown in block 25 of FIG. 2, the presence or absence of an adjacent through hole is determined. This determination is made by determining the presence of two through holes 33 and 34 in the search described above using the determination circuit 19 shown in FIG. 1.

Next, as shown in block 26 of FIG. 2, the wiring pattern 28 is shaped. This shaping process is performed by shaping processing means 20 shown in FIG. Various methods can be considered for shaping it, but as shown in Figure 3, through holes 33, 3
Each point 39, 40, 41, 42, 4 corresponds to the position of the interval required by the wiring pattern 28 for 4.
By generating 3, 44, 45, 46,
Data to be subjected to shaping processing can be created, such as the wiring pattern 28a shown in the figure.

Therefore, the wiring pattern 28a that bypasses the through holes 33 and 34 can be formed by the points 39 to 43, so that the seventh point in the conventional example can be formed.
Hole 4a drilled by the drill as shown in Fig.
It is possible to appropriately correct the defective interval between the wiring pattern 2b and the wiring pattern 2b due to the positional deviation of the wiring pattern 4b. It goes without saying that the points 39 to 34 are positions where the distance between the wiring pattern 28a and the other adjacent wiring pattern 30 does not become defective.

Next, the wiring pattern data shown in block 27 of FIG. 2 is stored. This storage is performed by storing the wiring pattern shaping processing data obtained as described above in the wiring pattern storage means 21 shown in FIG.
This is done by storing the

If the data for the wiring pattern shaping process required as described above is created for all wiring patterns of the printed circuit board to be manufactured, appropriate spacing can be secured for all the holes drilled in the printed circuit board. Wiring patterns can be easily formed.

As described above, the wiring pattern shaping processing data stored in the wiring pattern storage means 21 is stored in the output wiring pattern data storage means 1 of the storage device 11.
5, and the data is read out to the input/output device 9 by the control means 10 and used for producing a printed circuit board.

Note that when the determination circuit 19 shown in FIG. 1 determines that the number of through holes adjacent to the wiring pattern is 0, the processing operation by the shaping processing means 20 is unnecessary, and the data in the wiring pattern extraction means 16 is directly transferred to the wiring pattern storage means. 21.

〔Effect of the invention〕

As explained above, the present invention stores the shape of a wiring pattern formed on a printed circuit board and the position of a through hole as printed circuit board data in a storage device, and based on the memory, through holes adjacent to the wiring pattern are stored. The adjacent search means performs a search, and based on the search results, the shaping processing means creates wiring pattern shaping data that forms a wiring pattern by ensuring an appropriate spacing from adjacent through holes. If the wiring pattern is formed on the board based on this, it will be possible to always ensure the appropriate distance between the through hole and the wiring pattern, which will eliminate the problem in printed circuit board manufacturing that occurs when the formation position of the hole for the through hole is misaligned. Problems such as the distance between the through hole and the wiring pattern becoming too narrow and damage to the wiring pattern are eliminated.

[Brief explanation of drawings]

FIG. 1 is a circuit block diagram of a wiring pattern shaping processing device according to an embodiment of the present invention, FIG. 2 is a flowchart of the wiring pattern shaping processing, and FIG. 3 is a diagram showing an example of wiring pattern shaping. Before plastic surgery indicates after plastic surgery. FIG. 4 shows a through hole according to the first conventional example, is a plan view thereof, is a side sectional view thereof, FIG. 5 is a landless through hole according to a second conventional example, is a plan view thereof,
shows a side sectional view. FIG. 6 is a diagram showing the formation density of wiring patterns in landless through holes, and FIG. 7 is a diagram showing an example of forming holes for through holes. 11... Storage device, 12... Wiring pattern processing device, 13... Input wiring pattern data storage.

Claims (1)

[Scope of Claims] 1. A wiring pattern shaping processing device for a printed circuit board equipped with landless through holes used for connecting wiring patterns on both sides of the circuit board and fixing circuit components, which comprises: basic wiring pattern data for each type of printed circuit board; An input/output device that inputs landless through-hole data and outputs wiring pattern data after shaping processing; an input wiring pattern data storage device that stores input basic wiring pattern data; and an input wiring pattern data storage device that stores input landless through-hole data. and a through-hole data storage device to calculate a landless through-hole search area for each wiring pattern of the basic wiring pattern data based on the amount of deviation of the hole expected when drilling the landless through-hole. search area calculation means for searching for landless through holes within the calculated search area based on the landless through hole data; and adjacent through hole searching means for searching for landless through holes existing within the search area; A wiring pattern shaping processing device comprising: shaping processing means for shaping a part of the pattern so as to bypass the range of the expected deviation amount.