JPS58184783A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS58184783A JPS58184783A JP57067972A JP6797282A JPS58184783A JP S58184783 A JPS58184783 A JP S58184783A JP 57067972 A JP57067972 A JP 57067972A JP 6797282 A JP6797282 A JP 6797282A JP S58184783 A JPS58184783 A JP S58184783A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- hole
- pattern
- grid
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
各種電気部品is装して電子機器1通信機器等の各種機
器、装置に用いる電気回路を構成するためのプリント配
線板KrIAシ、特にスルーyjt−kK瞬接する部分
あるいは配線が近接する部分での配IIMr曲巌パター
ンとし、他の部分での配Sを直線パターンとして全体の
配線がジグザク状のノ(ターンとなるようにしたプリン
ト配線板に関する。[Detailed Description of the Invention] [Technical Field] Printed wiring board KrIA board for configuring electric circuits for use in various equipment and devices such as electronic equipment 1 and communication equipment by mounting various electrical parts, especially through-yjt-kK instantaneous The present invention relates to a printed wiring board in which the wiring is in a zigzag pattern, with the wiring pattern being a curved pattern in the contacting portions or the portions where the wiring is close to each other, and the wiring pattern S in other portions being a straight pattern.
従来のプリント配線板は、菖1図に示すように、配線板
上のスルーホール10座(スルーホール塵)20間K1
1lの配置113’を格子状(配線格子)に設定して配
線を行なっていた。このプリント配@叡において配線収
容量を増加させるKtf’i、第2図(a)。In the conventional printed wiring board, as shown in Figure 1, there are 10 through-holes (through-hole dust) on the wiring board and 20 holes K1.
The wiring was performed by setting the 1l arrangement 113' in a grid pattern (wiring grid). Ktf'i, which increases the wiring capacity in this printed layout, FIG. 2(a).
(b)K示すように配線格子を増加させるが、この場合
配413間の近接によるクローストークの増大、配線3
とスルーホール塵2の接触あるいは11M3間の接触が
生じ、電気特性や信頼性を損ねるといった欠点があった
。(b) The wiring grid is increased as shown in K, but in this case, the crosstalk increases due to the proximity of the wiring 413,
There was a drawback that contact between the through-hole dust 2 or 11M3 occurred, impairing electrical characteristics and reliability.
本発明は従来のプリント配線板の欠点を除去したもので
、スルーホールK11I&接する配線、あるいは近接す
る配線同士を迂回1曲折させ、これらの間隔を常に一定
以上に保つことにより、配413とスルーホール座2の
接触、配ls3間の近接1w、触I!を防止して配線収
容量の増加及び信頼性の向上郷を図ったプリント配線板
の開示全目的とする。The present invention eliminates the drawbacks of the conventional printed wiring board, and by making a detour around the through hole K11I and the adjacent wiring, or between adjacent wirings, and always keeping the distance between them above a certain level, the wiring 413 and the through hole Contact of seat 2, proximity 1w between seats 3, touch I! The purpose of the present invention is to disclose a printed wiring board which is designed to increase wiring capacity and improve reliability by preventing such problems.
第3図(a) 、 (b)及び第6図は本発明を応用す
る前のプリント配線板の配線図全示し、第4図、第5図
及び第7図、第8図は本発明の実施例を示している。Figures 3(a), (b) and 6 show the entire wiring diagram of the printed wiring board before applying the present invention, and Figures 4, 5, 7, and 8 show the wiring diagram of the printed wiring board before applying the present invention. An example is shown.
基本格子が垂直水平状の配線である第3図において、1
はスルーホール、2はスルーホール座、3は配線であり
、スルーホール(ICピン)間に4本の配″1llk収
容可能な配線格子を設定しである。In Figure 3, where the basic grid is vertical and horizontal wiring, 1
2 is a through-hole, 2 is a through-hole seat, and 3 is a wiring. A wiring grid capable of accommodating 4 wires (11k) is set between the through-holes (IC pins).
このうち第3図(a)#i、スルーホールに近接する格
子間隔を疎にして中心部の格子間隔1に密となるように
設定したもので、第3図(b)け格子間隔を等しく設定
したものである。第、・:6□j図は基本格子が傾斜状
の配線であり格子間隔は雛しく設定しである。Among these, #i in Figure 3(a) is set so that the grid spacing near the through hole is sparse and the grid spacing in the center is denser than #i, and Figure 3(b) is set so that the grid spacing is equal. This is the setting. In Fig. 6:6□j, the basic lattice is an inclined wiring, and the lattice spacing is set precisely.
こわらの格子設定は配線間3のクロストーク及び製造歩
留りを考慮してなされている。また、スルーホール1の
間の最大配線本数はそれらの許容値内で増加できる。The setting of the stiff grid is done in consideration of crosstalk between wiring lines 3 and manufacturing yield. Further, the maximum number of wires between the through holes 1 can be increased within those allowable values.
しかし、このような格子設定状態で配m設計を行なうと
、スルーホール1に隣接する格子上の配41j3はスル
ーホール座2に形成した際、スルーポール座2と配線3
が接触して短絡現象を生じたり、あるいは近接してクロ
ストーク現象を牛じたりする。However, when designing the wiring in such a grid setting state, when the wiring 41j3 on the grid adjacent to the through-hole 1 is formed in the through-hole seat 2, the through-pole seat 2 and the wiring 3
may come into contact and cause a short circuit phenomenon, or be in close proximity to each other and cause a crosstalk phenomenon.
そこで、第4図(a) 、 (b)及び(C)に示す台
形、矩形及び弓形の曲線パターン例、あるいは第7図(
a)。Therefore, examples of trapezoidal, rectangular, and arcuate curve patterns shown in Figures 4 (a), (b), and (C), or Figure 7 (
a).
(b)及び(C)に示す台形、三角形及び弓形の曲線パ
ターン例を応用して、第5図(a) 、 (b)ある1
nFi第8図(a)、Φ)K示すような実施例のジグザ
ク状のパターン配Sを行なう。すなわち、その一実施例
である第5図(a) 、 (b)に輪いては、スルーホ
ール座2と配置1
線3及び配II3同士が接触したり近接したりしないよ
うにするため、スルーホール座2の形状に対応して垂直
水平基本格子における曲線パターンの配1ift適宜応
用しジグザク状のパターン記録色しである。なお、5F
i直線パターンである。また、他の実施例である第8図
(aL、(b)においては、スルーホール座2の形状に
対応して傾斜基本格子におn L tm II ハター
ンの配置14を応用してジグザク状のパターン配線とし
である。By applying the examples of trapezoidal, triangular, and arcuate curve patterns shown in (b) and (C),
A zigzag pattern arrangement S as shown in FIG. 8(a), Φ)K is performed. That is, in FIGS. 5(a) and 5(b), which are one example, in order to prevent the through-hole seat 2, arrangement 1 wire 3, and arrangement II 3 from coming into contact with each other or coming close to each other, Corresponding to the shape of the hole seat 2, a zigzag pattern is recorded by appropriately applying a curved pattern in a vertical and horizontal basic grid. In addition, 5F
It is a straight line pattern. In addition, in FIGS. 8(aL and 8(b)), which are other embodiments, the arrangement 14 of the n L tm II pattern is applied to the inclined basic lattice to form a zigzag shape corresponding to the shape of the through-hole seat 2. This is the pattern wiring.
本発明は、スルーホールの形状あるいは配線密W等に応
、じて配線パターンをジグザク状とし、スルーホール座
と配線の間隔ある囚は配線同土間の間隔を一定以上に保
つことにより、クロストークあるいは短絡等を防止でき
富気特性や信頼性の向上を図れる。また、なんらの弊害
を伴なう仁となく配線収容量を増加させることができる
。The present invention makes the wiring pattern zigzag according to the shape of the through hole or the wiring density W, etc., and when there is a gap between the through hole seat and the wiring, by keeping the distance between the wiring and the wiring at a certain level or more, crosstalk can be prevented. Alternatively, it is possible to prevent short circuits, etc., and improve the richness characteristics and reliability. Further, the wiring capacity can be increased without causing any adverse effects.
1g1図は従来のプリント配線板の配線図、第2図(a
)、Φ)は基本格子を増加した場合の配lII図、第3
図(a) 、 (b)は本発明を応用する紬の基本格子
が垂直水平状の配線図、第4図(a)、Φ)、(C)t
i!&直水平基本格子における曲線パターン図、第5図
(al 、 (b)はプリント配線板のジグザク状パタ
ーン配線の一実施例、第6囚は本発aAを応用する前の
基本格子が傾斜状の配線図、第7図(り、Φl 、 (
c)は傾斜基本格子における曲線パターン図、第8図(
a) 、 (b)はプリント配線板のジグザク状パター
ン配線の他の実施例。
1・・・ヌル−ホール 2・・・スルーホール座3
・・・配4!l 4・・・曲線パターン 5・・・
直線パターン出願人 日本電気株式会社Figure 1g1 is a wiring diagram of a conventional printed wiring board, Figure 2 (a
), Φ) are the layout lII diagrams when the basic lattice is increased, 3rd
Figures (a) and (b) are wiring diagrams in which the basic lattice of pongee to which the present invention is applied is vertical and horizontal, and Figure 4 (a), Φ), and (C) t.
i! &Curve pattern diagrams in a vertical horizontal basic lattice, Figures 5 (al and 5) are examples of zigzag pattern wiring on a printed wiring board, and the 6th figure shows an example of the basic lattice with an inclined shape before applying the present invention aA. Wiring diagram, Figure 7 (ri, Φl, (
c) is a diagram of the curve pattern in the inclined basic lattice, Figure 8 (
a) and (b) are other examples of zigzag pattern wiring on a printed wiring board. 1...Null hole 2...Through hole seat 3
...Prize 4! l 4...Curve pattern 5...
Straight line pattern applicant NEC Corporation
Claims (1)
辺においてスルーホール塵の形状に対応させた形状で迂
回曲折させ、前記スルーホールと配線との間隔を常に一
定以上に保つよう前記配線をジグザク状のパターンとし
たことを特徴とするプリント配線板。The wiring Ia adjacent to the through hole is bent in a detour around the through hole in a shape corresponding to the shape of the through hole dust, and the wiring is arranged in a zigzag shape so that the distance between the through hole and the wiring is always maintained at a certain level or more. A printed wiring board characterized by a pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57067972A JPS58184783A (en) | 1982-04-22 | 1982-04-22 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57067972A JPS58184783A (en) | 1982-04-22 | 1982-04-22 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58184783A true JPS58184783A (en) | 1983-10-28 |
Family
ID=13360407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57067972A Pending JPS58184783A (en) | 1982-04-22 | 1982-04-22 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58184783A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149492A (en) * | 1984-08-17 | 1986-03-11 | 旭化成株式会社 | Printed thick film fine pattern conductor |
JPS61125192A (en) * | 1984-11-22 | 1986-06-12 | 沖電気工業株式会社 | Device for shaping and treating wiring pattern |
JPS61214498A (en) * | 1985-03-20 | 1986-09-24 | 株式会社日立製作所 | Printed wiring board |
JPS61272998A (en) * | 1985-05-29 | 1986-12-03 | 株式会社日立製作所 | Printed wiring board |
US5395270A (en) * | 1992-10-01 | 1995-03-07 | Yazaki Corporation | Weak mating force female terminal |
JP2013135028A (en) * | 2011-12-26 | 2013-07-08 | Toppan Printing Co Ltd | Printed wiring base material, method of manufacturing the same and photogravure |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS522249B2 (en) * | 1972-06-27 | 1977-01-20 | ||
JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
JPS55124878A (en) * | 1979-03-19 | 1980-09-26 | Nippon Hoso Kyokai <Nhk> | Pattern recognition system |
-
1982
- 1982-04-22 JP JP57067972A patent/JPS58184783A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS522249B2 (en) * | 1972-06-27 | 1977-01-20 | ||
JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
JPS55124878A (en) * | 1979-03-19 | 1980-09-26 | Nippon Hoso Kyokai <Nhk> | Pattern recognition system |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149492A (en) * | 1984-08-17 | 1986-03-11 | 旭化成株式会社 | Printed thick film fine pattern conductor |
JPS61125192A (en) * | 1984-11-22 | 1986-06-12 | 沖電気工業株式会社 | Device for shaping and treating wiring pattern |
JPH0154747B2 (en) * | 1984-11-22 | 1989-11-21 | Oki Electric Ind Co Ltd | |
JPS61214498A (en) * | 1985-03-20 | 1986-09-24 | 株式会社日立製作所 | Printed wiring board |
JPS61272998A (en) * | 1985-05-29 | 1986-12-03 | 株式会社日立製作所 | Printed wiring board |
US5395270A (en) * | 1992-10-01 | 1995-03-07 | Yazaki Corporation | Weak mating force female terminal |
JP2013135028A (en) * | 2011-12-26 | 2013-07-08 | Toppan Printing Co Ltd | Printed wiring base material, method of manufacturing the same and photogravure |
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