JP2002124742A - Printed wiring board, connecting component and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To modify the structure of a printed wiring board, which affects the connection of ground patterns with each other and the like at the multipin electronic component mounting region on the surface or the rear of the wiring board mounted with the multipin electronic component having pins arranged in the form of roughly matrix as connecting terminals. SOLUTION: A plurality of lands for connecting the pins of a multipin connecting component (connectors or a sockets) with each other are formed at a region 1, where is mounted with the multipin connecting component, on the surface or the rear of a printed wiring board in the arrangement of the form of roughly a matrix of 19 rows and 4 columns (the number of rows is three or more, the number of columns is two or more and the number of rows > the number of columns) here. The all lands of the three rows among the 19 rows are used as the lands 4 for ground pin connection and three ground patterns 6 are provided so as to couple the whole lands 4 of the three rows with each other and are formed so as to transverse the region 1 in the direction of the row of the arrangement of the lands of the form of roughly a matrix. Hereby, the connection of the ground patterns with each other can be ensured fully and favorably on the direction of the row of the region 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printed wiring board,
The present invention relates to a connection component such as a connector or a socket mounted on a printed wiring board for detachably connecting an electronic component to the printed wiring board, and an electronic device including the printed wiring board.

[0002]

2. Description of the Related Art In recent years, with the advancement of information processing functions in various electronic devices, a large amount of data has been transmitted and received between printed wiring boards and units of electronic devices at high speeds. In connection parts such as connectors and sockets mounted on a printed wiring board, the number of pins serving as connection terminals connected to the printed wiring board is increasing. The pins are generally arranged in a substantially matrix shape, but the increase in the number of pins is achieved by reducing the interval between the pins in the pin arrangement or by increasing the number of arrangements. Correspondingly, in a printed wiring board on which a multi-pin connection component is mounted, a large number of lands corresponding to each pin of the connection component are arranged in a region on the front or back surface where the multi-pin connection component is mounted. The lands are formed in an array, but the spacing between the lands is reduced, or the number of lands is increased.

FIGS. 5 and 6 show the arrangement of lands and the arrangement of a ground pattern and a power supply pattern in a region where a multi-pin connection component is mounted on the front or back surface of a conventional printed wiring board.

FIG. 5 shows a case of a pin insertion type. In FIG. 5, reference numeral 1 denotes a multi-pin connection component (connector or socket) (not shown) on the surface of the printed wiring board.
Are mounted in this area 1. In this area 1, lands schematically indicated by circles are formed in a substantially matrix arrangement of 19 rows and 4 columns. Among the lands, white lands denoted by reference numeral 2 are signal pin connection lands for connecting various signal pins other than the ground pin and the power supply pin. Lands indicated by reference numeral 3 with diagonal lines are lands for connecting power supply pins. The lands with vertical stripe lines indicated by reference numeral 4 are lands for ground pin connection. Reference numeral 5 denotes a power supply pattern, 6 denotes a ground pattern, and 7, 8 denote bypass capacitors. The lands 2 to 4 and the patterns 5 and 6 may be formed on the back surface of the printed wiring board.

FIG. 6 shows a case of a surface mounting type. In this case, each of the lands 2 to 4 is formed in a slender shape as a so-called pad.
The rows and columns are arranged in a substantially matrix. In FIG. 6, reference numeral 9 denotes a via hole.

[0006]

However, in the land arrangement of the conventional printed wiring board as shown in FIGS. 5 and 6, particularly in the land arrangement as shown in FIG. 5, the lands 2 to 4 and the patterns 5 and 6 are formed. When drawing out a signal line pattern (not shown) from each of the signal pin connection lands 2 on the surface, the signal line pattern passes between the lands,
The space between the lands is completely filled with the signal line pattern.
There is no room for the ground pattern 6 to pass across the mounting area 1 of the multi-pin connection component in the row direction of the land arrangement, that is, in the horizontal direction in the drawing, and the ground pattern is divided into left and right sides of the long mounting area 1. I will.

Further, if the printed wiring board is a multilayer board and the layer forming the ground pattern 6 and the layer forming the other signal line patterns are different, the ground pattern 6 traverses the region 1 in the row direction. However, if the pin spacing is reduced due to the increase in the number of pins, the ground pattern passes through the narrow pins, so that the wiring is finely wired.

In either case, as a result, it is not possible to sufficiently and sufficiently secure the electrical connection between the ground patterns in the left and right regions of the region 1, thereby impairing the stability of the power supply / ground in the printed wiring board. There is a risk.

Further, in this conventional printed wiring board, a part of the wiring of the plurality of power supply patterns 5 or ground patterns 6 between the power supply pin connection lands 3 or the ground pin connection lands 4 and the bypass capacitors 7 and 8 is formed. And the inductance components between the bypass capacitors 7 and 8 and the power and ground pins become larger.
The bypass capacitors 7 and 8 may not work effectively.

Due to the above-mentioned instability of the power supply / ground and the poor operation of the bypass capacitor, malfunctions due to disturbance of the transmission waveform of the digital signal in the circuit of the printed wiring board and radiation noise exceeding the standard value may occur. was there.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a printed wiring board on which a multi-pin electronic component having pins arranged in substantially a matrix as connection terminals is mounted. The structure related to the connection of the ground pattern in the area is improved to solve the above-mentioned problems, to ensure the stable operation of the circuit of the printed wiring board and to reduce the radiated noise. It is an object of the present invention to improve the connectivity of the ground pattern in the connecting component, and to provide an electronic device provided with such a printed wiring board or the connecting component.

[0012]

According to the present invention, there is provided a printed wiring board on which an electronic component having a plurality of pins arranged substantially in a matrix as connection terminals is mounted. Alternatively, a plurality of lands for connecting pins of the electronic component are arranged in m rows and n columns (m is an integer of 3 or more, n is 2) in a mounting area for mounting the electronic component on the back surface.
The above integers are formed in a substantially matrix arrangement of m> n), and all lands of at least one of the m rows are lands for ground pin connection, and at least one A configuration is employed in which a ground pattern is formed so as to connect all the lands of the at least one row so as to cross the mounting region in the row direction of the substantially matrix-shaped land arrangement.

Further, in the substantially matrix-shaped land array, a land at an end of a row adjacent to one side in the column direction of the land array with respect to a specific row in which all the lands are used for ground pin connection is provided. Lands for connecting a bypass capacitor are formed near the outside of each of the land for connecting the power supply pin and the land for connecting the ground pin at the end adjacent to the land for connecting the power supply pin in the specific row. The adopted configuration was adopted.

Further, in the substantially matrix land arrangement, all lands in at least one row are used as lands for connecting power supply pins, and at least one power supply pattern connects all lands in the at least one row. And a configuration formed so as to cross the mounting area in the row direction.

Further, in the substantially matrix-shaped land arrangement, at least one of the rows in which all of the lands are used for ground pin connection or the rows in which all of the lands are used for power pin connection is: A configuration in which the land spacing or size is different from other rows, for example, a configuration in which the land spacing is narrower and the number of lands is larger than in other rows is adopted.

According to the present invention, in a connection component mounted on a printed wiring board for detachably connecting an electronic component to the printed wiring board, the connection component is connected to a land formed on the front surface or the back surface of the printed wiring board. As a pin to be
It has a plurality of pins arranged in an approximately matrix of m rows and n columns (m is an integer of 3 or more, n is an integer of 2 or more, and m> n), and has a substantially matrix shape of the plurality of pins. In at least one row in the above arrangement, the interval between pins is different from that of other rows, for example, a configuration in which the interval between pins is narrower and the number of pins is larger than that of other rows is adopted.

Further, according to the present invention, the configuration of an electronic device provided with the printed wiring board according to the present invention is adopted.

Further, the configuration of an electronic apparatus provided with the printed wiring board according to the present invention, wherein the connecting component according to the present invention is mounted on the mounting area of the electronic component on the front surface or the back surface is employed.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. Here, the first to third embodiments will be described with reference to FIGS. 1 to 4, but common or corresponding parts in FIGS. 1 to 4 are denoted by common reference numerals, and the second and third embodiments are described. In the embodiment, the description of the common parts with the first embodiment will be omitted.

[First Embodiment] A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a multi-pin connection component (connector or socket) (not shown) having pins arranged in a substantially matrix form as connection terminals on the surface of a pin insertion type printed wiring board according to the first embodiment.
1 schematically shows an arrangement of lands and an arrangement of a ground pattern and a power supply pattern in a region 1 in which is mounted. Illustration of signal line patterns other than the ground pattern and the power supply pattern is omitted. FIG. 2 is a view of FIG.
In the figure, the actual arrangement of lands and the arrangement of ground patterns, power supply patterns, signal line patterns, and the like in the middle portion in the vertical direction are shown in detail. Note that these lands and patterns may be formed on the back surface of the printed wiring board (the surface opposite to the surface on which the connection components are mounted).

As shown in FIG. 1, round lands as conductor patterns are formed in a substantially matrix arrangement of 19 rows and 4 columns in the connection component mounting area 1 on the surface of the printed wiring board. This arrangement corresponds to the pin arrangement of a connection component (not shown) mounted on the area 1. A hole for inserting the pin of the connection component is formed at the center of each land, but is not shown in FIG. In addition, the number of rows and the number of columns of the land array are not limited to those described above. For example, FIG. 2 shows five columns. However,
Assuming that the number of rows is 3 or more and the number of columns is 2 or more, the number of rows> the number of columns.
The land arrangement in the area 1 is a row as shown in FIG.
The columns do not have to be strictly a linear matrix, and the rows may be curved as shown in FIG. 1, for example.

Out of the lands in the region 1, the white lands indicated by reference numeral 2 are signal pin connection lands for connecting various signal pins other than the ground pin and the power supply pin of the connection component. Lands with diagonal lines denoted by reference numeral 3 are power supply pin connection lands for connecting power supply pins of connection components. Lands with horizontal stripes indicated by reference numeral 4 are ground pin connection lands for connecting ground pins of connection components.

The conductive wiring pattern indicated by diagonal lines denoted by reference numeral 5 is a power supply pattern, and the conductive wiring pattern denoted by matte surface denoted by reference numeral 6 is a ground pattern.

Reference numerals 7 and 8 denote bypass capacitors.
The bypass capacitor 7 indicated by the solid line is mounted on the illustrated surface (connection component mounting surface) of the printed wiring board, and the bypass capacitor 8 indicated by the broken line is mounted on the back surface of the printed wiring board.

In FIG. 2, reference numeral 9 denotes a via hole for interlayer connection. Reference numeral 10 denotes various signal line patterns, which are drawn out of the area 1 from each of the signal pin connection lands 2 in the area 1 through between the lands. 1
Reference numerals 1 and 12 denote lands for connecting capacitors for connecting the bypass capacitors 7 and 8. Reference numeral 13 denotes a clock signal line pattern for passing a clock signal as a high-speed signal line.

In the substantially matrix arrangement of the lands 2 to 4 shown in FIG. 1, the third row from the top, the tenth row in the center, and the third row from the bottom in the figure are three rows respectively. All the lands are ground pin connection lands 4 (hereinafter, referred to as lands 4).
A row in which all the lands are the ground pin connection lands 4 is referred to as a ground row). Then, the three ground patterns 6 traverse the region 1 in the row direction of the substantially matrix-shaped land array so as to connect all the lands of each of the three ground rows. It is formed so as to communicate with both sides. The thickness of the three ground patterns 6 passing through the three ground rows is actually larger than the diameter of the ground pin connection lands 4 as shown in FIG.

In one row adjacent to the center ground row on the lower side in the figure, all lands are power supply pin connection lands 3 (hereinafter, all lands are power supply pin connection lands). The row designated as land 3 is referred to as a power supply row). Then, one power supply pattern 5 traverses the area 1 in the row direction of the substantially matrix land array so as to connect all the lands of the power supply row, and communicates with both sides of the area 1 in the row direction. It is formed as follows. The thickness of the power supply pattern 5 is actually equal to the power supply pin connection land 3 as shown in FIG.
It is bigger than the diameter of and thick enough.

The lands at both ends or one end of the three rows adjacent to the lower side of the ground row in FIG. 1 are used as lands 3 for power supply pin connection. Capacitor connection lands 11 and 12 shown in FIG. 2 are formed near the outside of each region 1 with the ground pin connection lands 4, and the power supply patterns 5 extending from the end lands 3 and 4 respectively. And the ground pattern 6 are connected. The patterns 5 and 6 are connected to the capacitor connection lands 11 and 12 on the back surface indicated by broken lines via via holes 9. The bypass capacitors 7 and 8 are connected to the capacitor connection lands 11 and 12, respectively.

According to this embodiment, three sufficiently thick ground patterns 6 passing through three ground rows in the substantially matrix land array in the area 1 divide the area 1 in the row direction of the land array. Since it traverses and communicates with both sides of the region 1 in the row direction, the electrical connection between the ground patterns between both sides in the row direction of the region 1 is limited only to the surface of the printed wiring board (the mounting surface of the connection component). Sufficiently good securing can be ensured, and there is no need to form a ground pattern on another layer using a printed wiring board as a multilayer board for the connection.

Further, since one sufficiently thick power supply pattern 5 passing through one power supply row traverses the area 1 in the row direction of the land arrangement and communicates with both sides of the area 1 in the row direction, the area The electrical connection between the power supply patterns between the two sides in the row direction can be sufficiently ensured.

Also, the lands 11 and 12 for connecting capacitors are provided.
The power supply pattern 5 and the ground pattern 6 connecting the power supply pin connection land 3 and the ground pin connection land 4 can be made sufficiently thick as shown in FIG. , The inductance component becomes small, and it can function effectively.

Further, since the clock signal line pattern 13 shown in FIG. 2 is formed along a sufficiently thick ground pattern 6 passing through the central ground row, the ground pattern It can act as a return path, a so-called guard ground pattern.

Therefore, in the circuit of the printed wiring board, the stability of the transmission waveform of the digital signal can be ensured, and the stable operation of the circuit can be ensured, and the radiation noise can be reduced. If
The performance of an electronic device including the printed wiring board can be improved.

In the embodiment described above,
Regarding the substantially matrix-shaped land arrangement in the area 1, the number of rows is not particularly limited except that the number of rows is 3 or more and the number of columns is 2 or more and the number of rows is greater than the number of columns as described above. Regardless, in order to secure the above-described electrical connection, it is preferable that one row near the center or near the center in the column direction of the land arrangement be a ground row and the ground pattern 6 passing through this ground row be formed. When three or more rows are ground rows, it is preferable to arrange the ground rows at substantially equal intervals in the column direction of the land arrangement.

[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 3 shows an arrangement of lands and an arrangement of a ground pattern and a power supply pattern in a region 1 for mounting a multi-pin connection component (connector or socket) (not shown) on the surface of a surface-mount type printed wiring board according to the second embodiment. Is schematically shown.

In the connection component mounting area 1 on the surface of the printed wiring board shown in FIG. 3, two lands 2 for signal pin connection, lands 3 for ground pin connection, and two lands 4 for ground pin connection are provided.
They are arranged in a matrix of three rows and two columns. Each land 2
Numeral 4 is formed in an elongated shape as a so-called pad for surface mounting.

In the land arrangement in the region 1, the sixth row from the top, the twelfth row in the center, and the third row from the bottom are three rows as ground rows, and all (two) lands are ground pin connection lands. It is set to 4. Then, as in the first embodiment, the three ground patterns 6 traverse the area 1 in the row direction of the substantially matrix land arrangement so that all the lands of the three ground rows are connected. And area 1
Are formed so as to communicate with both sides in the row direction.

In two rows, the fifth row and the ninth row from the top, all (two) lands are power supply pin connection lands 3 as power supply rows. Similarly, the two power supply patterns 5 connect all the lands of the two power supply rows, and traverse the area 1 in the row direction of the substantially matrix land arrangement. It is formed so as to communicate with both sides in the direction. Further, the land on the left side of the fifth row from the bottom is also a land 3 for power supply pin connection.

Each of the adjacent power supply pin connection lands 3 and ground pin connection lands 4 has a region 1
A bypass capacitor 7 or 8 is mounted on a capacitor connection land (not shown) formed in the vicinity of the outside, and is connected to lands 3 and 4 via a power supply pattern 5 and a ground pattern 6. The bypass capacitor 8 is mounted on a capacitor connection land formed on the back surface of the printed wiring board, and is connected to the lands 3 and 4 via the via holes 9.

According to this embodiment, the same operation and effect can be obtained for the same reason as in the first embodiment.

[Third Embodiment] Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 4 schematically shows an arrangement of lands and an arrangement of a ground pattern and a power supply pattern in a region 1 for mounting a multi-pin connection component (not shown) on the surface of a pin insertion type printed wiring board according to the third embodiment. ing.

As shown in FIG. 4, the land arrangement in the area 1 in this embodiment is substantially the same as that in the first embodiment, and the third, tenth, and lower rows from the top in the figure. From 4
The third row is a ground row, and the eleventh row from the top is a power row. However, the difference from the first embodiment is that
The spacing, number, and size of the ground pin connection lands 4 in the third and tenth ground rows from the top and the power pin connection lands 3 in the eleventh power row are different from the other rows. The land spacing is smaller and the number is larger (here, the other rows are 7 compared to 4) and the size is smaller than that of the row. The other points of the printed wiring board of the present embodiment are the first.
It is the same as the embodiment.

The connection components (connectors or sockets) (not shown) mounted on the area 1 on the surface of the printed wiring board according to the present embodiment are arranged in a plurality of rows arranged substantially in a matrix corresponding to the land arrangement in the area 1. In the pin arrangement, the third row, 1
The three rows corresponding to the three rows of the zeroth row and the eleventh row are the area 1
According to the land arrangement of the three rows, the pin interval is smaller than the other rows, and the number of pins is larger than the other rows.

According to the present embodiment, the above-mentioned 3
By increasing the number of lands and pins of the ground and the power supply for the row, the ground and the power supply of the electronic components (such as a cable with a connector and other boards) connected to the connection components mounted in the area 1 and the printed wiring board are increased. Of the ground pattern and the power supply pattern can be improved.

In the ground row or power supply row in which the number of lands is increased by making the land interval narrower than the other rows, and in the row of the pin arrangement of the connection parts corresponding thereto, the solder for connection at the time of mounting is bridged. Of course, there is no problem in circuit.

As a modification of the present embodiment, the area 1
In the land arrangement inside, the ground pin connection lands 4 in the third and tenth ground rows from the top and the power pin connection lands 3 in the eleventh power row are larger in land size than the other rows. It is also considered effective to make it thin or long. In this case, in the pin arrangement of the connection components mounted in the area 1, the pins are thickened in three rows corresponding to the three rows, or the cross-sectional shape orthogonal to the length direction is elongated.

In each of the embodiments described above, connection components (connectors or sockets) are mounted in the area 1 of the printed wiring board. However, other electronic parts such as ICs may be mounted in the area 1. Of course.

[0048]

As is apparent from the above description, according to the present invention, in a printed wiring board on which a multi-pin electronic component having a plurality of pins arranged in substantially a matrix as connection terminals is mounted. Or, a mounting area for mounting the electronic component on the rear surface, in which the plurality of lands for pin connection are formed in a substantially matrix array, and a ground pattern (and a power supply pattern) is arranged in a row of the pin array. It is not divided on both sides in the direction, and the electrical connection between the ground patterns (and the power supply patterns) on the regions on both sides is sufficiently large only on the front or back surface of the printed wiring board. ) Can sufficiently ensure the stability of the power supply / ground in the circuit of the printed wiring board. Further, a land for connecting a bypass capacitor is connected to a land for connecting a ground pin and a land for connecting a power supply pin at an end of a row of the land array in the mounting area through a sufficiently thick ground pattern and a power supply pattern. Is connected to the bypass capacitor, the bypass capacitor can be effectively operated. Therefore, even if the printed wiring board is not a multilayer board but a single-sided board or a double-sided board, it is possible to mount a multi-pin electronic component, secure the stability of the transmission waveform of the digital signal, and secure the stable operation of the circuit, Radiated noise can be reduced.
Further, according to the printed wiring board and the connection component of the present invention, the ground of the electronic component connected to the connection component mounted on the mounting area, the power supply and the ground pattern of the printed wiring board, and the connectivity of the power supply pattern are improved. Can be. Further, an excellent effect that the performance of an electronic device can be improved by using the printed wiring board or the connection component of the present invention can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a land arrangement, a ground pattern, and a power supply pattern in a mounting area of a multi-pin connection component on a surface of a printed wiring board (pin insertion type) according to a first embodiment of the present invention. .

FIG. 2 is a plan view showing in detail an actual land arrangement and arrangement of ground patterns, power supply patterns, signal line patterns, and the like in a vertical intermediate portion in FIG. 1 of the mounting area.

FIG. 3 is a plan view schematically showing a land arrangement, a ground pattern, and a power supply pattern in a mounting area of a multi-pin connection component on a surface of a printed wiring board (surface mounting type) in a second embodiment.

FIG. 4 is a plan view schematically showing a land arrangement, a ground pattern, and a power supply pattern in a mounting area of a multi-pin connection component on a surface of a printed wiring board (pin insertion type) in a third embodiment.

FIG. 5 is a plan view schematically showing a land arrangement, a ground pattern, and a power supply pattern in a mounting area of a multi-pin connection component on the surface of a conventional printed wiring board (pin insertion type).

FIG. 6 is a plan view schematically showing a land arrangement, a ground pattern, and a power supply pattern in a mounting area of a multi-pin connection component on the surface of a conventional printed wiring board (surface mounting type).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection component mounting area of printed wiring board 2 Land for signal pin connection 3 Land for power pin connection 4 Land for ground pin connection 5 Power supply pattern 6 Ground pattern 7,8 Bypass capacitor 9 Via hole 10 Signal line pattern 11 For connection of bypass capacitor Land (power side) 12 Land for bypass capacitor connection (ground side) 13 Clock signal line pattern

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/12 F

Claims (17)

[Claims] 1. A printed wiring board on which electronic components having a plurality of pins arranged substantially in a matrix as connection terminals are mounted, and a mounting area for mounting the electronic components on a front surface or a back surface is provided.
The plurality of lands for connecting the pins of the electronic component are m
Rows, n columns (m is an integer of 3 or more, n is an integer of 2 or more, m> n), and is formed in a substantially matrix-like array; The lands are lands for ground pin connection, and at least one ground pattern connects all the lands in the at least one row so as to traverse the mounting area in the row direction of the substantially matrix land array. A printed wiring board, wherein the printed wiring board is formed. 2. In the substantially matrix land array, all lands in one row near the center or near the center in the column direction of the land array are lands for ground pin connection, and one ground pattern is The printed wiring board according to claim 1, wherein the printed wiring board is formed so as to traverse the mounting area in a row direction of the land arrangement so as to connect all lands in a row. 3. In the substantially matrix-shaped land arrangement, all lands in at least three of the m rows are lands for ground pin connection, and at least three ground patterns are in all of the at least three rows. Are formed so as to traverse the mounting area in the row direction of the land array by connecting the lands, and the at least three rows are arranged at substantially equal intervals in the column direction of the land array. The printed wiring board according to claim 1 or 2, wherein: 4. In the substantially matrix land array, a land at an end of a row adjacent to one side in a column direction of the land array with respect to a specific row in which all the lands are used for ground pin connection is provided. Lands for connecting a bypass capacitor are formed near the outside of each of the land for connecting the power supply pin and the land for connecting the ground pin at the end adjacent to the land for connecting the power supply pin in the specific row. The printed wiring board according to any one of claims 1 to 3, wherein the printed wiring board is formed. 5. In the substantially matrix-shaped land arrangement, at least one of the rows in which all of the lands are used for ground pin connection is different in land spacing or size from other rows. The printed wiring board according to any one of claims 1 to 4. 6. In the substantially matrix-shaped land arrangement, at least one of the rows in which all of the lands are used for ground pin connection has a smaller land spacing than other rows and has a smaller number of lands. The printed wiring board according to claim 5, wherein the number is large. 7. In the substantially matrix-shaped land arrangement, all lands in at least one row are lands for connecting power supply pins, and at least one power supply pattern connects all lands in the at least one row. 7. The printed wiring board according to claim 1, wherein the printed wiring board is formed so as to cross the mounting area in a row direction. 8. In the substantially matrix-shaped land arrangement, at least one row in which all the lands are lands for connecting power pins is adjacent to a row in which all lands are lands for connecting ground pins. The printed wiring board according to claim 7, wherein the printed wiring board is used. 9. In the substantially matrix-shaped land array, at least one of the rows in which all of the lands are used for connecting power supply pins has a land spacing or size different from other rows. The printed wiring board according to claim 7 or 8, wherein 10. In the substantially matrix land arrangement,
10. The printed wiring according to claim 9, wherein at least one of the rows in which all of the lands are used for connecting power supply pins has a smaller land spacing and a larger number of lands than other rows. Board. 11. In the mounting area, at least one line formed in the substantially matrix land arrangement so that all the lands are connected to all lands in at least one row, which are lands for ground pin connection. A pattern of at least one signal line is formed along the ground pattern, and the at least one ground pattern functions as a guard ground pattern for the at least one signal line. The printed wiring board according to any one of claims 1 to 10. 12. The printed wiring board according to claim 11, wherein the signal line pattern is a high-speed signal line pattern. 13. A connection component mounted on a printed wiring board so as to detachably connect an electronic component to the printed wiring board, and as a pin connected to a land formed on the front surface or the back surface of the printed wiring board. , M rows and n columns (m is an integer of 3 or more, n is an integer of 2 or more, and m> n), and has a plurality of pins arranged in a substantially matrix shape, and a roughly matrix of the plurality of pins. A connection component characterized in that the spacing of at least one row of pins is different from that of other rows in an array. 14. The connecting part according to claim 13, wherein the at least one row has a smaller pin interval and a larger number of pins than other rows. 15. An electronic apparatus comprising the printed wiring board according to claim 1. Description: 16. The mounting component according to claim 13, wherein the connecting component is mounted on a mounting area of the electronic component on the front surface or the back surface.
Or an electronic device comprising the printed wiring board according to item 9. 17. The connecting component according to claim 14, wherein the connecting component is mounted on a mounting area of the electronic component on the front surface or the back surface.
Or an electronic device comprising the printed wiring board according to item 10.