JPS59159597A - 耐衝撃実装法 - Google Patents
耐衝撃実装法Info
- Publication number
- JPS59159597A JPS59159597A JP3376883A JP3376883A JPS59159597A JP S59159597 A JPS59159597 A JP S59159597A JP 3376883 A JP3376883 A JP 3376883A JP 3376883 A JP3376883 A JP 3376883A JP S59159597 A JPS59159597 A JP S59159597A
- Authority
- JP
- Japan
- Prior art keywords
- package
- mounting method
- mounting
- impact resistance
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 230000035939 shock Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012966 insertion method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3376883A JPS59159597A (ja) | 1983-03-03 | 1983-03-03 | 耐衝撃実装法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3376883A JPS59159597A (ja) | 1983-03-03 | 1983-03-03 | 耐衝撃実装法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159597A true JPS59159597A (ja) | 1984-09-10 |
| JPH0352240B2 JPH0352240B2 (https=) | 1991-08-09 |
Family
ID=12395621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3376883A Granted JPS59159597A (ja) | 1983-03-03 | 1983-03-03 | 耐衝撃実装法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159597A (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51113145U (https=) * | 1975-02-20 | 1976-09-13 | ||
| JPS57113492U (https=) * | 1980-12-29 | 1982-07-13 | ||
| JPS5812973U (ja) * | 1981-07-20 | 1983-01-27 | パイオニア株式会社 | 多層プリント基板 |
-
1983
- 1983-03-03 JP JP3376883A patent/JPS59159597A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51113145U (https=) * | 1975-02-20 | 1976-09-13 | ||
| JPS57113492U (https=) * | 1980-12-29 | 1982-07-13 | ||
| JPS5812973U (ja) * | 1981-07-20 | 1983-01-27 | パイオニア株式会社 | 多層プリント基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0352240B2 (https=) | 1991-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6255136B1 (en) | Method of making electronic package with compressible heatsink structure | |
| JP3109479B2 (ja) | 放熱体及び放熱体を装着したメモリモジュール | |
| KR100264638B1 (ko) | 스트레스 경감을 위한 히트 싱크가 부착된 칼럼그리드 어레이 | |
| US8879263B2 (en) | Conducting heat away from a printed circuit board assembly in an enclosure | |
| US5985697A (en) | Method and apparatus for mounting an integrated circuit to a printed circuit board | |
| JP5163543B2 (ja) | プリント基板ユニット | |
| US9818669B2 (en) | Printed circuit board assembly including conductive heat transfer | |
| US7161238B2 (en) | Structural reinforcement for electronic substrate | |
| US6923658B2 (en) | Support for an integrated circuit package having a column grid array interconnect | |
| US20040134680A1 (en) | Use of perimeter stops to support solder interconnects between integrated circuit assembly components | |
| US11901310B2 (en) | Electronic assembly | |
| JPS59159597A (ja) | 耐衝撃実装法 | |
| JP4030845B2 (ja) | Ｑｆｐ構造を有するｉｃの実装構造及びその実装方法、実装に用いる組立て治具 | |
| US6541710B1 (en) | Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns | |
| US5699228A (en) | Method of interconnecting leadless devices to printed wiring boards and apparatus produced thereby | |
| JP3399418B2 (ja) | 表面実装型半導体装置の実装構造 | |
| US12322674B2 (en) | Thermal spreader including ringframe and thermal straps for thermal dissipation in space and other applications | |
| JP2003163306A (ja) | ハンダカラム相互接続部を有する回路構成要素を外部的な支持体を使用して支持する方法及び装置 | |
| US20080000675A1 (en) | System and method of providing structural support to printed wiring assembly components | |
| JPH09148498A (ja) | 電子部品 | |
| JPS5968998A (ja) | 混成集積回路装置 | |
| JPH1197594A (ja) | ヒートシンク固定装置 | |
| JPH01312889A (ja) | 電子回路の実装構造 | |
| HK40057203A (zh) | 电子组件 | |
| JP2002329826A (ja) | 電子パッケージ組立用支持部材およびそれを有する電子パッケージ組立体の組立方式およびその組立方法 |