JPH0352240B2 - - Google Patents

Info

Publication number
JPH0352240B2
JPH0352240B2 JP58033768A JP3376883A JPH0352240B2 JP H0352240 B2 JPH0352240 B2 JP H0352240B2 JP 58033768 A JP58033768 A JP 58033768A JP 3376883 A JP3376883 A JP 3376883A JP H0352240 B2 JPH0352240 B2 JP H0352240B2
Authority
JP
Japan
Prior art keywords
package
fixed
metal plate
mounting
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58033768A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59159597A (ja
Inventor
Chikaichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP3376883A priority Critical patent/JPS59159597A/ja
Publication of JPS59159597A publication Critical patent/JPS59159597A/ja
Publication of JPH0352240B2 publication Critical patent/JPH0352240B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP3376883A 1983-03-03 1983-03-03 耐衝撃実装法 Granted JPS59159597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3376883A JPS59159597A (ja) 1983-03-03 1983-03-03 耐衝撃実装法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3376883A JPS59159597A (ja) 1983-03-03 1983-03-03 耐衝撃実装法

Publications (2)

Publication Number Publication Date
JPS59159597A JPS59159597A (ja) 1984-09-10
JPH0352240B2 true JPH0352240B2 (https=) 1991-08-09

Family

ID=12395621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3376883A Granted JPS59159597A (ja) 1983-03-03 1983-03-03 耐衝撃実装法

Country Status (1)

Country Link
JP (1) JPS59159597A (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51113145U (https=) * 1975-02-20 1976-09-13
JPS57113492U (https=) * 1980-12-29 1982-07-13
JPS5812973U (ja) * 1981-07-20 1983-01-27 パイオニア株式会社 多層プリント基板

Also Published As

Publication number Publication date
JPS59159597A (ja) 1984-09-10

Similar Documents

Publication Publication Date Title
JP3109479B2 (ja) 放熱体及び放熱体を装着したメモリモジュール
US5863814A (en) Electronic package with compressible heatsink structure
KR100264638B1 (ko) 스트레스 경감을 위한 히트 싱크가 부착된 칼럼그리드 어레이
US5883782A (en) Apparatus for attaching a heat sink to a PCB mounted semiconductor package
US5985697A (en) Method and apparatus for mounting an integrated circuit to a printed circuit board
US20080253098A1 (en) Damage Prevention Interposer for Electronic Package and Electronic Interconnect Structure
US6986454B2 (en) Electronic package having controlled height stand-off solder joint
JPH0712069B2 (ja) 電子部品パッケージ
US6053394A (en) Column grid array substrate attachment with heat sink stress relief
US7161238B2 (en) Structural reinforcement for electronic substrate
US20160043017A1 (en) Printed circuit board assembly including conductive heat transfer
EP0742681A2 (en) Circuit card having a large module strain relief and heat sink support
JPH0245357B2 (https=)
KR100389920B1 (ko) 열팽창에 의한 신뢰성 저하를 개선할 수 있는 반도체 모듈
US5963428A (en) Cooling cap method and apparatus for tab packaged integrated circuit
US20040134680A1 (en) Use of perimeter stops to support solder interconnects between integrated circuit assembly components
EP3853897B1 (en) ELECTRONIC ASSEMBLY
JPH0352240B2 (https=)
US6541710B1 (en) Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns
US5699228A (en) Method of interconnecting leadless devices to printed wiring boards and apparatus produced thereby
JP3399418B2 (ja) 表面実装型半導体装置の実装構造
US11183438B1 (en) Compression-loaded printed circuit assembly for solder defect mitigation
HK40057203A (zh) 电子组件
HK40037383B (zh) 用於焊膏缺陷缓解的压缩负载印刷电路组件
JPH1197594A (ja) ヒートシンク固定装置