JPS59159538A - ボンデイングツ−ル - Google Patents
ボンデイングツ−ルInfo
- Publication number
- JPS59159538A JPS59159538A JP58032979A JP3297983A JPS59159538A JP S59159538 A JPS59159538 A JP S59159538A JP 58032979 A JP58032979 A JP 58032979A JP 3297983 A JP3297983 A JP 3297983A JP S59159538 A JPS59159538 A JP S59159538A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- metal layer
- bonding tool
- bonding
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/077—
-
- H10W72/701—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58032979A JPS59159538A (ja) | 1983-03-02 | 1983-03-02 | ボンデイングツ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58032979A JPS59159538A (ja) | 1983-03-02 | 1983-03-02 | ボンデイングツ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159538A true JPS59159538A (ja) | 1984-09-10 |
| JPH03781B2 JPH03781B2 (OSRAM) | 1991-01-08 |
Family
ID=12373998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58032979A Granted JPS59159538A (ja) | 1983-03-02 | 1983-03-02 | ボンデイングツ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159538A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158154A (ja) * | 1984-12-28 | 1986-07-17 | Matsushita Electric Ind Co Ltd | 加熱圧着ツ−ル |
| US5958270A (en) * | 1995-09-02 | 1999-09-28 | Lg Semicon Co., Ltd. | Wire bonding wedge tool with electric heater |
| CN114883286A (zh) * | 2022-06-08 | 2022-08-09 | 江西蓝微电子科技有限公司 | 一种金银合金复合键合丝及其制造方法 |
-
1983
- 1983-03-02 JP JP58032979A patent/JPS59159538A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158154A (ja) * | 1984-12-28 | 1986-07-17 | Matsushita Electric Ind Co Ltd | 加熱圧着ツ−ル |
| US5958270A (en) * | 1995-09-02 | 1999-09-28 | Lg Semicon Co., Ltd. | Wire bonding wedge tool with electric heater |
| CN114883286A (zh) * | 2022-06-08 | 2022-08-09 | 江西蓝微电子科技有限公司 | 一种金银合金复合键合丝及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03781B2 (OSRAM) | 1991-01-08 |
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